Modules, cooled

To represent the module cooling behavior, it is convenient to define the heat dissipation capability as the ratio of total heat generated to the maximum temperature difference experienced by the switch assembly. This ratio can then be plotted as a fnnction of coolant flow rate to establish the operating range and functional safety margins. Reference [31] shows the heat dissipation capability of the heat sink assembly. 

Back Covers. Back covers are back surface material layers which should be weatherable, hard, and mechanically durable and tough. Engineering analysis Indicates that the color of the back surface material layer should be white, to aid module cooling. 

Glass fiber-reinforced PPE/PA blends designed to meet varying demands of stiffness, impact, and heat resistance properties are used in automotive under-the-hood applications such as engine control modules, cooling system parts, power distribution boxes, connectors, lamp sockets, etc. Other applications include lawn and garden tractor hoods, pumps, water meter housings, etc. 

The primary circuit (circuit I) with natural circulation of the coolant (water with a pressure of 19.6 MPa specially treated to meet specified water chemistry conditions) transports heat from the core to the thermoelectric generator (TEG) modules cooled by the circuit II coolant (water with a pressure of 0.36 MPa). The TEG consists of eight thermoelectric units, each housing 36 annular tube modules. The latter are electric current generators based on semi-conductors and operating due to a difference in the temperatures of the circuit I and II coolants. 

S- the place for nuclear module cooling before trd )itation... 

Figure 2.104. Conventional melting curves for poly(p-phenylene sulfide), PPS samples cooled by conventional and modulated cooling at the same underlying cooUng rate [from Menczel (1999) reprinted with permission from Springer-Verlag],...

Figure Cl.4.9. Usual cooling (carrier) and repumping (sideband) transitions when optically cooling Na atoms. The repumper frequency is nonnally derived from the cooling transition frequency with electro-optic modulation.

In module II (Fig. lb) a crystallization vessel, jacketed and coimected to cooling water, is added. Thus the salt formation step, which may require heating, is separated from the crystallization (qv), which is completed upon cooling. Using module II a substantially iacreased production capacity can be achieved at only a minor additional capital investment. 

Westinghouse Electric Corp. initiated a program to develop air-cooled PAFC stacks, containing cooling plates at six-ceU intervals. Full size 100-kW stacks (468 cells, 0.12-m electrode area) were built, and a module containing four of these stacks was tested. An air-cooled stack operated at 0.480 MPa yielded a cell voltage of 0.7 V at 267 m A /cm (187 mW/cm ). Demonstration of this technology is plarmed for a site in Norway. 

A numerical study of the effect of area ratio on the flow distribution in parallel flow manifolds used in a Hquid cooling module for electronic packaging demonstrate the useflilness of such a computational fluid dynamic code. The manifolds have rectangular headers and channels divided with thin baffles, as shown in Figure 12. Because the flow is laminar in small heat exchangers designed for electronic packaging or biochemical process, the inlet Reynolds numbers of 5, 50, and 250 were used for three different area ratio cases, ie, AR = 4, 8, and 16. 

Fig. 12. Schematic diagram of a Hquid-cooling module manifold for electronic packaging.

While the air distribution must match the heat distribution, the position of extracts is not important. Direct return to air-handling units mounted around the room in numbers necessary for reliability is common practice. In the event of loss of one or more cooling modules a well-designed ventilated ceiling adds to reliability by distributing the reduced amount of air in the same proportions throughout the room. 

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