Heat dissipation capability

To represent the module cooling behavior, it is convenient to define the heat dissipation capability as the ratio of total heat generated to the maximum temperature difference experienced by the switch assembly. This ratio can then be plotted as a fnnction of coolant flow rate to establish the operating range and functional safety margins. Reference [31] shows the heat dissipation capability of the heat sink assembly. 

Thermal capability and Tm) and the heat dissipation capability at the interface determine the wear performance of a plastic material. Thermal capability of a plastic material depends on its chemical structure and material composition. The major factors that contribute to thermal stability in polymers include [3] ... 

The heat dissipation capability is affected by both internal and external lubrication in these applications. The effect of this external lubrication is usually more significant as it removes heat. If the interfaces are always covered with a homogeneous layer of lubricant, the wear performance of two plastic materials with different thermal capabilities may become the same, even though significant differences are expected if running occurs in dry conditions [1],... 

Blackout accompanied by the failure of all loops of the heat removal systems. The slow heat up of the plant does not result in boiling in the reactor. Heat is accumulated in the coolant (where temperature rises) and is then released to the environment (ground air). After 13 days the heat dissipation capability is equal to the decay heat release (43 kW), the coolant attains its maximum temperature (< 100°C) and then it drops.. 

It is the authors contention in this paper, that a cryogenic auxiliary power supply can be designed to provide power levels and operating times useful to aircraft, missiles and space vehicles. Further, that the state of the art" is such that these designs are imminent realities. The chief advantage claimed for such APU s is that they have inherent heat dissipation capabilities. 

For some applications flat heat pipe panels (HPP) have advantages over conventional cylindrical heat pipes, such as geometry adaptation, ability for localized heat dissipation and the maintenance of an entirely flat isothermal surface (Fig. 14). The liquid-vapour interface formed in capillary channels inside the heat pipe panel is capable to generate self-sustained thermally driven oscillations. Thin layer (several mm) of the sorbent between mini-fins on the outer side of the heat pipe panel ensures an advanced heat and mass transfer during the cycle adsorption/de sorption. 

We conclude that the piezometric technique is capable of yielding reliable diffusivity data provided that the pressures are monitored in the uptake cell and the limitations imposed by the time constant of the valve and finite heat dissipation rates are respected. For strongly adsorbed species theses restrictions limit the applicability to relatively slow processes (half times of at least several seconds). For weakly adsorbed species somewhat faster diffusion processes can be measured. A detailed assessment of the range of validity of this method, as a function of the system variables, has been presented by Schumacher and Karge [19]. In reviewing earlier reported piezometric diffusivity data, the values derived from measuring only the pressure in the dosing cell should not be accepted without further detailed analysis. 

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