Metal alloy, thin film

Vacuum arc plasma discharges are intense sources of dense metal plasma, and can be used to deposit metal alloy thin films of various kind including both conventional alloys as well as non—equilibrium alloys. In our approach, the basic plasma deposition process is combined with the ion bombardment the method is environmentally friendly, highly efficient, can be scaled up to large size, and can synthesize films of a wide range of materials[5—9], A metal plasma of the required species is formed by a vacuum arc plasma gun and directed towards the substrate with a moderate streaming energy, typically in order of 100 eV. At the same time, the substrate is... 

Our findings showed that the interaction of compression plasma flow containing metal components with the surface of material resulted in the formation of nanostructured metal based thin films with the size of structural components up to 300 nm. An increase of the number of pulses allows to produce alloys of the steel substrate with the components of plasma flow. Thus, the new method of the materials surface layer modification combined the compression plasma flows treatment with film deposition can be proposed. 

Therefore, our purpose is to demonstrate that the physical and chemical properties of rare earth metallic and rare earth alloy thin films or single-crystals must be cautiously analyzed. Particularly, the lack of crystallographic spectra (X-ray or electron diffraction), of chemical analyses (absorbed or adsorbed gases, surface contamination, impurities,...), of structural investigations (grain size, defects,. ..) for example, is truly detrimental to precise characterization of the materials. In this way one can claim that numerous... 

Molybdenum hexafluoride is used in the manufacture of thin films (qv) for large-scale integrated circuits (qv) commonly known as LSIC systems (3,4), in the manufacture of metallised ceramics (see MetaL-MATRIX COMPOSITES) (5), and chemical vapor deposition of molybdenum and molybdenum—tungsten alloys (see Molybdenumand molybdenum alloys) (6,7). The latter process involves the reduction of gaseous metal fluorides by hydrogen at elevated temperatures to produce metals or their alloys such as molybdenum—tungsten, molybdenum—tungsten—rhenium, or molybdenum—rhenium alloys. 

In the electronics industry, gold is used as fine wires or thin film coatings and frequendy in the form of alloys to economize on gold consumption and to impart properties such as hardness. Gold has properties that satisfy specific requirements not achievable with less expensive metals (see Electrical connectors Electronics coatings Thin films). 

StiU another method used to produce PV cells is provided by thin-fiLm technologies. Thin films ate made by depositing semiconductor materials on a sohd substrate such as glass or metal sheet. Among the wide variety of thin-fiLm materials under development ate amorphous siUcon, polycrystaUine sUicon, copper indium diselenide, and cadmium teUuride. Additionally, development of multijunction thin-film PV cells is being explored. These cells use multiple layers of thin-film sUicon alloys or other semiconductors tailored to respond to specific portions of the light spectmm. 

Thin films of metals, alloys and compounds of a few micrometres diickness, which play an important part in microelectronics, can be prepared by die condensation of atomic species on an inert substrate from a gaseous phase. The source of die atoms is, in die simplest circumstances, a sample of die collision-free evaporated beam originating from an elemental substance, or a number of elementary substances, which is formed in vacuum. The condensing surface is selected and held at a pre-determined temperature, so as to affect die crystallographic form of die condensate. If diis surface is at room teiiiperamre, a polycrystalline film is usually formed. As die temperature of die surface is increased die deposit crystal size increases, and can be made practically monocrystalline at elevated temperatures. The degree of crystallinity which has been achieved can be determined by electron diffraction, while odier properties such as surface morphology and dislocation sttiicmre can be established by electron microscopy. 

The 10 volumes in the Series on characterization of particular materials classes include volumes on silicon processir, metals and alloys, catalytic materials, integrated circuit packaging, etc. Characterization is approached from the materials user s point of view. Thus, in general, the format is based on properties, processing steps, materials classification, etc., rather than on a technique. The emphasis of all volumes is on surfaces, interfaces, and thin films, but the emphasis varies depending on the relative importance of these areas for the materials class concerned. Appendixes in each volume reproduce the relevant one-page summaries from the Encyclopedia and provide longer summaries for any techniques referred to that are not covered in the Encyclopedia. 

The outstanding characteristics of the noble metals are their exceptional resistance to corrosive attack by a wide range of liquid and gaseous substances, and their stability at high temperatures under conditions where base metals would be rapidly oxidised. This resistance to chemical and oxidative attack arises principally from the Inherently high thermodynamic stability of the noble metals, but in aqueous media under oxidising or anodic conditions a very thin film of adsorbed oxygen or oxide may be formed which can contribute to their corrosion resistance. An exception to this rule, however, is the passivation of silver and silver alloys in hydrochloric or hydrobromic acids by the formation of relatively thick halide films. 

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