Low-temperature, co-fired ceramic

Pricing as well as reliability considerations have led to an almost exclusive use of Si-based (i.e. Si and SOI) micro machined devices. Packaging and assembly has focused on ceramics (A1203, AIN, Low Temperature Co-fired Ceramics LTCC), Printed Circuit Board (PCB-) and Surface Mount Device (SMD-) technology and multichip modules (MCM s). 

LIGA lithographie, galvanoformung, abformtechnik LTCC low-temperature co-fired ceramics MEMS microelectromechanical systems... 

LTCC low-temperature co-fired ceramic (an aluminum borosilicate) Luminol 5-amino-2,3-dihydro- 1,4-phthalazinedione... 

Over the past two decades MLC technology has been progressively developed for advanced packaging, especially by main frame computer manufacturers, and it is increasingly exploited for microwave communications. Especially significant is the emergence of low temperature co-fired ceramic (LTCC) technology. 

Pfeifer, K.B., Rumpf, A.N., Measurement of ion swarm distribution functions in miniature low-temperature co-fired ceramic ion mobility spectrometer drift mbes. Anal. Chem. 2005, 77, 5215. 

Kemethmueller S, Hagymasi M, Stiegelschmitt A, Roosen A (2007) Viscous flow as the driving force for the densification of low-temperature co-fired ceramics. J Am Ceram Soc 90 64-70... 

Another market trend, toward higher power, higher working frequencies and lower power consumption, requires reduction of the resistivity of conductors in co-fired packages. To meet this requirement, glass ceramics (LTCC low-temperature co-fired ceramics) with silver or copper conductors have been developed. 

The discussion of lead properties of course does not apply to leadless devices such as leadless ceramic chip carriers (LCCCs). Design teams using these and similar packages must understand the better heat transfer properties of the alumina used in ceramic packages and must match coefficients of thermal expansion (CTEs or TCEs) between the LCCC and the substrate since there are no leads to bend and absorb mismatches of expansion. Use of ceramic devices may lead the design team to consider the use of Low Temperature Co-fired Ceramic (LTCC) substrates and assembly technologies XXX. 

Folk, M., Wang, V., Elshabini, A., and Barlow, E, Embedded passives in low-temperature co-fired ceramic for RF and microwave applications. Proceedings of the 2003 International Microelectronics and Packaging Conference, Boston, MA, 2003. 

Fritcsh, L, Aguilar, Z.P., Fakimle, E., and Barlow, F., Considerations in developing electrochemical microimmunoassays based on low temperature co-fired ceramic materials, PUCON 2003, March 9-14, 2003. 

Gongora-Rubio, M.R., Espinoza-Vallejos, P. et al. Overview of low Temperature co-fires ceramics tape technology for meso-system technology (MsST), Sensors and Actors, A89, 222-241, 2001. 

Multi-chip module (substrate low-temperature, co-fired ceramic, LTCC)... 

Pfeifer KB, Rumpf AN (2005) Measurement of Ion Swarm Distribution Functions in Miniature Low-temperature Co-fired Ceramic Ion Mobility Spectrometer Drift Tubes. Anal Chem 77 5215-5220... 

Alias, R., Ibrahim, A., Shapee, S.M., Ambak, Z., Yusoff, Z.M. Saad, M.R. (2010). Processing Defects Observation of Multilayered Low Temperature Co-fired Ceramic Substrate. Proceedings of International Conference on Electronic Packaging 2010 (ICEP2010), Hokkaido, Japan, May 2010, pp. 300-304. 

The last part of the book deals with Hquids crystals and ceramic microelectronic devices. Chapter 12, by Mendoza et al. reviews recent theoretical results on the rheology of systems consisting of a flow-aligning nematic contained in cells and capillaries under a variety of different flow conditions and under the action of applied electric fields. Finally, chapter 13, by Alias and Shapee, stresses the impact of silver paste rheology in the fabrication of ceramic microelectronic devices (low temperature co-fired ceramic LTCC devices). 

R. G. Pond, C. J. Sabo, W. A. Vitriol, and R. L. Brown, Processing and Reliability of Resistors Incorporated Within Low Temperature Co-Fired Ceramic Structirres, Proc. 1986 Int. Symp. on Microelectronics, 1986, pp. 461-472. 

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