Low temperature co-fired ceramics LTCC

Pricing as well as reliability considerations have led to an almost exclusive use of Si-based (i.e. Si and SOI) micro machined devices. Packaging and assembly has focused on ceramics (A1203, AIN, Low Temperature Co-fired Ceramics LTCC), Printed Circuit Board (PCB-) and Surface Mount Device (SMD-) technology and multichip modules (MCM s). 

Over the past two decades MLC technology has been progressively developed for advanced packaging, especially by main frame computer manufacturers, and it is increasingly exploited for microwave communications. Especially significant is the emergence of low temperature co-fired ceramic (LTCC) technology. 

The discussion of lead properties of course does not apply to leadless devices such as leadless ceramic chip carriers (LCCCs). Design teams using these and similar packages must understand the better heat transfer properties of the alumina used in ceramic packages and must match coefficients of thermal expansion (CTEs or TCEs) between the LCCC and the substrate since there are no leads to bend and absorb mismatches of expansion. Use of ceramic devices may lead the design team to consider the use of Low Temperature Co-fired Ceramic (LTCC) substrates and assembly technologies XXX. 

Multi-chip module (substrate low-temperature, co-fired ceramic, LTCC)... 

The last part of the book deals with Hquids crystals and ceramic microelectronic devices. Chapter 12, by Mendoza et al. reviews recent theoretical results on the rheology of systems consisting of a flow-aligning nematic contained in cells and capillaries under a variety of different flow conditions and under the action of applied electric fields. Finally, chapter 13, by Alias and Shapee, stresses the impact of silver paste rheology in the fabrication of ceramic microelectronic devices (low temperature co-fired ceramic LTCC devices). 

LIGA lithographie, galvanoformung, abformtechnik LTCC low-temperature co-fired ceramics MEMS microelectromechanical systems... 

LTCC low-temperature co-fired ceramic (an aluminum borosilicate) Luminol 5-amino-2,3-dihydro- 1,4-phthalazinedione... 

Another market trend, toward higher power, higher working frequencies and lower power consumption, requires reduction of the resistivity of conductors in co-fired packages. To meet this requirement, glass ceramics (LTCC low-temperature co-fired ceramics) with silver or copper conductors have been developed. 

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