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MEMS Microelectromechanical

LIGA lithographie, galvanoformung, abformtechnik LTCC low-temperature co-fired ceramics MEMS microelectromechanical systems... [Pg.548]

MEMS (microelectromechanical systems) are systems with small device sizes of 1-100 pm. They are typically driven by electrical signals. To fabricate such systems materials like semiconductors, metals, and polymers are commonly used. MEMS technology fabrication is very cost-efficient. The structures are transferred by processes, which are applied to many systems on one substrate or even many of them simultaneously. The most important fabrication processes are physical vapor deposition (PVD), chemical vapor deposition (CVD), lithography, wet chemical etching, and dry etching. Typical examples for MEMS are pressure, acceleration, and gyro sensors [28,29], DLPs [30], ink jets [31], compasses [32], and also (bio)medical devices. [Pg.443]

Figure 13 Diagrams of a prototype of a MEMS drug delivery device incorporating multiple sealed compartments that can be opened on demand to deliver a drug dose. (A) Prime grade silicon wafers are sandwiched between two layers of silicon nitride and each device contained reservoirs that extended completely through the wafer. The devices also contain a cathode and an anode between which small electric potentials can be passed. (B) Each reservoir is square pyramidal in shape with one large and one small square opening. The reservoirs have a volume of approximately 25 nL and are sealed on the small square end with the anode which is a 0.3- im thick gold membrane. Abbreviation MEMS, microelectromechanical systems. Figure 13 Diagrams of a prototype of a MEMS drug delivery device incorporating multiple sealed compartments that can be opened on demand to deliver a drug dose. (A) Prime grade silicon wafers are sandwiched between two layers of silicon nitride and each device contained reservoirs that extended completely through the wafer. The devices also contain a cathode and an anode between which small electric potentials can be passed. (B) Each reservoir is square pyramidal in shape with one large and one small square opening. The reservoirs have a volume of approximately 25 nL and are sealed on the small square end with the anode which is a 0.3- im thick gold membrane. Abbreviation MEMS, microelectromechanical systems.
Figure 14 Scanning electromicrograph of a single reservoir in a prototypical MEMS drug delivery device. (A) The gold anode is in place over the small square end of the reservoir. (B) After passage of a small electrical potential the gold anode has dissolved. Abbreviation MEMS, microelectromechanical systems. Figure 14 Scanning electromicrograph of a single reservoir in a prototypical MEMS drug delivery device. (A) The gold anode is in place over the small square end of the reservoir. (B) After passage of a small electrical potential the gold anode has dissolved. Abbreviation MEMS, microelectromechanical systems.
MEMS Microelectromechanical systems NEMS Nanoelectromechanical systems PECVD Plasma-enhanced chemical vapor... [Pg.1259]

MEMS (microelectromechanical systems) are devices made by the integration of mechanical elements, sensors, actuators, and electronics on a common Si substrate through microfabrication technology [1]. MEMS find applications in areas such as sensors, actuators, power-producing devices, telecommunications, chemical reactors, biomedical devices, etc. [2,3]. In MEMS components, the electrostatic and other surface forces become predominant when compared with inertial and gravitational forces because of the large ratios of surface area to volume, and hence the performance of MEMS components is limited by the nature of the surface. Therefore, contact-related... [Pg.111]

An alternate approach to traditional batteries consists of using MEMS (microelectromechanical systems), microfabrication, and nanotechnologies to implement a variety of energy conversion microsystems. These power MEMS could provide electrical power, propulsion, or cooling based on traditional operating principles or on novel prin-... [Pg.1119]

First, the main difference between NC and UNCD films has to be considered. The decrease of the crystal grain size from NC to UNCD films increases the number of grain boundary interfaces. This also results in a decrease of thermal conductivity and an increase of the optical absorption of UNCD films compared to NC films. At the same time, the friction coefficient of UNCD films is lower than that of NC films. Both types of CVD films can be used for MEMS (microelectromechan-ical systems), NEMS (nanoelectromechanical systems), and also for electrochemical applications. " DND is applied as an abrasive for ultrafine mechanical polishing of hard surfaces of materials. Present-day polishing compositions based on detonation ND offer the possibility of obtaining... [Pg.271]

The sensors used for monitoring the movement and position of soldiers are based on GPS, MEMS (microelectromechanical systems) accelerometers and in some cases gyroscopes. These elements could be placed as small pockets on textiles for wearable applications (Zephyr, 2010). The mounting of these devices on flexible structures needs optimisation for comfort, robusmess and proper functioning. The position of soldiers may be detected and displayed by a graphic interface, such as that based on Google Earth software. The boots worn by soldiers can also be fitted with sensors to detect their position and measure their movement. [Pg.248]

Accelerometer Displacement sensor MEMS (microelectromechanical systems) Restoring force characteristics SDOF (single degree of freedom) mass-spring system Sensor network Velocimeter... [Pg.1481]


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MEMS

Microelectromechanical

Microelectromechanics

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