X-rays lithography

In addition to good sensitivity, issues for X-ray resist materials are analogous to those of optical and e-beam resists resolution, contrast, etch resistance, thermal stability, and adhesion. To stay competitive with e-beam and even optical lithography, X-ray lithography must have a resolution performance better than 0.5 p,m. An extensive list of X-ray resist properties has been collected in the literature (83, 116, 121). 

Conventional lithography. X-ray, or UV LIGA followed by electroplating nickel or nickel alloys on silicon or nickel substrates is a common technique for fabricating tools with very small and complex features [4, 11, 17]. The... 

In general there are two distinct paths that can be taken toward nanometer scale structure the top-down approach that employs hthographic tools (such as photolithography, electron beam lithography. X-ray hthography, etc.) to pattern nanostructures on a substrate and the bottom-up approach that takes advantage of the interactions between molecules to assemble them into nanoscale structures in a... 

Because beryllium is relatively transparent to X-rays, ultra-thin Be-foil is finding use in X-ray lithography for reproduction of microminiature integrated circuits. 

L First manufacturing use of chemically amplified resists Plasma-developed resist first described X-ray proximity lithography demonstrated Bis-azide rubber resists introduced DNO-novolac resist for microelectronics introduced Photoresist technology first applied to transistor fabrication DNO-novolac resist patented by Kalle... 

Detection limits for various elements by TXRF on Si wafers are shown in Fig. 4.13. Synchrotron radiation (SR) enables bright and horizontally polarized X-ray excitation of narrow collimation that reduces the Compton scatter of silicon. Recent developments in the field of SR-TXRF and extreme ultra violet (EUV) lithography nurture our hope for improved sensitivity down to the range of less than 10 atoms cm ... 

Fig. 2.9.5 (a) Typical computer generated percolation cluster that served as a template for the sample fabrication, (b) Photograph of a model object milled 1 mm deep into a polystyrene sheet. The total object size is 12 x 12 cm2, (c) Photographs of model objects etched 1 mm deep into PMMA sheets by X-ray lithography. The total object sizes are 15x15 mm2, 18x18 mm2 and 24 x 24 mm2 from right to... 

One method for obtaining a high masking speed and resolution with X-ray lithography is use of highly sensitive positive resists. This paper reports some investigations on such sensitive positive X-ray resists. 

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