International Microelectronics and Packaging Society

Tumala, R., Chahal, P, and Bhattachrya, S., Recent advances in integral passives at PRC, presented at the International Microelectronics and Packaging Society 35th Nordic Conference, Stockholm, Sweden, September 1998. 

Copyright 2009 by IMAPS - International Microelectronics and Packaging Society. Permission to reprint/repubUsh granted from the 42nd International Symposium on Microelectronics (IMAPS 2009) Proceedings, pp. 492-499, November 1-5, 2009, San Jose McEnery Convention Center, San Jose, California. ISBN 0-930815-89-0. 

Stress = (Odij - aa,b) x 10 x (rcure - fuse) X modulus (-55°, +25°, +125 °C), where as i, = 10 ppm/°C for ferrite cores and ajhs (above or below Tg, respectively). (Copyright 1999 IMAPS - International Microelectronics and Packaging Society, and 2001 by Elsevier Press. Reproduced by permission.)... 

Crumpton, J.C., Cofield, V.E., and Bacher, R.J., Through-hole plugs and thermal vias. Proceedings of the International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS), Washington, DC, 2000, pp. 325-329. 

So, Y. H., et al. In Proceedings of the International Microelectronics and Packaging Society, Boston, 2000 International Microelectronics and Package Society Washington, DC 80-86. 

Packages, International Microelectronics and Packaging Society (IMAPS), 2004. 

International Microelectronic and Packaging Society (IMAPS) http //www.imaps. org (accessed October 12, 2010). Founded in 1967, IMAPS holds an annual national conference as well as international, national, and regional saninars. 

Koichi Hirano, Seiichi Nakatani, and Jun ichi Kato, A Novel Composite Substrate with High Thermal Conductivity for CSP, MCM, and Power Modules, Proceedings, International Microelectronic and Packaging Society, 1998. 

IMAPS International Microelectronics and Packaging Society http //www.imaps.org/... 

B.L. Booth, Optical Waveguide and Fiber Array Connectivity and Packaging Solutions , invited paper presented at the Optoelectronics Device Packaging Topical Workshop and Exhibition sponsored by International Microelectronics and Packaging Society (IMAPS), Radisson Hotel, Bethlehem, PA, October 11-14, 2004 proceedings to be published. 

International Society for Hybrid Microelectronics (also known as the Microelectronics Society) (ISHM), Reston, VA 800-535-4746, 703-758-1060, http //www.ishm.ee.vt.edu. This technical society was founded in 1967 and covers various microelectronic issues such as MCMs and advanced packaging. The Institute for Interconnecting and Packaging Electronic Circuits (IPC). This organization issues standards on packaging and printed circuitry. 

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