Insulating mechanical characteristics

The common elements in the cited examples are the mechanical characteristics and the insulation properties. These advantages come, not only from macroscopic configuration of these materials (the hollow cylindrical structure of stubble for instance), but, mainly, from their microscopic structure. Most the vegetal fibres can be described by two models wood fibres and cotton fibres, which will be presented later. In order to better understand the mechanical properties of these fibres, let us first consider their molecular constitution, then their hierarchical structure. 

This ability of solid foams to undergo considerable deformation while the stress remains low makes them ideal for cushioning sensitive items to protect them against mechanical damage. The presence of air bubbles also makes them excellent thermal insulators. This characteristic also influences the processing of cellular foods where heat transfer plays an important role. 

Studies of the moisture absorption (hygroscopicity) and water absorption (hydro-scopicity) of gas-filled plastics are of considerable practical importance, since foamed polymers always contain moisture (with the exception of their use in space or under extremely rare conditions on Earth) n4iich noticeably affects all physico-mechanical characteristic of materials, in particular electrical and heat insulation properties. 

A high chemical stability, refractoriness, good dielectric characteristics in a wide interval of temperatures receivings of linear and structural polymers make them suitable as insulating, chemicaly stable, fire-resistant coverages, and high physio-mechanical characteristics - as constructive materials. 

Properties desired in cable insulation and flexible circuit substrate materials include mechanical flexibiUty, fatigue endurance, and resistance to chemicals, water absorption, and abrasion. Both thermoplasts and thermosets are used as cable-insulating materials. Thermoplastic materials possess excellent electrical characteristics and are available at relatively low cost. 

Silica aerogels, a newly developing type of material, also have been produced as thermal insulations with superinsulation characteristics. The nanometer-size cells limit the gas phase conduction that can take place. The aerogels are transparent to visible light, so they have potential as window insulation. The use of superinsulations at present is limited by cost and the need to have a design that protects the evacuated packets or aerogels from mechanical damage. 

All bodies traveling in a fluid experience dynamic heating, the magnitude of which depends upon the body characteristics and the environmental parameters. Modern supersonic aircraft, for example, experience appreciable heating. This incident flux is accommodated by the use of an insulated metallic structure, which provides a near balance between the incident thermal pulse and the heat dissipated by surface radiation. Hence, only a small amount of heat has to be absorbed by mechanisms other than radiation. 

The skin s mechanism of heat conservation involves its very complex circulatory system [2,3]. To conserve heat, blood is diverted away from the skin s periphery by way of the arteriovenous anastomoses. The ex-ternalmost circulation of the blood is effectively shut down, leading to a characteristic blanching of the skin in fair-skinned individuals. Less heat is irradiated and convectively passed into the atmosphere. Furry mammals have yet another mechanism to conserve body heat. Each tiny arrector pilorum stands its hair up straight, adding appreciable thickness to the insulating air layer entrapped in the fur, reducing heat loss. 

We most often encounter polystyrene in one of three forms, each of which displays characteristic properties. In its pure solid state, polystyrene is a hard, brittle material. When toughened with rubber particles, it can absorb significant mechanical energy prior to failure. Lastly, in its foamed state, it is versatile, light weight thermal insulator. 

Polychlorinated biphenyls (PCBs) are a family of compounds, manufactured in the United States from 1930-1975, which were used in a number of discard applications and extensively as an electrical insulating fluid (see Chap. 1). Environmental concerns have led to strict controls on the use of PCBs and standards for cleanup of PCB discharges. One of the purposes of this section is to present information on the chemical and physical characteristics of these compounds. Based on this, the mechanisms of their movement in the surface/subsurface environment can be explained. 

A cross-sectional schematic of a monolithic gas sensor system featuring a microhotplate is shown in Fig. 2.2. Its fabrication relies on an industrial CMOS-process with subsequent micromachining steps. Diverse thin-film layers, which can be used for electrical insulation and passivation, are available in the CMOS-process. They are denoted dielectric layers and include several silicon-oxide layers such as the thermal field oxide, the contact oxide and the intermetal oxide as well as a silicon-nitride layer that serves as passivation. All these materials exhibit a characteristically low thermal conductivity, so that a membrane, which consists of only the dielectric layers, provides excellent thermal insulation between the bulk-silicon chip and a heated area. The heated area features a resistive heater, a temperature sensor, and the electrodes that contact the deposited sensitive metal oxide. An additional temperature sensor is integrated close to the circuitry on the bulk chip to monitor the overall chip temperature. The membrane is released by etching away the silicon underneath the dielectric layers. Depending on the micromachining procedure, it is possible to leave a silicon island underneath the heated area. Such an island can serve as a heat spreader and also mechanically stabihzes the membrane. The fabrication process will be explained in more detail in Chap 4. 

Additional drawbacks to the use of polyimide insulators for the fabrication of multilevel structures include self- or auto-adhesion. It has been demonstrated that the interfacial strength of polyimide layers sequentially cast and cured depends on the interdiffusion between layers, which in turn depends on the cure time and temperature for both the first layer (Tj) and the combined first and second layers (T2) [3]. In this work, it was shown that unusually high diffusion distances ( 200 nm) were required to achieve bulk strength [3]. For T2 > Tj, the adhesion decreased with increasing T. However, for T2 < Tj and Tj 400 °C, the adhesion between the layers was poor irrespective of T2. Consequently, it is of interest to combine the desirable characteristics of polyimide with other materials in such a way as to produce a low stress, low dielectric constant, self-adhering material with the desirable processabiHty and mechanical properties of polyimide. 

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