Hot-cure adhesives

Cold glue or hot curing adhesive as a reference to the processing temperature. 

Check time and temperature control in the case of hot-curing adhesives... 

Specific material characteristics (e.g., moisture and/or hot-curing adhesive) curing time, stability in storage, flexibility at low temperatures, hydrolytic stability, aging resistance, adhesion properties... 

Table 26.14 Properties of Typical One Part Hot Curing Adhesive Film...

It should be mentioned that acceptable bonds have been obtained in the auto-manufacturing industry using untreated and oily steel surfaces employing hot-curing adhesives, like the vinyl plastisols or specially formulated one-part epoxies.( i i27)... 

Urea resin adhesives, by the use of the proper hardener, may be set either by heat or at room temperature. For room temperature curing, the hardener may be ammonium chloride, together with basic materials like calcium phosphate to neutralize excess acid that might damage the wood. Cold set or room temperature set adhesives are those that set satisfactorily at 20 —30°C, whereas a hot set adhesive generally means one that is set above 99 °C. 

Polyurethane adhesives are known for excellent adhesion, flexibihty, toughness, high cohesive strength, and fast cure rates. Polyurethane adhesives rely on the curing of multifunctional isocyanate-terrninated prepolymers with moisture or on the reaction with the substrate, eg, wood and ceUulosic fibers. Two-component adhesives consist of an isocyanate prepolymer, which is cured with low equivalent weight diols, polyols, diamines, or polyamines. Such systems can be used neat or as solution. The two components are kept separately before apphcation. Two-component polyurethane systems are also used as hot-melt adhesives. 

Effect of moisture cure on properties of a urethane-based hot melt adhesive... 

In most cases, the allophanate reaction is an undesirable side reaction that can cause problems, such as high-viscosity urethane prepolymers, lower pot lives of curing hot-melt adhesives, or poor shelf lives of certain urethane adhesives. The allophanate reaction may, however, produce some benefits in urethane structural adhesives, e.g., additional crosslinking, additional modulus, and resistance to creep. The same may be said about the biuret reaction, i.e., the reaction product of a substituted urea linkage with isocyanate. The allophanate and biuret linkages are not usually as thermally stable as urethane linkages [8]. 

Most moisture-curing hot-melt adhesives utilize a crystallizable backbone and are based almost exclusively on monomeric MDI at NCO/OH ratios of 1.5 to 2.2. Poly(hexamethylene adipate) polyol is the workhorse of the curing hot-melt adhesives. 

These adhesives differ from normal hot-melt adhesives, such as the standard ethylene vinyl acetate hot melts. Standard hot-melt adhesives like EVA have no curing mechanism. They are heated above the crystalline melting point and applied as a low-viscosity liquid in the same manner as is the curing hot melt. The bond is closed in the same manner and strength is developed upon crystallization. 

Curing hot melts usually have less fixturing strength than do standard hot-melt adhesives but eventually develop structural strength. Once the moisture cure is complete, the curing hot melt has good structural properties and has better elevated heat strength than does a traditional hot melt such as EVA. 

Although not in wide use, a fast crystallizing TPU adhesive can be used in the shoe industry as an alternative to solvent-borne urethane adhesives. The TPU adhesives have good holding strength soon after crystallization, which can be a distinct advantage over curing hot-melt adhesives. TPU adhesives normally have... 

In hot mixing or elevated-temperature curing of an epoxy system, vapor pressure could also be of concern relative to the quality of the adhesive bond. If the components in an epoxy system become too hot, boiling can occur, resulting in gas bubbles. If gas bubbles become trapped in the cured adhesive film, they can lead to reduction of cohesive strength and stress risers. For many adhesive applications, particularly those in the electrical and electronic industries (due to possible ionization of air voids), complete removal of any gas bubbles from the epoxy is essential. 

Solid epoxy adhesives may also be fused or compacted into various shapes or preforms (see Fig. 13.2) such as sticks, rings, and beads.5 They can then be easily applied to a specifically shaped part. Similar to thermoplastic hot-melt adhesives, these thermosetting epoxy adhesives flow on the substrate by heating. However, the product will cure to an infusible thermoset stage with continued heating. Once cured, the product demonstrates properties similar to those of other structural epoxy adhesives. These solid epoxy adhesives are sometimes referred to as thermosetting hot melts. 

In general, these groups of cellulose ethers have been used for their innate adhesive properties and to provide thickening to adhesive formulations. They are used for plywood adhesives, industrial adhesives, wallpaper paste, library paste, and latex adhesives. For example, methylcellulose is used in some adhesives as an additive to control viscosity, especially in the heat-cure phenol-formaldehyde glues and other hot-pressing adhesives. Hydroxyethylcellulose is used as an ingredient in polyvinyl acetate emulsions, where it acts as a thickener and protective colloid. 

An emulsion polymer-isocyanate adhesive, a crosslinked polyvinyl acetate adhesive, a resorcinol-formaldehyde adhesive, a phenol-resorcinol-formalde-hyde adhesive, and an acid-catalyzed phenolic-formaldehyde adhesive developed bonds of high shear strength and wood failure at all levels of acetylation in the dry condition. A neoprene contact bond adhesive and a moisture-curing polyurethane hot-melt adhesive performed as well on acetylated wood as untreated wood in tests of dry strength. Only a cold-setting resorcinol-formal-... 

Adhesives. Two single part, rubber toughened hot cured structural epoxy adhesives were used throughout the current research. Both adhesives were provided by Dow Automotive,... 

---