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HEMT

Tra.nsitorAmplifiers. Most gaUium-based field-effect transitor amplifiers (FETs) are manufactured using ion implantation (qv) (52), except for high microwave frequencies and low noise requirements where epitaxy is used. The majority of discrete high electron mobiHty transistor (HEMT) low noise amplifiers are currently produced on MBE substrates. Discrete high barrier transistor (HBT) power amplifiers use MOCVD and MBE technologies. [Pg.164]

Integrated Circuits. For analogue integrated circuits (ICs) as frequencies increase, requirements for epitaxy grow at the same rate. For most microwave devices with frequencies over 20 GHz, an epitaxial GaAs layer is required. MBE is preferred for HEMT stmctures with better low noise, while MOCVD is used for HBT devices (see Integrated circuits). [Pg.164]

Optoelectronic components produced by CVD include semiconductor lasers, light-emitting diodes (LED), photodetectors, photovoltaic cells, imaging tubes, laser diodes, optical waveguides, Impact diodes, Gunn diodes, mixer diodes, varactors, photocathodes, and HEMT (high electron mobility transistor). Major applications are listed in Table 15.1.El... [Pg.387]

Sadrzadeh, S.M.H. and Eaton, J.W. (1992). Hemt obin-induced oxidant damage to the central nervous system. In Free Radical Mechanisms of Tissue Injury (eds. M.T. Moslen and C.V. Smith) pp. 24—32. CRC Press, Boca Baton. [Pg.82]

Yersinia enterocolitica HemR HemT HemU HemV Haem Wandersman and... [Pg.104]

Bhaskar and Loganathan96 described O-peracetylation of monosaccharides, disaccharides, and methyl glycosides (94) with acetic anhydride under catalysis by acid zeolites. From the panel of zeolites tested (HY, HEMT, HZSM-5, HZSM-12, HZSM-22, and H-beta), the large-pore zeolite H-beta provided the best yields of the fully acetylated sugars, most of them being over 85% and up to 99%, with the pyranose forms 95 accounting for 66-100% of the reaction products (Scheme 22). [Pg.56]

N.T. Link, Two-Dimensional Electron Gas FETs Microwave Applications M. Abe et al., Ultra-High-Speed HEMT Integrated Circuits... [Pg.653]

Figure 13.14. Bending tests on three-layer stacks of Si, GaN, and SWNT devices supported by a plastic substrate, (a) Images of the automated mechanical stages used to bend the system, (b) Normalized transconductances (gm/gom) of devices in each layer after bending (to a 3.7-mm radius) and unbending (to a flat state) the devices several thousand times, (squares ps-Si MOSFETs circles SWNT TFTs triangles ps-GaN HEMTs.) (Reprinted with permission from Ref. 42. Copyright 2006 American Association for the Advancement of Science.)... Figure 13.14. Bending tests on three-layer stacks of Si, GaN, and SWNT devices supported by a plastic substrate, (a) Images of the automated mechanical stages used to bend the system, (b) Normalized transconductances (gm/gom) of devices in each layer after bending (to a 3.7-mm radius) and unbending (to a flat state) the devices several thousand times, (squares ps-Si MOSFETs circles SWNT TFTs triangles ps-GaN HEMTs.) (Reprinted with permission from Ref. 42. Copyright 2006 American Association for the Advancement of Science.)...
Field-effect transistors (FETs) Heterojunction bipolar transistors (HBTs) High electron mobility transistors (HEMTs) Metal oxide semiconductor FETs (MOSFETs) Single-electron transistors (SETs) Single-heterojunction HBTs (SH-HBTs) Thin-film transistors (TFTs) hydrogenated amorphous silicon in, 22 135... [Pg.964]

Lipostune-Encapsulated Hemt lobin as an Artificial Oxygen Carrier... [Pg.69]

If more than one layer is present, there will be interference fringes from each of them. If their thicknesses are different these will superimpose and beat. Very complex patterns may arise, as will be seen in the HEMT sfructrrre simrrlated in Chapter 5. [Pg.67]

Figure 5.6 The HEMT structure and (a)-(f) the sequence of simulations as described in the text... Figure 5.6 The HEMT structure and (a)-(f) the sequence of simulations as described in the text...
Figure 7.13 Reciprocal space map of a HEMT structure which contains an approximately 10 nm thick InGaAs quantum well and is capped by a thick GaAs layer. The substrate is (OOl)GaAs... Figure 7.13 Reciprocal space map of a HEMT structure which contains an approximately 10 nm thick InGaAs quantum well and is capped by a thick GaAs layer. The substrate is (OOl)GaAs...
Unlike SiC, GaN is still not mature for the market. There is no doubt that the technological issues will be overcome but it will take some time. And finally, since money rules in the ruthless commercial world, will the manufacturing cost of GaN HEMTs be low enough to capture a lion s share or just a niche portion of the market ... [Pg.23]

Electrical and Thermal Characterization of MESFETs, HEMTs, and HBTs, Robert Anholt... [Pg.213]

The 1// gain fluctuations in HEMTs require a high chopping frequency. Prior to the lockin amplifier, the variance of the output of a HEMT radiometer in a 1 Hz bandwidth (tint = 0.5 sec) centered at / is given by... [Pg.163]

Note that the quantum limit on coherent receivers is 0.5hv/k or 0.024 K/GHz (Wright, 1999). This corresponds to 0.5 photons per mode. The 0.3 K/GHz for cryogenic HEMTs is about 7 photons/mode. At 72 GHz the CMB has only n = 0.4 photons per mode, where n = (exp[hv/kT] — l)-1 is the mean number of photons per mode. Thus a background-limited incoherent detector could be much more sensitive than a coherent radiometer using HEMTs. [Pg.164]


See other pages where HEMT is mentioned: [Pg.469]    [Pg.372]    [Pg.427]    [Pg.428]    [Pg.428]    [Pg.433]    [Pg.433]    [Pg.434]    [Pg.390]    [Pg.390]    [Pg.434]    [Pg.682]    [Pg.126]    [Pg.173]    [Pg.1438]    [Pg.593]    [Pg.23]    [Pg.23]    [Pg.32]    [Pg.48]    [Pg.372]    [Pg.127]    [Pg.469]    [Pg.163]    [Pg.163]   


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