Glass anodic bonding

B. Dunn, J.M. Miller, B.C. Dave, J.S. Valentine, and J.I. Zink, Initiation toughness of silicon/glass anodic bonds. Acta Mater. 46, 737-741 (1998). 

Labossiere, P.E.W., Dunn, M.L., and Cunningham, S.J., Application of bimaterial interface comer failure mechanics to silicon/glass anodic bonds, Jourruil of the Mechanics and Physics of Solids 2002, 50,405-433. 

Anodic Bonding, Fig. 5 Bonding time as a function of applied voltage for silicon-glass anodic bonding... 

Berthold A, Nicola L, Sarro PM, Vellekoop MJ (2000) Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers. Sens Actuator A82(l-3) 224-228... 

Chen et al recently reported the fabrication and characterization of a high power self-breathing PEMFC with optimally designed wet KOH etched flow-fields and electrodes [49]. Ni/Cu/Au layers are used for current collecting, the 1.5 /im-thick in-between layer instead of a thick Au layer allowing to reduce the fabrication cost. The MEA is composed of a classical Nafion -1135 membrane with Pt-alloy sprayed carbon paper on both sides. The two silicon electrodes are sandwiched and pressed at RT with the MEA, and then sealed with epoxy. A base-chip formed by drilled Pyrex glass anodically bonded with KOH eched silicon acted both as H2 inlet/outlet manifolds and as a support for a... 

Roger T, Kowal J (1995) Selection of glass, anodic bonding conditions and material compatibility for silicon—glass capacitive sensors. Sens Acmators A46-47 l 13—120... 

Bonding Method AB,Anodic Bondmg, SGAB,Sputtered Glass Anodic Bonding, EB Eutectic Bonding... 

This simple reactor concept is based on a microstructured silicon chip (Figure 3.18) covered by a Pyrex-glass plate by anodic bonding [73, 74]. The silicon microstructure comprises, in addition to inlet and outlet structures, a multi-channel array. Only the Pyrex-glass plate acts as cover and inlet and outlet streams interface the silicon chip from the rear. 

The two plates were not manufactured via the same route and were not made of the same material [7]. Typically, rectangular channels in silicon are realized by sawing, whereas semi-circular channels are made in glass by wet-chemical etching. Such glass/silicon plates are joined by anodic bonding. 

Attach a piece of glass as the carrying substrate using anodic bonding. The area with the cantilever is protected by a Cr layer on the glass. 

Figure 1.31 Schematic of the cross-section of the mixing chamber. An etched glass substrate is joined to a silicon wafer by anodic bonding. The silicon plate is etched from the backside to yield a diaphragm, and a PZT is attached to the oscillating diaphragm [22] (by courtesy of Elsevier Ltd.).

The channels are anisotropically etched into silicon and are separated by a thin Si02 layer, the cantilever [111]. This microstructure, open to both sides, is closed by anodic bonding to Pyrex glass wafers. 

Micro fabrication was made by conventional silicon wet etching. Sealing was achieved by anodic bonding to Pyrex glass [67]. 

Channel structures are etched on two plates which are later positioned face-to-face to give the overall fluid structure [140], In the region where the channels overlap, they are separated by the separation plate defined by an etch stop layer. The channel covered by this structured plate was generated by underetching in the <100> direction through slits in the plate. The micro mixer is assembled from a silicon and a glass wafer connected by anodic bonding. 

The mixers were fabricated by deep reactive ion etching (DR1E) into silicon [159], The silicon structure was anodically bonded to a glass wafer. 

The micro channel system was fabricated by standard silicon micromachining via etching of a silicon wafer with potassium hydroxide using thermal oxide as an etch mask [6], The double mixing tee configuration consists of six micro channels. For fluid connection, an outlet hole was drilled into the silicon chip. The chip was anodically bonded to a glass slide with three inlet holes, clamped in a holder and, thereby, connected to a commercially available quench-flow instrument... 

Tanaka et al. [73] developed another MEMS system for the catalytic combustion of butane. It is composed of a combustion chamber 8 mm wide, 14 mm long and 150 pm deep which was prepared by anisotropic wet etching of a silicon substrate. The substrate was then covered with Pyrex glass applying anodic bonding. Combustion was performed on a platinum/titania catalyst... 

MEMS-like systems are frequently sealed by anodic bonding of Pyrex glass covers [20, 73, 86], or melting of low melting-point glass frits [71], which may well be suitable for future mass production of small devices. Further details will not be discussed here. 

Anodic bonding [65], which uses electrostatic attraction to bring a glass wafer into contact with a silicon wafer and to form covalent bonds between them ... 

The wafers containing the etched trenches are anodically bonded to Pyrex glass to form closed channels. The bond strength thus formed is strong enough to withstand pressures up to 250 bar. At that point a breakdown even takes place in the mono crystalline silicon and not at the bonded interface. Clearly, the indicated structures are useful for HPLC applications. 

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