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Gimbal

Joints similar to that shown in Fig, 10-170, except with two pairs of hinge pins equally spaced around a gimbal ring, achieve similar results with a lesser number of joints. [Pg.1001]

The simplicity of early carrier designs was complicated by their use as part of the robot used to move wafers from the load cassette to the unload cassette. On a so-called gimbaled carrier, the down force was applied to a central point on a plate behind the wafer, and it was assumed that the applied force was transferred through the wafer backing plate to be distributed uniformly across the wafer. Lateral motion of the pad then caused a torque to be applied to the carrier. To compensate for this rotation, a gimbal was built into the carrier at the point where the down force was applied. [Pg.20]

Fig. 1.4 Diagram showing the principle of operation of a time-of-flight atom-probe. The tip is mounted on either an internal or an external gimbal system. The tip orientation is adjusted so that atoms of one s choice for chemical analysis will have their images falling into the small probe-hole at the screen assembly. By pulse field evaporating surface atoms, these atoms, in the form of ions, will pass through the probe hole into the flight tube, and be detected by the ion detector. From their times of flight, their mass-to-charge ratios are calculated, and thus their chemical species identified. Fig. 1.4 Diagram showing the principle of operation of a time-of-flight atom-probe. The tip is mounted on either an internal or an external gimbal system. The tip orientation is adjusted so that atoms of one s choice for chemical analysis will have their images falling into the small probe-hole at the screen assembly. By pulse field evaporating surface atoms, these atoms, in the form of ions, will pass through the probe hole into the flight tube, and be detected by the ion detector. From their times of flight, their mass-to-charge ratios are calculated, and thus their chemical species identified.
Fig. 3.4 (c) Penn State design tip exchange setup ffor an FIM or a pulsed-laser atom-probe with a vacuum lock. The tip can be heated by passing a current through the wire loop. The tip is mounted on an internal gimbal and is cooled through a copper braid by a refrigerator. [Pg.108]

Fig. 3.12 The Penn State flight-time-focused ToF atom-probe in its middle stage of development and the electronic block diagram. This system now uses a LeCroy 4208 TDC for measuring flight times. The gimbal system has also been changed to an internal one as shown in Fig. 3.4c. Fig. 3.12 The Penn State flight-time-focused ToF atom-probe in its middle stage of development and the electronic block diagram. This system now uses a LeCroy 4208 TDC for measuring flight times. The gimbal system has also been changed to an internal one as shown in Fig. 3.4c.
Fig. 4.40 Procedures used in measuring the dipole moment of adatoms by an FIM-FEM combination experiment, (a) A clean W surface is prepared by low temperature field evaporation and characterized by the FIM image. (b) The (110) plane is lined up with a Faraday cap using an external gimbal, the image gas is pumped out and the polarity of the tip is changed. A FN plot is then taken, (c) Adatoms are deposited on the (110) surface and their number found by the field ion image, in this case 9 adatoms. (d) A FN plot is taken again from the same surface area but now with the presence of 9 adatoms on the surface, (e) Two sets of data collected from two different (110) planes are shown (circles are for clean W (110), and squares are with 10 adatoms). The solid lines are for W adatoms and the broken lines are for Ta adatoms. Fig. 4.40 Procedures used in measuring the dipole moment of adatoms by an FIM-FEM combination experiment, (a) A clean W surface is prepared by low temperature field evaporation and characterized by the FIM image. (b) The (110) plane is lined up with a Faraday cap using an external gimbal, the image gas is pumped out and the polarity of the tip is changed. A FN plot is then taken, (c) Adatoms are deposited on the (110) surface and their number found by the field ion image, in this case 9 adatoms. (d) A FN plot is taken again from the same surface area but now with the presence of 9 adatoms on the surface, (e) Two sets of data collected from two different (110) planes are shown (circles are for clean W (110), and squares are with 10 adatoms). The solid lines are for W adatoms and the broken lines are for Ta adatoms.
Applications over die past several years have included guidance sysLem parts, such as gimbals, gyroscopes, stable platforms, housings, mirrors, aircraft brakes, and accelerometers. In advanced (U.S.) land-based nuclear missiles, there is a precisely machined beryllium sphere, floating, warmed and protected, in a fluid bath. [Pg.196]

Vertical flux of particulate organic carbon (POC) and phytoplankton was measured with two parallel cylindrical sediment traps (aspect ratio 6.25), mounted in a gimballed frame equipped with a vane (KC maskiner og labora-... [Pg.219]

FIGURE 3.11 Schematic illustration of the cross section of different carrier models gimbal type (A), floating type (B and C), and actual example of a carrier (D). [Pg.66]

Carrier A The carrier is supported by gimbals and can be swung around its gimbals. The backside pressure is adopted in this carrier example to control the polishing pressure (rate). [Pg.67]

Sputtered M0S2 TRIAD SMS-1,2 GEOS-1 Orbit sensing mechanism Gimbal bearings... [Pg.8]

Runnels and Eyman consider the wafer, with some finite curvature, to be held by a carrier which is mounted via a gimbal mechanism as shown in Figure 4.2. The wafer then glides at an angle of attack, 6, upon a slurry fluid layer of thickness h. Runnels... [Pg.52]

C.W. Lee, Lateral Gyroscope Suspended By Two Gimbals Through High Aspect Ratio ICP Etching, in Proc. Conf. Transducers,... [Pg.313]

The balance of forces as the wafer on the head engages the pliable pad material is critical to creating a planar surface. To compensate for the torque exerted on the head as the pad comes under initial compression and fric-tionally engages the leading edge of the wafer, the plane of the wafer is placed on a gimbal pivot. The downforce pressure from the shaft on the head... [Pg.34]


See other pages where Gimbal is mentioned: [Pg.65]    [Pg.925]    [Pg.237]    [Pg.5]    [Pg.20]    [Pg.21]    [Pg.7]    [Pg.127]    [Pg.128]    [Pg.128]    [Pg.132]    [Pg.267]    [Pg.297]    [Pg.65]    [Pg.189]    [Pg.190]    [Pg.59]    [Pg.188]    [Pg.166]    [Pg.66]    [Pg.10]    [Pg.187]    [Pg.2138]    [Pg.271]    [Pg.1595]    [Pg.295]    [Pg.396]    [Pg.397]    [Pg.37]    [Pg.37]   
See also in sourсe #XX -- [ Pg.44 ]

See also in sourсe #XX -- [ Pg.82 , Pg.86 ]




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Gimbal mechanism

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