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Equipment and Consumables

The disadvantages of pad A, as compared to pad B, are twofold (1) the grooving imposing a pad-life limit, because once the grooves are worn out, the pad can no longer polish and (2) the difficulty in putting the whole pad successfully on a platen without entrapping bubbles to accomplish this, more skilled technicians are required. Perforated pads do not have these problems. [Pg.249]

Also apparent in Fig. 5 is that for the second half of the month, the tool lost consistency, with the nonuniformities of the three wafers tested each day varying significantly. In this period, the wafer-to-wafer problem was due to the previously mentioned effects bubbles, delamination, poor pad choice, and so on. [Pg.249]

Three-Level, Full-Factorial Experiment Design, Interaction Model Between Pad A and Pad B [Pg.250]

Experiment no. Down force (psi) Platen speed (rpm) Carrier Polishing rate (A/min) Nonuniformity (%)  [Pg.250]


Thermal transfer printers are relatively complex, both mechanically and electronically. In addition to precise mechanisms they require sophisticated electronics for networking and PostScript interpretation. Cost of equipment and consumables ( 0.50— 1.00 per page) is relatively high. [Pg.51]

These easy-to-use tables of equipment and consumable materials can help you prepare for your chemistry classes for the year. Quantities listed for ChemLabs and MiniLabs are the maximum quantities you will need for one student group for the year. The Student Edition pages on which each item is used are listed in parentheses after the quantities. Refer to the Resource Manager in front of each chapter in the Teacher Wraparound Edition for a list of equipment and materials used for each laboratory activity in the chapter. [Pg.112]

Equipment and consumables of different ages Columns from different suppliers or different batches Solvents, reagents, and other materials with different quality... [Pg.553]

The advancements of microelectronics with its increasing device performance and decreasing structure dimensions, which recently fell below the 100-nm mark, follow the path given by Moore s law. In contrast, microfabrication deals with a broad range of structure dimensions between submicrometers and millimeters [7]. The main developments in CMP are traditionally connected to those in advanced IC manufacturing. In recent years, however, the CMP equipment and consumable communities have also paid close attention to microfabrication. It is recognized that MEMS-specific CMP processes require dedicated consumables [8] and optimized tool sets [9] due to their diversity in structure dimension and materials to be processed. [Pg.404]

The second process investigated was an alternative for a xylene cleaning process. The dual-cycle (two step) process, as described previously in this chapter, is used due to the nature of the contaminant being removed. Figure 7 shows a bar chart of the annual costs (normalized) for the two processes. Once again the key differences are in the equipment and consumables. [Pg.263]

The use of CE methods for the determination of metal ions is a popular application area of CE as they are simple, inexpensive to operate and do not require purchase of specific instrumentation or capillaries/columns. This compares favourably to ion-exchange chromatography (lEC) where specific equipment and consumables are required. Set-up of the CE method is also favourably compared to lEC where conditioning is often required. [Pg.116]

Because the problems associated with W plasma etchback process are inherited in its chemistry and process design, it was difficult to resolve them [2-5]. Therefore, an alternative process - metal chemical mechanical polishing - has been proposed and studied extensively in the last several years [6-12]. With the maturing equipment and consumable sets, the W CMP process is proven to be better in terms of defectivity [6], controlling the plug recess, and high... [Pg.83]

The ILD thickness variation sources can be categorized into wafer-level, die-level, die and wafer interaction, and residual terms. The wafer-level variation is often caused by process perturbation and drifts in equipment and consumables, and is relatively invariant of pattern density and other layout effects. On the other hand, the die-level variation is attributed to... [Pg.23]

Within the shaft, and at each main operating level (as dictated by the mining plan), there will need to be a full operating station within the shaft to enable the transfer of personnel, equipment and consumables onto and off of the level. [Pg.639]

European consumption of natural fibers in automotive composites was estimated at 26000 tons in 2003 and is expected to grow by 10% per year [7]. Worldwide consumption in all applications by 2010 has been estimated at 110 000-120 000 tons per annum in a variety of applications including automotive, building, appliances and business equipment, and consumer products. [Pg.213]

Disposable pipette extraction (DPX) is a new approach in sample pretreatment, which has proved to be valuable in the analysis of drugs of abuse in biological matrices, such as urine and blood. DPX requires low-cost equipment and consumables and uses smaller volumes of samples and solvents, producing less waste. In contrast to SPE columns, DPX uses loosely packed sorbent and therefore does not... [Pg.4353]

Availahility of equipment and consumables for all stages of welding and verification, that is, welding sets, hot quivers for electrodes, inert gas supply, heat treatment facilities and inspection and testing apparatus... [Pg.172]


See other pages where Equipment and Consumables is mentioned: [Pg.280]    [Pg.394]    [Pg.245]    [Pg.246]    [Pg.246]    [Pg.930]    [Pg.290]    [Pg.192]    [Pg.314]    [Pg.90]    [Pg.594]    [Pg.69]    [Pg.84]    [Pg.311]    [Pg.69]    [Pg.41]    [Pg.341]    [Pg.68]    [Pg.307]    [Pg.3]    [Pg.2]    [Pg.213]    [Pg.434]    [Pg.53]    [Pg.72]    [Pg.426]    [Pg.248]    [Pg.249]    [Pg.198]    [Pg.509]   


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