Encapsulation package types

In other manufacturing applications, flowa-ble one-component RTV silicones are used to coat circuit boards and encapsulate packaged electronic assemblies to isolate them from dirt, heat, water, and vibrational damage. These types of materials can be cut out and repaired if needed, as can be done with the gels described above. 

Leakage. By far the majority of implanted electronic devices fail due to mechanisms of the second type (i.e. leakage). In a poorly encapsulated implant, this failure mode can cause rapid deterioration in a matter of days, hours, or even minutes. As the size of the implant designs are reduced, the risk of this type of failure is greatly Increased because due to the small dimensions involved, the time for fluid entry into the package becomes very short. 

M1I P-47099A(MI) Polyurethane Foam, Polyether Type, Rigid, for Packaging and Encapsulation of Electronic Components, 31 March 1989, 10 pp (FSC 5970) (MI). (This specification was validated 6 September 1990). 

Several types of bacterial polyesters that are produced by biosynthesis are poly-3-hydroxybutyrate, poly-4-hydroxybutyrate, poly-3-hydroxyvalerate, poly-3-hydroxyhexanoate, poly-3-hydroxy-heptanoate, etc., and their respective copolymer combinations. Due to their ability to degrade naturally in variety of environments, they will find a lot of applications in disposal items, short-term packaging, and also considered biocompatible in contact with living tissues and can be used for biomedical applications (e.g., drug encapsulation, tissue engineering) (Chauhan, 2012). 

Polymer-matrix composites have been used as one of the most common packaging materials for encapsulating a variety of electronic components for dissipating heat [14]. In this section, 3D AlN nanowhiskers with brush-hke structure were filled into the polymer matrix to enhance its thermal conductivity. The 3D brush-hke AlN fiUers were fabricated by CS process [7a], as iUustrated in Section 3.2. The use of AlN as a filler candidate to enhance the thermal conductivity of the polymer is attributed to its attractive properties such as high thermal conductivity, high electrical resistivity, and good chemical stabihty with polymers [1]. To explore the promoting effect of the 3D brush-hke AIN fillers on thermal conductivity, three types of AIN fillers with different brush-hke filler aspect ratio were added into polymer matrix to fabricate a series of composites and their thermal conductivities were measured. The results demonstrated that the 3D brush-hke AIN nanowhiskers fillers can effectively enhance the thermal conductivity of the polymer composite. 

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