Electroless plating deposition

While tCP and selective etching can potentially replace costly photolithographic tools in OTFT fabrication, expensive deposition tools are still required to deposit the metal layers. Recently, a lower cost metal electroless plating deposition technique has been explored as a potential replacement for the more expensive sputtering and evaporation processes. 

The Electroless plating deposition (ELP) technique is based upon the controlled auto-catalyzed decomposition or reduction of meta-stable metallic salt complexes on target surfaces [75]. In the case of palladium, usually, the substrate should be pre-seeded with palladium nuclei in an activation solution in order to reduce the induction period of the autocatalytic plating reaction. For some applications, this technique provides strong benefits such as uniformity of deposits on complex shapes and hardness. Palladium and some of its alloys are among the few metals that can be deposited in this way [11]. However, this method presents some drawbacks such as difficult thickness control, costly losses of palladium in the bath, not guaranteed purity of the deposit and so on [75]. 

Electroless plating. Electroless plating is a siuface treatment process that does not require electric current, as does electrolytic plating. Electroless plating deposits a dissolved metal, such as copper or nickel, on the surface of a plastic part through the use of a chemical solution (Fig. 9.34a). Also, any plastic part to be plated mth the electrolytic process must first be electroless plated to create a conductive surface. 

Electrogalvanizing Electrography Electrogravimetry Electrohydrodynamics Electro-Katadyn process Electrokinetics Electroless deposition Electroless nickel Electroless plating... 

Electroforrning, which is used in the production of art objects or jewelry is a combination of electroless plating and electro deposition. A wax mold of the object to be produced is made conductive by electroless gold plating, a thick layer of gold or gold alloy is then electrodeposited and, finally, the wax is removed by melting (134). 

In electroless deposition, the substrate, prepared in the same manner as in electroplating (qv), is immersed in a solution containing the desired film components (see Electroless plating). The solutions generally used contain soluble nickel salts, hypophosphite, and organic compounds, and plating occurs by a spontaneous reduction of the metal ions by the hypophosphite at the substrate surface, which is presumed to catalyze the oxidation—reduction reaction. 

Electroless Electrolytic Plating. In electroless or autocatalytic plating, no external voltage/current source is required (21). The voltage/current is suppHed by the chemical reduction of an agent at the deposit surface. The reduction reaction must be catalyzed, and often boron or phosphoms is used as the catalyst. Materials that are commonly deposited by electroless plating (qv) are Ni, Cu, Au, Pd, Pt, Ag, Co, and Ni—Fe (permalloy). In order to initiate the electroless deposition process, a catalyst must be present on the surface. A common catalyst for electroless nickel is tin. Often an accelerator is needed to remove the protective coat on the catalysis and start the reaction. 

Electrodeposition of Metals. Citric acid and its salts are used as sequestrants to control deposition rates in both electroplating and electroless plating of metals (153—171). The addition of citric acid to an electroless nickel plating bath results in a smooth, hard, nonporous metal finish. 

The growth of electroless plating is directiy traceable to (/) the discovery that some alloys produced by electroless deposition, notably nickel phosphoms, have unique properties (2) the growth of the electronics industry, especially the development of printed circuits (see Electronic coatings Integrated circuits) and (i) the large-scale introduction of plastics into everyday life. 

Modem electroless plating began in 1944 with the rediscovery that hypophosphite could bring about nickel deposition (7,8). Subsequent work led to the first patents on commercially usable electroless nickel solutions. Although these solutions were very useful for coating metals, they could not be used on most plastics because the operating temperature was 90—100°C. The first electroless nickel solution capable of wide use on plastics was introduced in 1966 (9). This solution was usable at room temperature and was extremely stable (see Nickel and nickel alloys). 

The ideal electroless solution deposits metal only on an immersed article, never as a film on the sides of the tank or as a fine powder. Room temperature electroless nickel baths closely approach this ideal electroless copper plating is beginning to approach this stabiHty when carefully controUed. Any metal that can be electroplated can theoretically also be deposited by electroless plating. Only a few metals, ie, nickel, copper, gold, palladium, and silver, are used on any significant commercial scale. 

Electroless plating rates ate affected by the rate of reduction of the dissolved reducing agent and the dissolved metal ion which diffuse to the catalytic surface of the object being plated. When an initial continuous metal film is deposited, the whole surface is at one potential determined by the mixed potential of the system (17). The current density is the same everywhere on the surface as long as flow and diffusion are unrestricted so the metal... 

Plating T anks. An electroless plating line consists of a series of lead-lined (for plastics etching) or plastic-lined tanks equipped with filters and heaters, separated by rinse tanks (24). Most metal tanks, except for passivated stainless steel used for electroless nickel, cannot be used to hold electroless plating baths because the metal initiates electroless plating onto itself. Tank linings must be stripped of metal deposits using acid at periodic intervals. 

Neutralizing removes the large amount of hexavalent chromium from the surface of the part. Hexavalent chromium shortens the life of the catalyst, and trace amounts completely inhibit electroless nickel deposition. The neutralizer is usually a mildly acidic or basic reducing agent, but other types of neutralizers are available, especially for substrates that are difficult to plate. The neutralizer may also contain surfactants (qv) or other compounds that increase catalyst absorption absorption promoters are often needed for non-ABS plastics. 

Copper etchants do not directly influence the electroless plating process, but are used merely to remove unwanted copper, and should not affect the deposit properties. The costs of waste treatment and disposal have led to disuse of throw-away systems such as chromic—sulfuric acid, ferric chloride, and ammonium persulfate. Newer types of regenerable etchants include cupric chloride, stabilized peroxide, and proprietary ammoniacal etchant baths. 

Other Baths. Other forms of 2inc plating are also in use. Immersion 2inc deposits are used as a preparatory step in electroless plating or electroplating of aluminum (146), magnesium (147), and beryUium (148) alloys. Formulations vary with the appHcation typical baths are Hsted in the references cited. 

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