Electrochemical mechanical planarization

Several people in the IBM Semiconductor Research and Development Center including the alliance partners helped in reviewing this chapter for clarity and consistency and provided valuable input. The author would also like to thank the Applied Materials team who has been working on electrochemical-mechanical planarization for their continuous support during the development of the hybrid ECMP as well as for providing their inputs on the recent developments for full-sequence ECMP. In addition, the author gratefully acknowledge to the kind contribution from Manabu Tsujimura of Ebara on the comparison of ECP, ECP-DI, ECMP, and CMP. 

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