Hybrid-ECMP

FIGURE 11.15 A schematic view of a hybrid-ECMP system. 

Another fully conductive pad design is shown in Fig. 11.27. The pad is fully immersed in electrolyte solution as the polymeric perforated pad in the hybrid-ECMP system. The fully conductive pad is made of polymer as the matrix, with embedded conductive particles serving as conducting medium to carry the... 

Figure 11.28 is the schematic of an ECMP platen that carries a conductive pad. The counterelectrode (cathode) is in the back of the conductive pad. It can be segmented into three or more zones similar to the platen for the hybrid-ECMP process. 

Several people in the IBM Semiconductor Research and Development Center including the alliance partners helped in reviewing this chapter for clarity and consistency and provided valuable input. The author would also like to thank the Applied Materials team who has been working on electrochemical-mechanical planarization for their continuous support during the development of the hybrid ECMP as well as for providing their inputs on the recent developments for full-sequence ECMP. In addition, the author gratefully acknowledge to the kind contribution from Manabu Tsujimura of Ebara on the comparison of ECP, ECP-DI, ECMP, and CMP. 

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