Electrical glass Electrically conductive adhesives

Several approaches using electrically conductive adhesives instead of solder have been explored and are proving successful. Anisotropic adhesives (See Chapter 1), for example, have been used to connect flex circuits and cables from the separate driver circuits to the panel, avoiding the use of solder connections. More importantly, integrated-circuit chips can be bonded directly to the ITO conductor traces on the panel, a technology called chip-on-glass (COG). IC chips can be flip-chip bonded, then underfilled with a stress-free underfill adhesive if necessary. For protection, the chips may then be encapsulated with epoxy (glob-topped). 

Kazuya H, Takeshi M, Manabu S, Takeshi K, Manabu T. Asahi glass. Electric double layer capacitor having an electrode bonded to a current collector via a carbon type conductive adhesive layer. US patent /6072692. 

By virtue of their high silver content, silver-glass adhesives have high electrical conductivities, typically 1.3 x 10 ohm-cm. Other typical properties are flexural modulus of 350 kpsi, die shear adhesion of 900 psi, and CTE of 20 ppm/°C. ... 

In the materials science area, dendrimers have been used for adhesive tie coats to glass, metal, carbon, or polymer surfaces, additives for polymer resins and composites, printing inks, surfactants, cross-linking agents, electrically conductive nano devices,flow regulators, processing aids, and chemical... 

Epoxy adhesives are also easy to modify for special purposes. For example, they can be filled with carbon, silver, or gold to provide electrical conductivity. Other additives can enhance thermal conductivity, while maintaining electrical insulation. Additional performance properties of epoxy-based adhesives that can be modified include impact resistance, shrinkage, glass transition temperature, high-temperature strength, surface specific adhesion characteristics, and chemical or moisture resistance. 

After application of the matrix, the TLC plate is loaded directly into the MALDI device. The most obvious and simple approach is to fix the TLC plate with conductive adhesive tape onto a standard MALDI target (although a dedicated TLC adapter is now also available from Bruker Daltonics). To avoid charging effects in the MALDI source by residual charged particles on the surface and to enable successful ion desorption, an electrically conductive surface is needed. Therefore, the use of TLC glass plates is absolutely discouraged, whereas alumina TLC plates are perfect for this application. Such plates are commercially available with different stationary phases. 

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