Dynamic mechanical analysis instrumentation

Web http //www.welcome.to/dynamic mechanicaLanalysis E-mail enquiries ttech.globalnet.co.uk (Dynamic mechanical analysis instruments)... 

In a similar fashion, Thermally Stimulated Current spectrometry (TSC) makes use of an applied d-c potential that acts as the stress to orient dipoles. The temperature is then lowered to trap these dipoles, and small electrical currents are measured during heating as the dipoles relax. The resulting relaxation maps have been related to G and G" curves obtained by dynamic mechanical analysis (244—246). This technique, long carried out only in laboratory-built instruments, is available as a commercial TSC spectrometer from Thermold Partners L.P., formerly Solomat Instmments (247). 

The physical properties of barrier dressings were evaluated using the Seiko Model DMS 210 Dynamic Mechanical Analyzer Instrument (see Fig. 2.45). Referring to Fig. 2.46, dynamic mechanical analysis consists of oscillating (1 Hz) tensile force of a material in an environmentally (37°C) controlled chamber (see Fig. 2.47) to measure loss modulus (E") and stored modulus (E ). Many materials including polymers and tissue are viscoelastic, meaning that they deform (stretch or pull) with applied force and return to their original shape with time. The effect is a function of the viscous property (E") within the material that resists deformation and the elastic property (E )... 

Finally, one of the most useful ways of measuring viscoelastic properties is dynamic mechanical analysis, or DMA. In this type of experiment, an oscillating stress is applied to the sample and the response is measured as a function of the frequency of the oscillation. By using different instruments this frequency can be varied over an enormous range. Actually, the sample is usually stretched a little bit and oscillated about this strain also, the stress necessary to produce an oscillatory strain of a given magnitude is the quantity usually measured. If the sample being oscillated happens to be perfectly elastic, so that its response is instantaneous, then the stress and strain would be completely in-phase. If a sinusoidal shear strain is imposed on the sample we have (Equation 13-72) ... 

A convenient method for determining transition times and transition temperatures of polymeric materials is dynamic mechanical analysis. One type of instrument which is particularly suitable for polymeric solids is the freely oscillating torsion pendulum (TP). Advantages of the TP include its simplicity, sensitivity, relatively low frequency ( 1 Hz) which permits direct correlation of transition temperatures with static nonmechanical methods (e.g., dilatometry and calorimetry), and its high resolution of transitions A major disadvantage of the conventional TP is that test temperatures are limited by the inability of materials to support their own weight near load-limiting transition temperatures. 

Glass transition temperature, Tg, and storage modulus, E , were measured to explore how the pigment dispersion affects the material (i.e. cross-link density) and mechanical properties. Both Tg and E were determined from dynamic mechanical analysis method using a dynamic mechanical thermal analyzer (DMTA, TA Instruments RSA III) equipped with transient testing capability. A minimum of 3 to 4 specimens were analyzed from each sample. The estimated uncertainties of data are one-standard deviation. 

In this technique, the mechanical response of a sample is measured as it is deformed under oscillating load against temperature or time. Dynamic mechanical analysis (DMA) is a further development of TMA, but the instruments are different. 

Tensile properties were measured by using Shimadzu mechanical tester DSS5000. The cross head speed was 2 mm/min. Viscoelastic properties(tensile storage modulus and tan S) were measured by a tensile type dynamic mechanical analysis(SEIKO Instrument DMS 200). The... 

Dynamic Mechanical Analysis Thermal Analysis Review, Du Pont Instrument Corp., Wilmington, DE. 

Dual Cure. Films were prepared for Dynamic Mechanical Analysis (DMA). All films were cast on release paper with a 4.5 mil draw down bar, and partially cured with two 200 watt/inch lamps at half power and a belt speed of 200 ft/min. The films were intentionally under cured to facilitate cutting with minimal flaws. After the films were cut into ii-inch test pieces, they were cured with two 200 watt/inch lamps at 100 ft/min, equal to 260 millijoules/cm dose. The instrument used for the DMA work was a Rheometrics RSA II Solids Analyzer. All tests were made at a frequency of 11 hz with a nominal strain of 0.05%, under nitrogen. Both temperature scans, at 2°C/minute, and isothermal runs were made. 

Half way between conventional thermomechanical analysis and dynamic mechanical analysis is the technique of dynamic force (or load) TMA. This method uses a standard TMA instrument but the force is changed between two values in a stepwise (or sometimes sinusoidal) fashion. The dimensional changes of the specimen are monitored as a function of time (and temperature) but no attempt is made to determine the modulus and damping properties of the material. 

Dynamic Mechanical Analysis and Stress Relaxation Behavior. Samples were compression molded into bars of the dimensions 38.xl2.5x0.78 0.007 mm and 65.x9.7xl.7 0.007 mm in a Carver laboratory hot press model C. A TA Instruments 983 DMA, which was operated in the fixed frequency mode, was used to characterize the storage and loss moduli as a function of temperature. Samples were scanned at fi-equencies from 0.05 to 10.0 Hz over a temperature range from -150 C to above the glass transition temperature. The displacement was 0.4 - 0.6 mm. Stress relaxation curves were determined for the same size samples at a constant strain. The sample was displaced for 10.0 minutes and then allowed to recover for 10.0 minutes. The stress data were taken in five degree increments. A microprocessor controlled Liquid Nitrogen Cooling Accessory (LNCA) was used for sub-ambient operations. 

Test pieces 25 x 12 x 3 mm were subjected to dynamic mechanical analysis in a Du Pont 983 instrument, operating in resonant frequency mode. Samples were heated from -150 to 150°C at 20 C min. The oscillation displacement amplitude used was 0.05 mm. Data was processed using TA 2100 software. 

DuPont Company (Scientific and Process Instruments Division) DuPont 982 Dynamic Mechanical Analysis System, Product Bulletin. DuPont Company (Scientific and Process Instruments Division)... 

Mathematical modeling of the cure process coupled with the automation of various thermal analytical instruments and Fourier Transform Infrared Spectroscopy (FT-IR) have made possible the determination of quantitative cure and chemical reaction kinetics from a single dynamic scan of the reaction process. This paper describes the application of FT-IR, differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) in determining cure and reaction kinetics in some model organic coatings systems. 

The study of elastic and viscoelastic materials under conditions of cyclic stress or strain is called dynamic mechanical analysis, DMA. The periodic changes in either stress or strain permits the analysis of the dynamic response of the sample in the other variable. The analysis has certain parallels to the temperature-modulated differential thermal analysis described in Sect 4.4, where the dynamic response of the heat-flow rate is caused by the cyclic temperature change. In fact, much of the description of TMDSC was initially modeled on the more fully developed DMA. The instruments which measure stress versus strain as a function of frequency and temperature are called dynamic mechanical analyzers. The DMA is easily recognized as a further development of TMA. Its importance lies in the direct link of the experiment to the mechanical behavior of the samples. The difficulty of the technique lies in understanding the macroscopic measurement in terms of the microscopic origin. The... 

DuPont Co., Scientific and Process Instrumentation Division, 981 Dynamic Mechanical Analysis System (DMA), Bulletin E-08434. 

Calibration of TA instrumentation and development of standards for calibration continue to be administered by ICTAC in conjunction with ASTM. The standardization Committee of ICTAC has certified a range of materials for temperature calibration of TA systems, and in addition, standards for calibration of mass (known as Class M Standards ) are available for this purpose. A range of certified reference materials are available for enthalpy calibration in DSC. Temperature calibration for TMA and dynamic mechanical analysis (DMA) is effected by using disks of pure metals (silver, aluminum, and tin) separated by alumina disks. Load or force calibration for DMA is a complex process involving the use of calibrated weights. Temperature calibration for DETA is effected by measuring the melting transition of benzoic acid and dielectric calibration is... 

Dynamic mechanical analyzer n. An instrument that can test in an oscillating-flexural mode over a range of temperature and frequency to provide estimates of the real , i.e., in-phase, and imaginary , i.e., out-of-phase parts of the complex modulus. The real part is the elastic component, the imaginary part is the loss component. The square root of the sum of their squares is the complex modulus. With polymers, the components and the modulus are usually dependent on both temperature and frequency. ASTM D 4065 spells out the standard practice for reporting dynamic mechanical properties of plastics. An example of a DMA thermogram of different Perkin-Elmer Inc., manufactures the Diamond DMA instrument. Polymer films is shown. Sepe MP (1998) Dynamic mechanical analysis. Plastics Design Library, Norwich, New York. 

Dynamic mechanical analysis (DMA) measures a compound s modulus (stiffness) as its temperature is raised. This instrument has provided interesting insights into the properties of phenolics as well as those of DAPs, thermoset polyesters, silicones, and epoxies, by indicating the ability of thermosets to retain their modulus at elevated temperatures. DMA can also be used to determine thermal transition temperatures of the sample. 

Relaxation transitions in polymer EPDM samples before and after the introduction of CNF in alternating load was studied using dynamic mechanical analysis (DMA) on the instrument Netzsch DMA 242C in a temperature range from -140 to 150°C. We used the special cooler CC 200 L running on liquid nitrogen to obtain low temperatures... 

Viscoelastic behavior can be viewed as three fundamental modulus characteristics G orE =complex modulus, G or E = storage or dynamic modulus, and G" or E" = loss or viscous modulus. The moduli are related by the angle of phase lag 5 in stress-to-strain phase lag. They are derived from measurements of the complex modulus and phase angle 8 relationships of stress to strain, by dynamic mechanical analysis (DMA) using a Rheometric Solids Analyzer, RSA, supplied by TA Instruments [19]. Further information on loss modulus, storage modulus, and DMA is found in Chap. 2, Products and Designs, and Chap. 3, Properties. ... 

Dynamic mechanical analysis El DuPont de Nemours Inc. Perkin Elmer Corporation PL Thermal Sciences Inc. TA Instruments... 

Studies of the thermal and chemical stability of polymers are of paramount importance and instrumentation used in these studies discussed in Chapter 9 include thermogravimetric analysis, differential thermal analysis, differential scanning calorimetry, thermal volatilisation analysis and evolved gas analysis. Monitoring of resin cure is another important parameter in polymer processing in which dynamic mechanical analysis, dielectric thermal analysis and differential scanning calorimetry is used (Chapter 10). 

---