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Dimensional inspection

Visual Dimensional Inspection Customer Inspection — Marking... [Pg.112]

Most industrial applications with vision sensors can be divided into the following four types dimensional inspection, surface quality inspection, assembly inspection, and operation inspection. In the assembly line, vision sensors are widely used in robots as the machine vision to help them recognize the positions/orientations of objects to be handled or assembled, to determine the presence or absence of parts, and to detect parts which do not meet required specifications. Zhu et al. (2013) and Chadda et al. (2011) built vision systems using low-cost cameras such as Wii Remotes and Firefly MV cameras to track the object or human motion in an assembly line. Object motion data was used to generate assembly simulation for training, and human motion data was used to do ergonomic analysis to help design a better assembly cell. [Pg.1099]

These film methods may appear old fashioned, but this is wrong. Any serious X-ray laboratory will have a few of these machines, which are always necessary to give a first impression of the diffraction problem on a relatively cheap apparatus. especially when the expensive computer-controlled diffractometers are not immediately available or when there are problems and a three-dimensional inspection of the reciprocal space is necessary to gain an impression of the difficulties. [Pg.389]

Flawed dimensional characteristics affecting such characteristics as PCB size and thickness, hole size, pattern accuracy and registration, condnctor width and spacing, and annular ring (dimensional inspection is usually performed using a sampling plan)... [Pg.1182]

Dimensional Characteristics. Contour dimensional inspection verifies that the outside border dimensions, cutouts, and key slots meet the procurement documentation requirements. Contour dimension requirements can be considered fit requirements. Both undersized and oversized PCBs can affect functionaUty, depending on the degree of requirement violation. Incorrect placement or size of key slots prevents the proper mounting of the PCB. Measuring methods vary from the use of a ruler or calipers to sophisticated coordinate measurement machines (CMMs).The sophistication of the method is naturally dependent on the required dimensions and tolerances. [Pg.1189]

There have been numerous efforts to inspect specimens by ultrasonic reflectivity (or pulse-echo) measurements. In these inspections ultrasonic reflectivity is often used to observe changes in the acoustical impedance, and from this observation to localize defects in the specimen. However, the term defect is related to any discontinuity within the specimen and, consequently, more information is needed than only ultrasonic reflectivity to define the discontinuity as a defect. This information may be provided by three-dimensional ultrasonic reflection tomography and a priori knowledge about the specimen (e.g., the specimen fabrication process, its design, the intended purpose and the material). A more comprehensive review of defect characterization and related nondestructive evaluation (NDE) methods is provided elsewhere [1]. [Pg.200]

One notes by V(x, y, z) the bi-dimensional Fourier transform of the voltage u x,y,z) when the transducer is scanning the inspected surface at a height z=const. [Pg.378]

The eombination in a compact system of an infrared sensor and a laser as excitation source is called a photothermal camera. The surface heating is aehieved by the absorption of the focused beam of a laser. This localisation of the heating permits a three-dimensional heat diffusion in the sample to be examined. The infrared (IR) emission of the surface in the neighbourhood of the heating spot is measured by an infrared detector. A full surface inspection is possible through a video scanning of the excitation and detection spots on the piece to test (figure 1). [Pg.393]

In order that the data acquisition system can obtain information about the spatial location and orientation of the probe, a four-channel incremental encoder interface board is installed. Three channels are used to define position in three-dimensional space, while the fourth monitors the skew of the probe (skew is defined as rotation about an axis normal to the probe face). Although six measurements are required to completely define the location and orientation, it is assumed that the probe remains in contact with the inspection surface. [Pg.768]

Dimensional and runout inspections to determine the extent of deformation to bores, turns, flange faces, and fit areas. [Pg.206]

Where dimensional and functional checks are necessary, define how the receipt inspection personnel obtain the acceptance criteria and how they are to conduct the inspections and tests. [Pg.381]

The effective length is defined as the measured center distance plus the outside circumference of one of the inspection pulleys. This measurement method accounts for the modulus of elasticity, or stretch ability, and dimensional variations among belts with the same cross-section. [Pg.971]

We can fill in some of the unknown quantities almost by inspection. By symmetry, for example, we know that on a two-dimensional hexagonal lattice /eq = p/6. Also, the constraints given in equations 9.84 determine the coefficients ryi, a2 and 03 ... [Pg.498]

We are now ready to derive an expression for the intensity pattern observed with the Young s interferometer. The correlation term is replaced by the complex coherence factor transported to the interferometer from the source, and which contains the baseline B = xi — X2. Exactly this term quantifies the contrast of the interference fringes. Upon closer inspection it becomes apparent that the complex coherence factor contains the two-dimensional Fourier transform of the apparent source distribution I(1 ) taken at a spatial frequency s = B/A (with units line pairs per radian ). The notion that the fringe contrast in an interferometer is determined by the Fourier transform of the source intensity distribution is the essence of the theorem of van Cittert - Zemike. [Pg.281]

Fig. 14.3 Polyhedral packing plots for the two-dimensional layers of [RE(P2S6),/2(PS4)P in the series of solids A2RE(P2S6)i/2(PS4), where A=K, Cs RE = Y, La. Rare-earth polyhedra are striped PS4 polyhedra are black phosphorous atoms in P2S6 are shown as black circles. Alkali atoms are not shown for clarity. Although these phases have distinctly different structures based on space group symmetry and atomic positions, the compounds are clearly related upon close inspection of the building blocks. Fig. 14.3 Polyhedral packing plots for the two-dimensional layers of [RE(P2S6),/2(PS4)P in the series of solids A2RE(P2S6)i/2(PS4), where A=K, Cs RE = Y, La. Rare-earth polyhedra are striped PS4 polyhedra are black phosphorous atoms in P2S6 are shown as black circles. Alkali atoms are not shown for clarity. Although these phases have distinctly different structures based on space group symmetry and atomic positions, the compounds are clearly related upon close inspection of the building blocks.
When one inspects the multiple channel protein sequences that have been derived, one readily recognizes that they have related primary sequences. This suggests that they have similar three-dimensional structures. The primary sequences can be subdivided into an amino-terminal, a core and a carboxy-terminal domain (see Fig. 5). Each domain seems to contribute separately to the structure and function of a given channel [49]. Following this hypothesis, it has been possible to carry out domain swapping experiments between Sh and RCK proteins [49] as well as between... [Pg.308]


See other pages where Dimensional inspection is mentioned: [Pg.1151]    [Pg.1152]    [Pg.216]    [Pg.81]    [Pg.152]    [Pg.339]    [Pg.340]    [Pg.323]    [Pg.245]    [Pg.509]    [Pg.510]    [Pg.62]    [Pg.64]    [Pg.245]    [Pg.21]    [Pg.1151]    [Pg.1152]    [Pg.216]    [Pg.81]    [Pg.152]    [Pg.339]    [Pg.340]    [Pg.323]    [Pg.245]    [Pg.509]    [Pg.510]    [Pg.62]    [Pg.64]    [Pg.245]    [Pg.21]    [Pg.1023]    [Pg.1062]    [Pg.1066]    [Pg.555]    [Pg.108]    [Pg.356]    [Pg.124]    [Pg.127]    [Pg.129]    [Pg.130]    [Pg.392]    [Pg.418]    [Pg.250]    [Pg.86]    [Pg.197]    [Pg.112]    [Pg.128]   
See also in sourсe #XX -- [ Pg.485 ]




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