Dielectric constant strength

The solvent dielectric constant, ionic strength and temperature are chosen to fit the conditions of the experimental studies. The protein dielectric constant is assigned some small value, e.g. 4. The PB calculations are currently carried out with the atomic charges and radii of the PARSE parameter set, developed by Honig and coworkers [17] or that for CHARMM [12]. The PARSE parameter set... 

A cubic lattice is superimposed onto the solute(s) and the surrounding solvent. Values of the electrostatic potential, charge density, dielectric constant and ionic strength are assigned to each grid point. The atomic charges do not usually coincide with a grid point and so the... 

The dielectric constant (permittivity) tabulated is the relative dielectric constant, which is the ratio of the actual electric displacement to the electric field strength when an external field is applied to the substance, which is the ratio of the actual dielectric constant to the dielectric constant of a vacuum. The table gives the static dielectric constant e, measured in static fields or at relatively low frequencies where no relaxation effects occur. 

Tetralluoroethylene polymer has the lowest coefficient of friction of any solid. It has remarkable chemical resistance and a very low brittleness temperature ( — 100°C). Its dielectric constant and loss factor are low and stable across a broad temperature and frequency range. Its impact strength is high. 

Dielectric strength, kV mm Electrical Volume (dc) resistivity, ohm-cm Dielectric constant (60 Hz) Dielectric constant (10 Hz) Dissipation (power) factor (60 Hz) Dissipation factor (10 Hz) Mechanical Compressive modulus, 10Mb in-2 9.8-12 24-31 16-24 1014-1016 4.5-6.0 19 335-600 14 ... 

Electrica.1 Properties. The bulk electrical properties of the parylenes make them excellent candidates for use in electronic constmction. The dielectric constants and dielectric losses are low and unaffected by absorption of atmospheric water. The dielectric strength is quoted for specimens of 25 p.m thickness because substantially thicker specimens cannot be prepared by VDP. If the value appears to be high in comparison with other materials, however, it should be noted that the usual thickness for such a measurement is 3.18 mm. Dielectric strength declines with the square root of increasing... 

The magnitude of the induced dipole moment depends on the electric field strength in accord with the relationship = nT, where ]1 is the induced dipole moment, F is the electric field strength, and the constant a is caHed the polarizabHity of the molecule. The polarizabHity is related to the dielectric constant of the substance. Group-contribution methods (2) can be used to estimate the polarizabHity from knowledge of the number of each type of bond within the molecule, eg, the polarizabHity of an unsaturated bond is greater than that of a saturated bond. 

Electrical Resistance—Conductivity. Most fillers are composed of nonconducting substances that should, therefore, provide electrical resistance properties comparable to the plastics in which they are used. However, some fillers contain adsorbed water or other conductive species that can gready reduce their electrical resistance. Standard tests for electrical resistance of filled plastics include dielectric strength, dielectric constant, arc resistance, and d-c resistance. 

Electrical Properties. The low polarizabiHty of perfluorinated Hquids makes them exceUent insulators. Theh dielectric strengths are about 40 kV (ASTM D877) dissipation factors are about 0.0001 at 1 MH2 dielectric constants are about 1.8 volume resistivities are about 1 x 10 ohm-cm (ASTM D257) (17). 

In air, PTFE has a damage threshold of 200—700 Gy (2 x 10 — 7 x 10 rad) and retains 50% of initial tensile strength after a dose of 10" Gy (1 Mrad), 40% of initial tensile strength after a dose of 10 Gy (10 lad), and ultimate elongation of 100% or more for doses up to 2—5 kGy (2 X 10 — 5 X 10 rad). During irradiation, resistivity decreases, whereas the dielectric constant and the dissipation factor increase. After irradiation, these properties tend to return to their preexposure values. Dielectric properties at high frequency are less sensitive to radiation than are properties at low frequency. Radiation has veryHtde effect on dielectric strength (86). 

Electrical Properties. Polytetrafluoroethylene is an excellent electrical insulator because of its mechanical strength and chemical and thermal stabihty as well as excellent electrical properties (Table 6). It does not absorb water and volume resistivity remains unchanged even after prolonged soaking. The dielectric constant remains constant at 2.1 for a temperature range of —40 to 250°C and a frequency range of 5 Hz to 10 GHz. 

Electrical Insulation. The substitution of a gas for part of a soHd polymer usuaUy results in large changes in the electrical properties of the resulting material. The dielectric constant, dissipation factor, and dielectric strength are aU generaUy lowered in amounts roughly proportional to the amount of gas in the foam. 

For low frequency electrical insulation appHcations, the dielectric constant of the insulation is ideaUy as low as possible (see Insulation, electrical). The lower the density of the ceUular polymer, the lower the dielectric constant and the better the electrical insulation. Dielectric strength is also reduced at... 

In addition to the obvious effect of high dielectric constant glasses on the capacitance of the circuit elements iato which they enter, their dielectric strengths maybe more important. Siace the amount of energy a capacitor can store varies as the first power of the dielectric constant and the second power of the voltage, a glass with twice the dielectric strength is as effective as one with four times the dielectric constant. 

The most important electrical properties of insulation are dielectric strength, insulation resistance, dielectric constant, and power factor. Corona resistance, although not stricdy an electrical property, is usually considered also (10). 

Sheet Miea. Good quahty sheet mica is widely used for many iadustrial appHcations, particularly ia the electrical and electronic iadustries, because of its high dielectric strength, uniform dielectric constant, low power loss (high power factor), high electrical resistivity, and low temperature coefficient (Table 6). Mica also resists temperatures of 600—900°C, and can be easily machined iato strong parts of different si2es and shapes (1). 

Alumina, or aluminum oxide [1344-28-17, has a thermal conductivity 20 times higher than that of most oxides (5). The flexural strength of commercial high alumina ceramics is two to four times greater than those of most oxide ceramics. The drawbacks of alumina ceramics are their relatively high thermal expansion compared to the chip material (siUcon) and their moderately high dielectric constant. 

Although beryllium oxide [1304-56-9] is in many ways superior to most commonly used alumina-based ceramics, the principal drawback of beryUia-based ceramics is their toxicity thus they should be handled with care. The thermal conductivity of beryUia is roughly about 10 times that of commonly used alumina-based materials (5). BeryUia [1304-56-9] has a lower dielectric constant, a lower coefficient of thermal expansion, and slightly less strength than alumina. Aluminum nitride materials have begun to appear as alternatives to beryUia. Aluminum nitride [24304-00-5] has a thermal conductivity comparable to that of beryUia, but deteriorates less with temperature the thermal conductivity of aluminum nitride can, theoreticaUy, be raised to over 300 W/(m-K) (6). The dielectric constant of aluminum nitride is comparable to that of alumina, but the coefficient of thermal expansion is lower. 

Materials Volume resis-tivity, H-m Dielectric constant at 1 MHz Dielectric strength, kV /mm Dissipation factor at 1 MHz Thermal conduc-tivity, W/(m-K) GTE, ppm/°C Maximum use tem-perature, °C... 

Plastic film Melting point, °C Moisture absorption, % Tensile strength, MPa " Ultimate elongation, % Coefficient of thermal expansion, 10-%K Dissipation factor at 1 kH2 Dielectric constant at 1 kHz Dielectric strength, MV/m Cost factor... 

Laminate T °C GTE below ppm/°C Water uptake, MIL-P-13949F, mg Dielectric constant at IMH2 Dissipation factor at 1 MH2 Tensde strength, MPa " Modulus of elasticity, GPa Thermal conductivity, W/(m-K)... 

Commonly used materials for cable insulation are poly(vinyl chloride) (PVC) compounds, polyamides, polyethylenes, polypropylenes, polyurethanes, and fluoropolymers. PVC compounds possess high dielectric and mechanical strength, flexibiUty, and resistance to flame, water, and abrasion. Polyethylene and polypropylene are used for high speed appHcations that require a low dielectric constant and low loss tangent. At low temperatures, these materials are stiff but bendable without breaking. They are also resistant to moisture, chemical attack, heat, and abrasion. Table 14 gives the mechanical and electrical properties of materials used for cable insulation. 

Insulation Common designation Tensile strength, MPa Elongation, % Specific gravity Dielectric strength, kV /mm Dielectric constant at 1 kHz Dissipatic factor at kHz... 

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