Electrodeposition deposition

Chemical Bath Deposition, Electrodeposition, and Electroless Deposition of Semiconductors, Superconductors, and Oxide Materials... 

Defect-free deposits in vias and trenches, superconformal electrodeposition, may be achieved in the presence of additives. In superconformal deposition, electrodeposition... 

The copper deposit electrodeposited from 0.075 M C11SO4 in 0.50 M H2SO4 at an overpotential of 550 mV with a quantity of the electricity of 10 mAh cm-2 was cauliflower-like structure. Copper... 

The morphologies of the copper deposits electrodeposited at an overpotential of 550 mV are cauliflower-like and dendritic ones.68 The size of the cauliflower-like particles did not change with increasing temperature, but the size of sub-particles constituting the cauliflower-like forms which decreased with increasing temperature of electrodeposition. The decrease of the size of sub-particles with increasing temperature can be explained by the well-known dependence of the nucleation rate on temperature,69 which was derived by Volmer and Weber.70... 

The morphologies of the copper deposits electrodeposited at an overpotential of 800 mV are shown in Fig. 40, from which the strong effect of evolved hydrogen on the morphologies of copper deposits is visible. Very porous structures, holes formed due to the attachment of hydrogen bubbles, cauliflower-like forms, and the absence... 

Figure 40. Morphologies of copper deposits electrodeposited at an overpotential of 800 mV at temperatures of (a) 14.0 0.5°C, (b) 35.0 0.5°C, and (c) 50.0 0.5°C. (Reprinted from Ref. with permission from the Serbian Chemical Society).

The powder particles belonging to the second type are shown in Fig. 46a. They are obtained by tapping the copper deposit electrodeposited from 0.15M CuSC>4 in 0.50M H2SO4 at an overpotential of 1,000 mV at which the electrodeposition of copper was accompanied by vigorous hydrogen evolution, corresponding to... 

The copper deposit obtained by electrodeposition at an overpotential of 300 mV during 2 min at copper cylindrical electrode from 0.15M Q1SO4 in 0.50M H2SO4 is shown in Fig. 24a. Copper deposits electrodeposited at overpotentials of 550 and 650 mV on the... 

Figure 24. (a) The copper deposit electrodeposited at an overpotential of 300 mV during 2 min on the cylindrical copper electrode and copper deposits electrode-posited with 5.0mAhcm 2 on the copper substrate Horn (a) at overpotentials of (b) 550 mV and (c) 650 mV (d) the top of copper dendrite electrodeposited at an overpotential of 650 mV with a deposition time of 32 min. Reprinted from ref.8 with permission of Elsevier. 

The second direction includes various methods of vapor deposition, electrodeposition, crystallization from amorphous condition as well as technology of powder metallurgy using compacting of ultra-fine powders. 

Practical growth of solid material phases, such as by vapor phase metal deposition, electrodeposition, etc., occurs away from the idealized thermodynamic models. 

Fig. 1.8 Morphologies of Pb deposits electrodeposited from 0.30 M Pb(N03)2 in 2.0 M NaN03 (a) the ohmic control, rj = 30 mV, and the diffusion control, (b) ri = 55 mV, (c, d) rj= 120 mV (Reprinted from Ref. [12] with permission from Elsevier and Ref. [23] with kind permission from Springer)...

Fig. 2.23 Silver deposits electrodeposited from 0.50 M AgNOs in 100 g dm NaN03 (a) in the potentiostatic regime of electrolysis onto Ag wire electrode without the addition of H3PO4. Quantity of electricity 100 mA h cm. Deposition overpotential 120 mV. The exchange current density 26 mA cm and (b) in the galvanostatic regime of electrolysis onto Pt wire electrodes with the addition of 6 g dm H3PO4. Current 30 mA. Time 2 s. The exchange current density 5 mA cm (Reprinted from Refs. [13, 65, 66] with kind permission from Springer)...

Nikolic ND, Brankovic G, Maksimovic VM (2012) Morphology and internal structure of copper deposits electrodeposited by the pulsating current regime in the hydrogen co-deposition range. J Solid State Electrochem 16 321-328... 

Fig. 6.5 The comparative survey of the polarization curves and the typical morphologies of lead deposits electrodeposited from 0.10 M Pb(NO3)2+2.0 M NaN03 and 0.10 M Pb (CH3C00)2+ 1.5 M NaCH3COO + 0.15 M CH3COOH (Reprinted from Ref. [11] with kind permission from Springer and Ref. [14] with permission from Elsevier)...

Current synthetic methods for the preparation of Pd-based electrocatalysts for anodes of DAFCs are manifold, including reduction of high-valent metal compounds with chemical agents, colloidal metal deposition, electrodeposition and transmetalation... 

Metal chalcogenides of general formula, MX(M = Cd, Zn, etc. X = S,Se,orTe)are important in a variety of appKcations ranging from solar cells to chemical/biological sensors. While thin films of these materials can be prepared by many methods (e.g. vacuum evaporation, chemical bath deposition), electrodeposition is an attractive alternative because of its simplicity, low cost, ambient temperature operation (and consequently the absence of interlayer diffusion), and its amenability to large and irregular area coatings [1]. 

Materials systems are used quite widely on automobiles for corrosion protection. For example, clad metals are commonly used in applications such as exterior trim and bumpers (stainless steel clad aluminum), windshield wiper socket (copper/steel/bronze), transition materials to join aluminum to steel (aluminum clad steel), and hydraulic brake line tubing (steel/SS/steel) [37]. A wide range of metallic coatings are produced by spraying, chemical vapor deposition, physical vapor deposition, electrodeposition, and electroless deposition [23-25]. 

Fig. 1.18 Copper deposits electrodeposited from 0.15 M CUSO4 in 0.50 M H2SO4 at overpotentials of (a) 550 mV and (b) 700 mV. The quantity of electricity 10 mAh cm (Reprinted from [45,47] with permission from Elsevier and [46] with permission from Springer.)...

Fig. 2.4 (a) Macrostracture of silver powdered deposits electrodeposited at an overpotential of 1,000 mV from 0.1 M AgNOs in both 0.5 M (NH4)2S04 and 0.5 M NH3 and (b) dendritic particles obtained by tapping silver deposit (Reprinted from [4] with permission from Electrochemical Society.)... 

In the dependence of the quantity of evolved hydrogen, the two types of powdered deposits are formed [32, 54]. The typical powdered deposits electrodeposited from 0.075 M CUSO4 in 0.50 M H2SO4 at an overpotential of 650 mV (plateau of the limiting diffusion current density) and at an overpotential of 1,000 mV (about 250 mV above the plateau) are shown in Fig. 3.7a, b, respectively. 

Fig. 3.12 Powdered deposits electrodeposited by the pulsating overpotential (PO) regime with a deposition pulse of (a) 3 ms, (b) 20 ms, (c) magnified part from (a), and (d) magnified part from (b). Pause duration 10 ms. Overpotential amplitude 1,000 mV. Solution 0.15 M CUSO4 in 0.50 M H2SO4...

From Figs. 3.11 and 3.12, it is very clear that macromorphologies of deposits electrodeposited from 0.30 M CUSO4 in 0.50 M H2SO4 at 1,000 mV and by the PO regime with a deposition pulse of 3 ms were very similar to each other in both cases, holes formed by attached hydrogen bubbles surrounded by very branchy dendrites were formed. 

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