Copper-nickel-phosphorus alloys

Ziewiec et al. [24] reported on the preparation, thermal stability and glass-forming ability of copper-nickel-phosphorus alloys. They found that, depending on the composition, melt spinning may result in either amorphous or partially crystalline systems, whose thermal behaviour was characterized by DSC, DTA, andXRD. 

To counteract the (vexing) convection effects on kinetic experiments, Aogaki and co-workers, having developed a special electrode assembly to separate mass transport and kinetic effects, report a marked decrease in the exchange current density (about 25%) in magnetic fields imposed on a copper deposition cell. Virtually no effect on the transfer coefficient (a 0.44) was observed. Experimental results obtained in nickel-phosphorus alloy deposition, cupric ion reduction in ethylenediamine solutions, and the electrolytic reduction of acetophenone " are further demonstrations of the interaction of the magnetic fields with polarization characteristics, and point to the difficulty of fully eliminating the effect of convection and/or diffusion on electrode kinetics. 

Weathering steels, such as ASTM standards A-242 and A-588, which are low-alloy steels of relatively high strength, form self-protecting rust films when exposed to many industrial as well as uncontaminated atmospheres. These steels contain small amounts of copper, nickel, phosphorus, silicon, manganese, or various combinations thereof which impart improved corrosion resistance. The corrosion resistance of these steels is dependent on the climatic conditions, the pollution levels, the degree of sheltering from the atmosphere, and the specific composition of the steel. 

A common metallization scheme for connector contacts used on printed circuit boards is a gold electroplate over copper or copper alloy substrate, usually with an intervening thin diffusion barrier layer (1.2-2.5 pm) of electroplated nickel or nickel-phosphorus alloy. Ordinarily this metallization scheme performs well and is frequently used in high reliability applications. A less reliable and infrequently used metallization has silver as the diffusion barrier. A potential problem with both metallizations is caused by the inevitable pores that exist even in the best quality gold elec-... 

Impurities in zirconium and zirconium alloys and compounds are often determined by emission spectroscopy. Both carrier distillation techniques and poiat-to-plane methods are available (91,92). Several metaUic impurities can be determined instantaneously by this method. Atomic absorption analysis has been used for iron, chromium, tin, copper, nickel, and magnesium (93). The interstitial gases, hydrogen, nitrogen, and oxygen are most often determiaed by chromatography (81). Procedures for carbon, chloride, fluoride, phosphorus, siUcon, sulfur, titanium, and uranium in zirconium are given in the hteiatuie (81,94—96). 

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