Gold Electroplating

FIGURE 2.31 Glass substrates before and after etching by 48% HF when the etch masks are (a) sputtered Ti (50 nm)/Au (200 nm) and (b) sputtered-gold titanium passivated with electroplated gold [123], Reprinted with permission from the Institute of Physics Publishing. 

Woodruff, D.W. Westwater, J.W. Steam condensation on electroplated gold Effect of plating thickness. Int. J. Heat Mass Transfer 22 (1979) 629-632... 

Schematic of field-flow lEF of mitochondria, (b) Photograph of a microfabricated device before final assembly (c) enlarged view of the fractionation end of the device. The device consists of electroplated gold electrodes and microfluidic channels formed in a photopattemable...

Apart from carbonaceous materials, other examples of nanocomposites can be found gold nanoparticles can be incorporated into PPy in a full electrochemical process using oxidation-reduction cycles. Alternatively a synthetic route consists in electroplating gold on PPy nanowires synthesized by a template electrochemical method. ... 

This is considerably more economical and results in much less target usage. For added savings, some companies apply photoresist to the substrate and electroplate gold only where actually required by the pattern. 

Specification by most original equipment manufacturer (OEM) customers Capability of being selectively coating with electroplated gold... 

A condition known as sporadic brittle fracture has been reported and may be related to the use of SAC alloy soldered to electroplate gold over electroplate nickel. It is most often associated with EGA solder ball-to-BGA package attach, but may also occur in board-level solder joints at the EGA ball-PWE interface. The root cause of failure is still unknown. 

Copper is etched at further stages in the manufacture of printed circuit boards including, after resist application (1) removal of electroless and electroplated deposits before pattern plating with copper (2) prior to electroplating gold onto edge contacts and (3) final etching of all unwanted copper to leave the desired circuit pattern. 

Electrochemical deposition (ECD) has been a technique for material synthesis since Luigi Brugnatelli first electroplated gold in 1805. After this historic achievement, ECD has advanced to include the deposition of other metals and alloys through the use of earth-abundant metal salts. In more recent times, metal oxides," -" metal sulfides," semiconductors, - and conductive... 

The properties of electroplated gold, as often is the case for electrodeposited metals and alloys, are scattered in a number of technical and scientific publications, the only comprehensive review being the chapter devoted to it in the book of Safranek [7]. 

Source From Electroplated golds, in Gold Usage, W. S. Rapson and T. Groenewald, Academic Press, London, 1978, pp.196-269 and Gold plating, A. M. Weisberg, Metal Finish., 2007,105(10), 205. 

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