Copper surfaces electrodeposited from

Figure 20. The line sections analysis of the flat parts of surfaces of the copper coatings electrodeposited from a) solution Cu I, 6 = 20 pm,15 b) solution Cu II, 5 = 20 pm,15 c) solution Cu I, 6 = 25 pm,13 d) solution Cu II, 8 = 25 pm 2 (Reprinted from Refs.12,13,15 with permission from Elsevier and Springer-Verlag.)...

X-Ray diffraction (XRD) patterns of 20 pm thicks copper coatings obtained from from solution Cu I and solution Cu II are shown in Figs. 23a and 23b, respectively. From Figs. 23a and 23b can be seen that the copper surfaces exhibited different a preferred orientation. The copper coating electrodeposited from solution Cu / showed (111) preferred ori... 

Mirror brightness of copper surfaces is not associated with their preferred orientation. This copper coating showed (200) preferred orientation [87]. On the other hand, the copper coating electrodeposited from the copper solution containing thiourea as the brightening additive showed the (111) preferred orientation, while the mirror bright copper surface polished both mechanically and electrochemically was relatively disordered with an increased ratio of copper crystallites oriented in (200), (220), and (311) planes [87, 91, 97]. 

Simultaneously, holes of irregular shapes (Fig. 29f) were formed from nuclei of copper formed in the initial stage of the electrodeposition between the hydrogen bubbles.18 The current distribution at the growing copper surface was responsible for the formation of this type of hole. 

Morphologies of copper deposits obtained at an overpotential of 1,000 mV from these copper solutions are shown in Figs. 35-37. The honeycomb-like structure was formed by the electrodeposition from 0.15 MCUSO4 in 1.0MH2SC>4(Fig.35). From Fig. 35 it can be seen that holes were lined up in parallel rows. The average diameter of formed holes was 50 pm, while the number of formed holes was 71/mm2 surface area of the copper electrode. 

Figure 7.7 Copper crystals electrodeposited on PEDOT layers by means of single-potential-step experiments (a, c) and double-potential-step experiments involving copper stabilization (b, d) before (a, b) and after (c, d) UV-irradiation of the CP surface. (Micrographs a and b adapted with permission from M. Hieva, V. Tsakova, N.K. Vuchkov, K.A. Temelkov, N.V. Sabotinov, UV copper ion laser treatment of poly-3,4- ethylenedioxythiophene,. Optoelectron. Adv. Mat., 9, 303-306 (2007). Copyright 2007 Nartional Institute of Research and Development for Optoelectronics.)...

Fig. 2.30 The STM images of 25 pm thick the coppCT coating electrodeposited from solution 240 g dm CuSOtS H2O + 6O g dm H2SO4+ 0.124 g dm NaCl+ 1.0 g dm modified polyglycol ether (Lutron HF 1)+ 1.0 g dm" poly(ethylene glycol) M = 6000 (PEG 6000) + 1.5 mg dm 3 -mercapto propane sulfonate. Scan size (a) (880 x 880) nm, and (b) (300 x 300) nm, (c) the line section analysis from the portion of the STM surface of the copper coating shown in Fig. 2.30a. The distance between markers is 1.177 nm.and (d) the line section analysis of the flat part of surface of the copper coating shown in Fig. 2.30c (Reprinted from Ref. [91] with permission from Elsevier and Ref. [87] with kind permission from Springer)...

Some rough surfaces resulting from pretreatment prior to adhesive bonding (a) porous anodic oxide on aluminum (schematic) (b) dendrites of zinc electrodeposited onto a zinc surface (c) black CuO layer produced on copper (d) PTFE irradiated by argon ions (After Koh et al. 1997) (e) adhesion of copper to silica using a mechanical key (van der Putten 1993) (i) TiW islands deposited (ii) Pd activator adsorbed and HF etching (iii) electroless Cu deposited (iv) Cu electrodeposited... 

Cu9ln4 and Cu2Se. They performed electrodeposition potentiostatically at room temperature on Ti or Ni rotating disk electrodes from acidic, citrate-buffered solutions. It was shown that the formation of crystalline definite compounds is correlated with a slow surface process, which induced a plateau on the polarization curves. The use of citrate ions was found to shift the copper deposition potential in the negative direction, lower the plateau current, and slow down the interfacial reactions. 

The high stability of the metal clusters allows one to hold the sample potential slightly positive of the Nernst potential, typically at +10 mV versus Cu/Cu2 + in the case of copper. Thus, normal electrodeposition onto the sample directly from solution is prevented, whereas the tip-generated Cu clusters remain on the surface [96]. 

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