Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Copper developments

Copper Development Association P.O. Box 1840 Greenwich, Conn. 06836 Standards for wrought and cast copper and copper alloy products a standards handbook is pubUshed with tolerances, alloy data, terminology, engineering data, processing characteristics, sources and specifications cross-indexes for six coppers and 87 copper-based alloys that are recognized as standards. [Pg.25]

At 0.020-mm grain size except in the case of Alloy 638, which is the standard annealed condition. Designation of Copper Development Association. [Pg.534]

A 99.5% Cu—0.5% Te alloy has been on the market for many years (78). The most widely used is alloy No. CA145 (number given by Copper Development Association, New York), nominally containing 0.5% tellurium and 0.008% phosphorous. The electrical conductivity of this alloy, in the aimealed state, is 90—98%, and the thermal conductivity 91.5—94.5% that of the tough-pitch grade of copper. The machinahility rating, 80—90, compares with 100 for free-cutting brass and 20 for pure copper. [Pg.392]

Copper and Copper Alloy Data Permanent File No. 1, Copper Development Association, London, England, 1968. [Pg.330]

Selecting Bronze Beanng Matenals, pamphlet. Copper Development Association, Greenwich, Conn., 1986. [Pg.10]

Copper Development dissociation Standards Handbook Part 2— A//oy Data Wrought Copper and Copper dilloj Mill Products 8th ed.. Copper Development Association, Inc., Greenwich, Conn., 1985. [Pg.74]

The only requirement for solderers is that they follow the procedure in the Copper Tube Handbook of the Copper Development Association. [Pg.1005]

When possible, earlier widely used three- or four-digit alloy numbering systems such as those developed by the Aluminum Association (AA), Copper Development Association (CDA), American Iron and Steel Institute (AISI), etc., have been incorporated by the addition of the appropriate alloy-group code letter plus additional digits. For example ... [Pg.2448]

Figure 28.7 Space factor for rectangular conductors (Courtesy The Copper Development Association) Table 28.3 Derating factors on account of higher ambient temperature or restricted temperature rise... Figure 28.7 Space factor for rectangular conductors (Courtesy The Copper Development Association) Table 28.3 Derating factors on account of higher ambient temperature or restricted temperature rise...
Figure 28.14 Ratio of a.c. current ratings for different configurations of busbars of the same cross-sectional area (Courtesy The Copper Development Association, U.K.)... Figure 28.14 Ratio of a.c. current ratings for different configurations of busbars of the same cross-sectional area (Courtesy The Copper Development Association, U.K.)...
Source The Copper Development Association and the Electrical Review. [Pg.919]

Examples are tViggin Alloys 100, Henry Wiggin Co. Ltd., Hereford Copper in Chemical Plant, Copper Development Association, London (1960) Corrosion Resistance of Stainless Steel, Publication 112/1, Firth Vickers Stainless Steel Ltd., Sheffield Corrosion Resistance of Titanium, Imperial Metals Industries (Kynoch) Ltd., Birmingham... [Pg.416]

A wide range of cast and wrought alloys is available. For detailed expositions of properties and uses the reader is referred to publications on many specialised aspects obtainable from the Copper Development Association offices in various countries. Relevant publications of the British Standards Institution include BS 1400, Copper Alloy Ingots and Castings and BS 2870-5, Copper and Copper Alloy Wrought Products. All standards of the American Society for Testing and Materials relating to copper and copper alloys are included in a volume published annually ... [Pg.682]

Standard Handbook — Copper, Brass, Bronze, Wrought Mill Products, 8lh edn, Copper Development Association Inc., New York (1985) Properties and Applications of Wrought Coppers and Copper Alloys , Meta Prog., 98, 85 (1970)... [Pg.710]

Gilbert, P. T., Metaiiurgist Mater. Tech., 10, 316 (1978) Gilbert, P. T., Proc. Internat. Symposium Corrosion and Protection Offshore, Cefracor, Paris (1979) Copper Development Assoc. (UK), Copper Alloys for Offshore Tech., Publication CM-L39 (1976) Lim, L. H., Conference Offshore Europe 77, Aberdeen, Paper No. 36680 (1977)... [Pg.718]

Prager, M. and Thiele, E. W., Welding J., p. 17 (July 1979) Middleton, L. G., R. Inst. Naval Arch/Copper Development Assoc. Symposium (Jan. 1980), London Schorsch,... [Pg.718]

Pinner, R., Copper and Copper Alloy Plating, Copper Development Assoc., London (1962)... [Pg.523]

The Copper Development Association has excellent references on copper and its alloys at http //www.copper.org. [Pg.34]

Copper Development Association (2003). Uses of copper compounds, www.copper.org/ applications/compounds/copper sulphate02.html. [Pg.409]

Copper deposits, electroless, 9 108 Copper Development Association,... [Pg.219]

American Society of Heating, Refrigeration and Air Conditioning Engineers — H. R. Kornblum Chemical Manufacturers Association — D. R. Frikken Copper Development Association — A. Cohen Ductile Iron Pipe Research Association — T. F. Stroud Edison Electric Institute — R. L. Williams International District Heating Association — G. M. Von Bargen... [Pg.12]

COPPERDATA Copper Development Association, Inc. numeric data for coppers and copper alloys... [Pg.119]

Copper is used in three basic forms pure, alloyed with zinc (brass), and alloyed with tin (bronze). Copper and copper alloys are difficult to bond satisfactorily, especially if high shear and peel strengths are desired. The primary reason for this difficulty is that the oxide that forms on copper develops rapidly (although not as fast as the rate of oxide development on aluminum). The copper oxide layer is weakly attached to the base metal under usual conditions. Thus, if clean, bare copper substrates were bonded, the initial strength of the joint would be relatively high, but on environmental exposure an oxide layer could develop which will reduce the durability of the joint. [Pg.353]

W. Seale, Copper Development Association, private communication, 28 October 2004. [Pg.483]


See other pages where Copper developments is mentioned: [Pg.119]    [Pg.392]    [Pg.368]    [Pg.919]    [Pg.925]    [Pg.190]    [Pg.713]    [Pg.719]    [Pg.394]    [Pg.190]    [Pg.292]    [Pg.174]    [Pg.285]    [Pg.199]    [Pg.392]    [Pg.16]    [Pg.396]   
See also in sourсe #XX -- [ Pg.416 , Pg.417 ]




SEARCH



Copper Development Association

Copper catalyzed reactions active ligand development

Copper catalyzed reactions methodology development

Copper complexes physical development

Copper industry, future developments

More Recent Developments Stoichiometric Copper Hydride Reagents

Paper containing copper, development

© 2024 chempedia.info