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Contact normal

The contact ends of printed circuit boards are copper. Alloys of nickel and iron are used as substrates in hermetic connectors in which glass (qv) is the dielectric material. Terminals are fabricated from brass or copper from nickel, for high temperature appHcations from aluminum, when aluminum conductors are used and from steel when high strength is required. Because steel has poor corrosion resistance, it is always plated using a protective metal, such as tin (see Tin and tin alloys). Other substrates can be unplated when high contact normal forces, usually more than 5 N, are available to mechanically dismpt insulating oxide films on the surfaces and thereby assure metaUic contact (see Corrosion and corrosion control). [Pg.30]

Comparison with Figure 9-21C gives 3 in. water/ft (parameter) or a total of (3) (45) = 135 in. water. Neither of these values represents a condition (flooding) that should be considered for tower operation, except under known experience studies. Distillation operations sometimes operate above flooding, but other types of contacting normally require operations in the loading region (or below) for stable performance. [Pg.315]

If either casing distortion or rotor expansion occur, the clearance between the rotating parts will decrease and metal-to-metal contact will occur. Since the rotors typically rotate at speeds between 3600 and 10,000 rpm, metal-to-metal contact normally results in instantaneous, catastrophic compressor failure. [Pg.560]

Many details in building construction may permit rain water to enter and this may be retained in crevices in metal surfaces, or between a metallic and some other surface. Water may drip on to metal surfaces. These conditions, which can involve a greater risk of corrosion than exists where a metal is exposed to the normal action of the weather, are more severe when the water contains dissolved acids, alkalis or salts derived from the atmosphere or from materials with which the water comes into contact. Normal supply waters can also cause corrosion. [Pg.42]

As synaptic contacts are being reestablished, it is likely that the high-affinity DAT is down regulated to maintain dopamine concentrations in the synaptic cleft. With time, and as the number of contacts normalize, normal transport may also be restored. This however, requires a lengthy process and would not be completed in animals with extensive lesions, even after 16 weeks. Blanchard et al. (1996) observed growth cones entering the striatum seven months after partial lesions, suggesting that 12 months or more may be required for normalization of synaptic function (Blanchard et al., 1996). [Pg.182]

Osteoblasts and osteoclasts are involved in the bone remodeling process. One can easily see that certain parts of bone must be eroded and lesorbed in the growing infant or child. Ihe skull, for example, must be resorbed to make room for the growing brain. The osteoclast adheres to the bone and secretes acid in its zone of contact with the bone, A pH of about 3 may be produced in this zone of contact. Normally, bone mineral is very insoluble in water. An attempt to dissolve hydroxyapatite in water at pH 7 results in a solution of calcium ions with a concentration of about 0,1 mM. Bone mineral can, however, be dissolved in acid. Apparently, the bone mineral dissolved in the acid secreted in the region of contact can result in a solution of calcium reaching about 40 mA4- The osteoclast is distinguished by its ruffled bonder... [Pg.582]

Figure 7-2 Control of the alternative complement pathway by activating surfaces. When complement component C3b binds to a surface, there exist two possible outcomes. Under normal conditions, when no activating surface is present (e g., if C3b has contacted normal tissue), sequential addition of blood cofactors H and I converts C3b into C3c, inactivating the complement protein. If an activating surface such as a microbe or damaged tissue is encountered, sequential addition of factors B and D drives the alternative pathway to the normal properdin (P) intermediate, and the complement cascade is triggered. The properdin-containing component (C3bBbP) feeds back to the beginning of the pathway, generating more C3. Figure 7-2 Control of the alternative complement pathway by activating surfaces. When complement component C3b binds to a surface, there exist two possible outcomes. Under normal conditions, when no activating surface is present (e g., if C3b has contacted normal tissue), sequential addition of blood cofactors H and I converts C3b into C3c, inactivating the complement protein. If an activating surface such as a microbe or damaged tissue is encountered, sequential addition of factors B and D drives the alternative pathway to the normal properdin (P) intermediate, and the complement cascade is triggered. The properdin-containing component (C3bBbP) feeds back to the beginning of the pathway, generating more C3.
Impinging motion Stream of abrasive particles Rolling contact (normal component) Striker against plate... [Pg.351]

The third mechanism can be seen as a combination of first and second basic mechanisms (Figure 1(c)). In a fractured rock with multiple fractures, anisotropy in fluid permeability may be significant due to the different orientations of fractures and anisotropic stresses. Each fracture is under different contact normal or shear stresses mobilized through deformations and this make the directional permeability anisotropic. [Pg.270]

CH4 concentration Contact normal force Sliding speed Sliding time Number of tests Number of explosion... [Pg.454]

Hydrodynamic lubrication is favored by a high sliding velocity, a weak normal force and a high viscosity of the lubricant. In machines, lubricated contacts normally operate in the hydrodynamic regime, minimizing thus friction and wear. [Pg.425]

Temperature Compatibility. If pin-in-paste soldering is to be used, check that components are temperature-compatible with the oven reflow process. The high temperatures and long exposures associated with oven reflow soldering may cause unsuited molded component bodies to melt or warp. Connector contact normal force may be affected if the molded connector body softens or distorts. Solder joints or wire bonds internal to some devices may become disbanded, and some, such as electrolytic capacitors, may leak or even explode as a result of an oven reflow cycle. Check the component manufacturer s specification for thermal hmits and compatibihty with oven reflow soldering. [Pg.1099]

Photoelectromagnetic (PEM) detector Utilizes photodiffusion, i.e., the appearance of photovoltage in the direction of Ohmic contacts, normally to radiation, as a result of the diffusion of carrias generated by self-photoexcitation in magnetic field (without electric bias). Usually an uncooled device... [Pg.10]

The fabric tensor, which describes the directed probability distribution to find a contact, involves the contact normal vectors related to the so-called branch vectors n ... [Pg.41]

When a fault current develops, for example, from a short circuit, an actuating mechanism quickly separates the contacts and a vacuum arc forms between the contacts. Normally, the separation of the contacts does not exceed 0.5 in., and were it not for the fact that alternating current is involved, the high-current arc would continue indefinitely. However, as the first zero is approached on the ac wave, the arc becomes unstable and extinguishes in times of the order of 10 sec. As discussed in Section II.E, an important characteristic of the vacuum arc is that it does not extinguish at the normal current zero, but at a finite current before ciurent zero, as shown in Fig. 7. The current at which this occurs is called the chopping current. For a short vacuum arc, this current is dependent on the... [Pg.363]

Difficult to regenerate after water contact Normally difficult to evacuate because of moisture content Dissolves in acidic media Needs protection from atmosphere... [Pg.409]

Type of Contact Normal Limit Extreme Limit... [Pg.142]

In addition, the contact normal force between the threads is found as... [Pg.70]

Fig. 8.10 Instability caused by kinematic constraint - 2-DOF model with very high contact stiffness and damping (a) phase-plane (b) contact normal force... Fig. 8.10 Instability caused by kinematic constraint - 2-DOF model with very high contact stiffness and damping (a) phase-plane (b) contact normal force...

See other pages where Contact normal is mentioned: [Pg.473]    [Pg.42]    [Pg.112]    [Pg.473]    [Pg.451]    [Pg.1587]    [Pg.464]    [Pg.2433]    [Pg.451]    [Pg.3053]    [Pg.257]    [Pg.1832]    [Pg.143]    [Pg.317]    [Pg.434]    [Pg.434]    [Pg.71]    [Pg.200]   
See also in sourсe #XX -- [ Pg.59 , Pg.60 , Pg.61 , Pg.62 ]

See also in sourсe #XX -- [ Pg.59 , Pg.85 , Pg.87 , Pg.124 , Pg.125 , Pg.126 , Pg.127 , Pg.128 , Pg.129 , Pg.130 , Pg.131 , Pg.132 , Pg.133 , Pg.134 , Pg.135 , Pg.136 , Pg.137 , Pg.138 , Pg.139 , Pg.172 , Pg.174 , Pg.175 , Pg.176 , Pg.177 , Pg.178 , Pg.179 , Pg.180 , Pg.181 , Pg.182 , Pg.183 , Pg.184 , Pg.185 , Pg.186 , Pg.187 , Pg.188 , Pg.189 , Pg.190 , Pg.191 , Pg.192 ]




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