Conformation Device fabrication

Since advanced lithography tools with resolution down to sub 100 nm may not be readily available, some novel techniques to fabricate ID nanochannels have been developed and reported. One of these techniques uses standard microfabrication process and has the potential to make integrated nanofluidic devices [2]. This technique is similar to the spacer technique developed in solid-state electronic device fabrication. A spacer is the thin side wall achieved by conformal deposition of selected thin film on the side wall of a sacrificial structure. With the fine control of the LPCVD deposition process, a spacer as thin as 10 nm can be made. After removing the sacrificial structure, a spacer as thin as 10 nm is left on the substrate, which can be subsequently used as a mask to pattern nanometer lines or used as a sacrificial line to make a nanochannel. Other novel techniques involve shrinking a larger channel made by standard micromachining to smaller sizes by methods such as filling the channel with other materials [3]. 

The ability of these peptidomimetic collagen-structures to adopt triple helices portends the development of highly stable biocompatible materials with collagenlike properties. For instance, it has been found that surface-immobilized (Gly-Pro-Meu)io-Gly-Pro-NH2 in its triple-helix conformation stimulated attachment and growth of epithelial cells and fibroblasts in vitro [77]. As a result, one can easily foresee future implementations of biostable collagen mimics such as these, in tissue engineering and for the fabrication of biomedical devices. 

OLED on an Al-PET substrate. The device performance does not deteriorate after repeated bending, suggesting that there is no significant stress-induced change in the characteristics of the OLEDs fabricated on PET foil [71,82]. The results demonstrate the feasibility of fabricating flexible displays using a variety of plastic substrates including metal-laminated plastic foils, or a metal film sandwiched between two plastic foils. The flexible device structures enable a display to conform, bend, or roll into any shape and thus make possible other product concepts. 

The simple analysis presented above confirms that new formulations are required to produce stable, reliable products for field use. Practical system requirements, as defined by Mil Spec conformity and the use of standard fabrication and assembly processes, definitely require that a electro-optic polymer system with better thermal properties than thermoplastic acrylates be developed. That this is true for optical interconnection boards and modules is not surprising because of their complexity. It is perhaps remarkable that it remains true for even simple devices, such as a packaged, pigtailed traveling-wave modulator. The ultimate success of electro-optic polymers will be their use in cost-effective products that are used by systems designers. 

Nonvolatile FeRAM devices ntilize either PZT or SET derivatives. In low density memory FeRAM prodncts, CSD is frequently nsed as the deposition method. For high-density 4- or 32-Mbit FeRAM prototypes, CSD is still used by industry to fabricate ferroelectric PZT thin-fihn capacitors, although gas phase methods like MOCVD have advantages due to the potential for conformal coverage of small three-dimensional strnctures. 

The structural materials that conform the cantilevers can have intrinsic stresses and stress gradients because of the fabrication processes. These can change the mechanical performance of the microcantilevers. If stresses and stress gradients are high, they must be previously measured by using specific test structures and their values should be included in the simulations. As monocrystalline silicon will be used in the fabrication of our devices, these stresses can be neglected. 

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