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Cofired multilayer ceramic technology

W. A. Vitriol andj. I. Steiaberg, "Development of a Low Fire Cofired Multilayer Ceramic Technology," 1983, pp. 593—598. [Pg.316]

Cofired Multilayer Ceramic. Cofired multilayer ceramic technology (Figure 13) is used to fabricate most ceramic SCPs (ceramic DIPs,... [Pg.477]

William A. Vitriol and Jerry 1. Steinberg, Development of a low temperature cofired multilayer ceramic technology, ISHM Proceedings, 1983, pp. 593-598. [Pg.284]

R. G. Pond and W. A. Vitriol, Custom Packaging in a Thick Film House Using Low Temperature Cofired Multilayer Ceramic Technology, Proc. 1984 Int. Symp. on Microelectronics, 1984, pp. 268-271. [Pg.61]

Fig. 9. Monolithic multilayer ceramics (MMCs) derived from multilayer capacitor, high temperature cofire, and thick film technologies. Fig. 9. Monolithic multilayer ceramics (MMCs) derived from multilayer capacitor, high temperature cofire, and thick film technologies.
The most advanced implementation of cofired-ceramic-packaging technology is the thermal conduction module (TCM) used in large-scale computers (IBM) (4, 72, 74). This package can accommodate over 100 flip-chip-bonded ICs on a 90 by 90 mm cofired ceramic substrate. The multilayer ceramic substrate contains 33 metal layers for chip pad redistribution, signal interconnection, and power distribution (Figure 14). Each chip contains 120 bonding pads, and 1800 pins are brazed to the bottom of the substrate for connection to a PWB. [Pg.479]

The original multilayered ceramic packages were developed around what is today known as a high-temperature cofired ceramic (HTCC). In this technology the ceramic was primarily an alumina-based... [Pg.211]

Master, R.N., Herron, L.W., and Tummala, R.R., Cofiring process for glass-ceramic/ copper multilayer ceramic substrate, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 14, 780-783, December 1991. [Pg.58]

The development of multilayer ceramics was first demonstrated in the preparation of capacitors in the late 1940s [1]. Over the following 10 years, the techniques necessary to produce multilayer high-temperature cofired ceramics (HTCC) substrates [2] were developed at American Lava and RCA, culminating in the first comprehensive description of this technology in 1961... [Pg.236]

Multilayered Low Temperature Cofired Ceramics (LTCC) Technology... [Pg.232]

Imanaka, Y. (2005). Multilayered Low Temperature Cofired Ceramics (LTCC) Technology, Springer, New York. [Pg.336]

See other pages where Cofired multilayer ceramic technology is mentioned: [Pg.316]    [Pg.316]    [Pg.475]    [Pg.480]    [Pg.277]    [Pg.159]    [Pg.342]    [Pg.1262]    [Pg.278]    [Pg.392]    [Pg.2]    [Pg.158]    [Pg.62]    [Pg.164]    [Pg.167]    [Pg.211]    [Pg.321]    [Pg.159]    [Pg.297]   


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