Cooling immersion

Fig. 2.6 Typical heat transfer regimes for immersion cooling with a fluorocarbon. Reprinted from Simons (1996) with permission...

Shih JC, Ho C-M, Liu J, Tai Y-C (1996) Monatomic and polyatomic gas flow through uniform microchannels. Microelectromech Syst (MEMS) DSC 59 197-203 Simons RE (1996) Direct liquid immersion cooling for high power density microelectronics. Electron Cooling 2(2) 7-12... 

Heat Dissipation. The very high power densities resulting from increased circuit density and speed require innovative approaches for dissipating heat, such as heat pipes (160, 161), immersion cooling (64-66), or structures such as microchannels (162, 163) or microcapillaries (163-165) etched into the substrate or fabricated internally within a cofired ceramic substrate (166). 

Natural convection (finned heat sinks, ventilation slots, liquid immersion cooling)... 

Incropera, F.P., Liquid Immersion Cooling of Electronic Components, Heat Transfer in Electronic and Microelectronic Equipment, Ed. A. E. Bergles, pp. 407-444, Hemisphere Publishing Corporation, 1990. 

E. Baker, Liquid Immersion Cooling of Small Electronic Devices, Microelectronics and Reliability (12) 163-173, 1973. 

Radioactive material packagings are designed to deal with many factors temperature variation, shielding, contamination, containment systems, pressure relief, absorbents, corrosion, moisture, heat buildup, water and snow immersion, cooling systems, critical mass, mechanical and structural integrity, etc. There are three main types ... 

Yokouchi, K., Kamehara, N., and Niwa, K. 1987. Immersion Cooling for High-Density Packaging. IEEE Trans. Comp., Hybrids, and Manuf Technol. 10(4) 643-646. 

In immersion cooling, the high-heat-flux component or subsystem is totally immersed in a dielectric fluid such as Freon (a registered trademark of E.I. duPont de Nemours Co.) or a fluorocarbon. The main requirements of the fluid are chemical compatibility with the electronics and heat transfer characteristics. 

Whitenack, K., Demystifying Cold Plates, in Electronic Products, 2003, pp. 35-36. 27. Simmons, R.E., Direct Liquid Immersion Cooling for High-Power Density Microelectronics, in ElectronicsCooUng, 1996. 

The fluidized bed reactor with immersed cooling tubes. 

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