High-temperature cofired ceramics packages

The original multilayered ceramic packages were developed around what is today known as a high-temperature cofired ceramic (HTCC). In this technology the ceramic was primarily an alumina-based... 

High-temperature cofired ceramic (HTCC) packages make use of thermal vias in the same manner as in multilayer thick-film substrates. The via-fill material used in HTCC packages is a refractory material such as tungsten or moly-manganese. 

Copper can be plated on the surface conductors of both high-temperature cofired ceramic (HTCC) and low-temperature cofired ceramic (LTCC) packages and substrates. On internal layers, on HTCC, the conductors must be composed of high-resistivity refractory metallization. 

As it is comparatively easy to combine Low Temperature Cofired Ceramics (LTCC) with materials that have different characteristics, it is possible to integrate and build the different types of components into the ceramic. Furthermore, while it is possible to incorporate low loss metal into LTCCs as a conductor, ceramic has low dielectric loss at high frequencies making it effective for achieving low loss performance, compared with other materials such as resin and the like. In addition, its thermal expansion coefficient compared with resin materials and other ceramic materials is low, and it has the merit of excellent connection reliability for high density packaging of LSI components. For these reasons, LTCCs are regarded as a... 

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