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Chemical copolymers Phenolic resins

Binders are macromolecular products with a molecular mass between 500 and ca. 30000. The higher molecular mass products include cellulose nitrate and polyacrylate and vinyl chloride copolymers, which are suitable for physical film formation. The low molecular mass products include alkyd resins, phenolic resins, polyisocyanates, and epoxy resins. To produce acceptable films, these binders must be chemically hardened after application to the substrate to produce high molecular mass cross-linked macromolecules. [Pg.3]

Tetrafluoroethylene/propylene copolymer molding resins, phenolic food-contact Acetaldehyde m-Cresol moldings, building industry Calcium sulfate hemihydrate moldings, chemical-resistant Tetrafluoroethylene/perfluoro (propyl vinyl ether) copolymer... [Pg.5474]

C-NMR spectroscopy was used extensively to investigate the chemical structures of phenolic resins (11,15-18) and related model compounds (17-19). These studies provided useful information on the complex chemical structure of PF resins. C-NMR spectroscopy was also used to study the chemical structure and to determine the copolymer composition of novolac resins prepared from 2-methylphenol, 3-methylphenol or 4-methylphenol (20,21) or from mixtures of... [Pg.175]

Epoxy and phenolic resins can be blended to provide linings with a cross-linked copolymer that shows the characteristics of both polymers. Epoxy-phenolic linings are air cured with good chemical and temperature resistance and are more easily repaired than phenolics. However, they do not have the comparable solvent resistance. [Pg.16]

Figure 17 provides an overview of the function of the diazoquinone/novolac materials. The matrix resin is a copolymer of a phenol and formaldehyde. The generic term for this class of polymers is novolac (18) meaning "new lacquer" and describes the purpose for which they were first developed. The chemical industry produces millions of tons of novolac each year where its end use is that of a thermoset resin and adhesive. Novolac is commonly used, for example, as the principle adhesive in the manufacture of plywood. [Pg.112]

Spent resins are generally compatible with the polymer matrix material. Generally, the polymer and the resin do not interact chemically. The immobilization of spent ion-exchange resins in polymers is a common application all over the world. Epoxy resins, polyesters, polyethylene, polystyrene and copolymers, polyurethane, phenol-formaldehyde, and polystyrene are among the polymers used (IAEA, 1988). Inorganic materials are generally not immobilized using polymers because they are more acceptable to other immobilization matrices such as cement. [Pg.352]

The Surlyn A ionomers (E. I. du Pont de Nemours Co.) are believed to be derived from copolymers of ethylene with minor amounts of methacrylic acid which are treated subsequently, so that substantial amounts of the carboxylic acid are converted to the sodium or other metal carboxylate. Resins similar to the one studied in this work contain about 10 weight % methacrylic acid. The ash (sodium carbonate) indicates about 40% neutralization. This resin, which contains 0.05% Santo-white Powder (Monsanto Chemical Co.), a phenolic antioxidant, is of medium molecular weight—i.e., probably corresponding to an ethylene homopolymer with a melt flow index around 20 (17). The molecular weight distribution is broad (17). [Pg.152]

OTHER COMMENTS used in the manufacture of plastics and synthetic rubber used as an insulating agent used in the manufacture of styrenated polyester, rubber-modified polystyrene, and copolymer resins used as a monomer for straight polystyrene chemical intermediate for styrenated phenols and styrene oxide used as a synthetic flavoring substance, e.g. for ice cream and candy also used to make paints.. [Pg.912]

Work continues by different organizations using different resins and compounds in the RP bipolar plates such as sulfonated copolymers, vinyl ester, phenolic, and fluoropolymer to provide high conductivity and mechanical properties without carbonization and/or graphitization resulting in lower cost. Latest commercial developments use highly conductive RP compounds for key components because they offer a cost-effective alternative that meets demanding chemical, electrical, mechanical, and physical requirements. [Pg.1030]


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