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Ceramic modules

Such ceramic hollow hbers can be assembled in fully ceramic modules of a thousand hbers exhibiting surfaceivolume rahos of about 2 m L-1. Different types of mesoporous, microporous, or dense separative layers have been deposited usually on the outer surface of macroporous hoUow hbers using y-alumina, ... [Pg.475]

T. Imasaka, N. Kanekuni, H. So and S. Yoshino, Gas-liquid two-phase cross-flow filtration by ceramic modules. Kagaku Kogaku Ronbunshu, 15 (1989) 638-644. [Pg.638]

A very general question within this modular concept is the choice of circuit board and connection technology. Each pathway in Figure 5.8.7 corresponds to a possible way of building a sensor. Metal packages can be welded directly onto metal inlay parts, and ceramic modules can be directly bonded. All the illustrated modules contain a printed circuit board (PCB). [Pg.199]

Lu, Z., Wang, G., Roohani-Esfahani, I., Dunstan, C.R., and Zreiqat, H. (2014) Baghdadite ceramics modulate the crosstalk between human adipose stem cells and osteoblasts for bone regeneration. Tissue Eng. A, 20 (5-6), 992-1002. [Pg.66]

Ceramic module and vibrating/rotating module costs reduced to U.S. 400/m. ... [Pg.332]

After preparation, the ceramic modules were introduced in the manufacturing chain of Aluminium die casting. [Pg.11]

Figure VIII 9. Cross section of a monolithic ceramic module... Figure VIII 9. Cross section of a monolithic ceramic module...
Filter (US Filter, 2002). Each ceramic module integrates 19 channels 1.02 m long with a diameter of 4 mm for a total area of 0.24m. Recommended maximum pressure and crossflow velocity are 10(X) kPa and 3 m/s, respectively. It is assumed that the batch size is 5000 L and that the plant capacity is at least 1000 L/h. The feed concentration is 5 g/L and the product must have a concentration of 50 g/L. [Pg.152]

B. T. Clark and Y. M. HUl, IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density , IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-3, No. I, March, (1980), pp. 89-93. [Pg.80]

W. W. Koste, Electron Beam Processing of Interconnection Structures in Multilayer Ceramic Modules, Metall. Trans., Vol. 2, No. 3, (1971), pp. 729. [Pg.165]

IBM Corporation, which had used an alumina cofired ceramic modules in its System 360 in the early 1980s, developed an LTCC system to replace the alumina-based system. The history of this development is well documented in Ref. 31. Salient features of the IBM system are as follows ... [Pg.39]

After the drying process, the YSZhoUow fiber with Pd/Ag membrane was unwrapped and assembled into a tubular ceramic module. Oxidation of the xerogel formed during the drying process was carried out in a tubular furnace. The temperature was increased from room temperature to 400°C at a rate of 5°C and held for 1 h. An air flow was introduced into the lumen to complete the oxidation process, and argon was introduced on the outer surface of the Pd/Ag membrane throughout this process to prevent oxidation of the Pd/Ag membrane, which may cause the formation of pin-holes. [Pg.362]


See other pages where Ceramic modules is mentioned: [Pg.285]    [Pg.196]    [Pg.155]    [Pg.24]    [Pg.621]    [Pg.156]    [Pg.299]    [Pg.66]    [Pg.12]    [Pg.281]    [Pg.281]    [Pg.288]    [Pg.289]    [Pg.470]    [Pg.868]    [Pg.714]    [Pg.263]   
See also in sourсe #XX -- [ Pg.196 ]




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