4,4 - -bisphenol Modified phenolic resin

Furfuryl alcohol phenolic resin comonomer Bisphenol A phenolic resin mfg. p-t-Amylphenol Tall oil rosin phenolic resin modifier Cumyl phenol Fumaric acid phenolic resins Phenol... 

Neither alcohol-soluble spirit Novolaks nor plasticized phenolic resins dissolve in dry-hardening oils such as linseed oil, however. The first step in this direction was achieved by the combination of phenolic resin with ester gum, i.e., abietic acid (the main component of colophonium or rosin) esterified with glycerine. These modified phenol resins or oleoresinous phenolics dry better than copal-linseed oil resins. Even better elasticized phenolic resins were developed by introducing new groups into the basic components. When bisphenol A (see Chapter 26) is used as a phenolic component, both the solubility in dry-hardening oils and the resistance to yellowing are improved. 

Bisphenol A diglycidyl ether [1675-54-3] reacts readily with methacrylic acid [71-49-4] in the presence of benzyl dimethyl amine catalyst to produce bisphenol epoxy dimethacrylate resins known commercially as vinyl esters. The resins display beneficial tensile properties that provide enhanced stmctural performance, especially in filament-wound glass-reinforced composites. The resins can be modified extensively to alter properties by extending the diepoxide with bisphenol A, phenol novolak, or carboxyl-terrninated mbbers. 

In addition to electrical uses, epoxy casting resins are utilized in the manufacture of tools, ie, contact and match molds, stretch blocks, vacuum-forrning tools, and foundry patterns, as weU as bench tops and kitchen sinks. Systems consist of a gel-coat formulation designed to form a thin coating over the pattern which provides a perfect reproduction of the pattern detail. This is backed by a heavily filled epoxy system which also incorporates fiber reinforcements to give the tool its strength. For moderate temperature service, a Hquid bisphenol A epoxy resin with an aHphatic amine is used. For higher temperature service, a modified system based on an epoxy phenol novolak and an aromatic diamine hardener may be used. 

Substituted phenols such as cresols, p-fcrf-butylphenol, / -phcnylphenol, resorcinol, and cardanol (derived from cashew nut shells) have also been used as precursors for phenolic resins. Alkylphenols with at least three carbons in the substituent lead to more hydrophobic phenolic resins that are compatible with many oils, natural resins, and rubbers.7 Such alkylphenolic resins are used as modifying and crosslinking agents for oil varnishes, as coatings and printing inks, and as antioxidants and stabilizers. Bisphenol-A (2,2-p-hydroxyphenylpropane),... 

Diphenolic acid, the condensation product of levulinic acid and phenol, is useful in the preparation of modified phenol-formaldehyde resins, polyether resins, or as monocarboxylic acid chain stoppers in alkyd resins (152). It can be substituted for bisphenol-A, the primary raw material in the production of epoxy resins (153). 

Epoxy, bisphenol A Epoxy, bisphenol F Epoxy resin Ethylene/propylene/dicyclopentadiene terpolymer Ethylene-propylene-ethyl idene norbomene Glycidyl neodecanoate PEG-4 dimethacrylate 3-(n-Pentadecyl) phenol Saccharin sodium anhydrous Saccharin sodium dihydrate Sodium-4-chlorophthalate resin modifier, adhesive coating elastomer Glyceryl hydrogenated rosinate resin modifier, adhesive coating film-formers Glyceryl hydrogenated rosinate resin modifier, adhesives... 

Materials. The polymers used were ABS blended with bisphenol A/phosgen resin terminated with p-tertiary butyl phenol (ABSPC), a blend of modified PC (minimum 70%), bisphenol A PC (maximum 30%), and n thylene chloride (less than 3 ppm) (PC), unfilled PP (UPP), and PP filled with 30% glassfiber and mineral (FPP). All materials were injection molded into 0.3x3.2x7.2 cm plaques with the mold gated at the center of the 3.2 cm side. Test specimens were machined fi om these plaques. The lower specimen was 0.3x1.6x7.2 cm while the upper specimen was 0.3x0.64x0.64 cm. The upper specimen had a hemispherical cavity msK hined in the upper surfoce to form a self aligning bearing with the loading bail which transmitted the normal load to the interfoce and the fiction force to a transducer. 

Bisphenol A is produced by the condensation reaction of excess phenol with acetone in the presence of an acidic catalyst. Sulfur compounds that may be used as a cocatalyst include alkyl mercaptans, such as methyl mercaptan, ethyl mercaptan and thioglycol acid. Recently, a catalyst composed of an acid-type ion exchange resin, which is modified in part with a sulfur-... 

Dimethylaminomethyl phenol Epoxy, bisphenol A encapsulation modifier Alkyl (C12-14) glycidyl ether encapsulation, elec, parts Epoxy resin... 

Vinyl esters are thermosetting resins that consist of a polymer backbone with an acrylate or methacrylate termination. The backbone component of vinyl ester resins can be derived from epoxide, polyester or urethane but those based on epoxide resins have most commercial significance. Bisphenol A epoxy formed vinyl esters were designed for chemical resistance and commonly formulated for viscosity for use in filament winding of chemical containers. Typically styrene is used as a reactive dilutent to modify viscosity. Phenolic novolac epoxies are used to produce vinyl esters with higher temperature capability and good solvent resistance, particularly in corrosive environments, and their FRP composites have demonstrated initial economy and better life cycle costs compared with metals. 

The compositions containing the bisphenol A-based epoxy resins and the phenolformaldehyde oligomers or dicyandiamide as the hardeners and the alcoholates of aluminum or sodium as the modifiers possessed excellent adhesion to the metals and, moreover, improved film-forming properties [266-269]. Sodium phenolate, aluminum trichloride, the hydroxides of the alkali and alkaline earth metals [270-274] and their halogenides [100,275,276] as well as the metal carboxilates [233,274,277-280] were used as the catalysts of the curing of epoxy oligomers with dicyandiamide, polyphenols, and polyalcohols. 

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