Bismaleimide triazine resin

Keywords. Cyanate ester, Polycyanurates, Phenolic-triazine, Polymer matrix composite, Cure kinetics, Polymer blends, Cyanate-epoxy blend, Bismaleimide-triazine resins, Aerospace structure... 

Ji Lifu, Gu Aijuan, Liang Guozheng, and Ynan Li. Novel modification of bismaleimide-triazine resin by reactive hyperbranched polysiloxane. J. Mater. Sci. 45 no. 7 (2010) 1859-1865. 

Zeng Xiaoliang, Yu Shuhui, and Sun Rong. Thermal behavior and dielectric property analysis of boron nitride-filled bismaleimide-triazine resin composites. J. Appl. Polym. Sci. 128 no. 3 (2013) 1353-1359. 

Polyimide and polyamide-type engineering plastics 107 Bismaleimide triazine resin BT resin... 

The majority of base materials for circuit boards are combinations of a copper foil with a laminate, where the laminate itself consists of a carrier material and a resin. Thus properties of the base material such as mechanical strength, dimensional stability, and processi-bility are determined primarily by the carrier material. On the other hand, the resin materials are responsible for the thermomechanical and electrical properties as well as for its resistance against chemicals and moisture. Frequently used carrier materials are based on glass and carbon fibers, papers, and polyamide, whereas the majority of the laminating resins are thermosets such as epoxies, phenolics, cyanates, bismaleimide triazine (BT) resins, maleimides, and various combinations of these [13]. 

Mitsubishi Gas Chemical Company Inc. market BT Resin, a blend of a bismaleimide (BMI) and a triazine resin, cured by heating alone or with a zinc octoate, zinc octoate/ triethylene diamine, or zinc octoate/A,A-dimethylbenzylamine catalyst system. 

Many matrix choices are available, and each type has an impact on the processing techniques, physical and mechanical properties, and enviromnental resistance of the finished part. Thermoplastic and thermoset materials can be resin matrices. Thermoplastic matrices have been developed to increase hot/wet use temperature and the fracture toughness of composites. Thermosetting resins, however, are more common. The common thermoset matrices for composites include polyester and vinyl esters, epoxy, bismaleimide, polyimide, and cyanate ester and phenolic triazine resins. 

Mitsubishi Gas Chemical (7) has developed a family of products which are stated to be a coreactive blend of triazine resin (terminology used to describe bisphenol A dicyanate and its prepolymers) and a bismaleimide resin. Properties of these resins are described in patents (8) and product literature (7). End uses suggested include electronic encapsulation, printed wiring board and structural composites. 

Interpenetrating polymer networks (IPNs) have been the subject of extensive study since their advent in the 1960s. The IPN is a combination of two polymers in network form, at least one of which is synthesized and/or cross-linked in the immediale presence of the other. In this section, we will refer to the research in recent years on the IPN or semi-IPN based on BMI. A special class that is part of the IPN network is made up of the bismaleimide-triazine (BT) resins based on BMI and dicyanate ester (CE), which has many attractive properties such as very good thermal stability, moisture resistance, low dielectric constant, and low dielectric loss. The cure mechanism of their blends was highly controversial and sometimes conflicting, and all research done on this subject until the year 2006 led to the conclusion that CE... 

Epoxy resin-based laminates are the workhorse of virtually all consumer and commercial electronic products. There are several variations of this pervasive laminate family, each developed to answer a special need. Among these are standard FR-4, multifunctional epoxy, difunctional epoxy, tetrafunctional epoxy, and BT or bismaleimide triazine blends. Each of these was developed to answer the need for a resin with a successively higher Tg or glass transition temperature. Multifunctional epoxy is the most commonly used form. 

Similar hybrid thermosets consisting of bismaleimide resins mixed with bisphenol A dicyanate ester have been commercially available (BT resin, Mitsubishi gas chemical). The presence of cross-linked triazine ether network in the matrix of bismaleimide crosslinked network is believed to improve the toughness, reduce the moisture sensitivity and improve the dielectric properties of the bismaleimide thermoset without a sacrifice in heat resistance. 

Blends of bismaleimide (B) and triazine (T) resins, primarily for printed circuit board applications... 

Resins (matrices). The available resins are polyester and vinyl esters, polyureas, epoxy, bismaleimides, polyimides, cyanate ester, and phenyl triazine. 

The common commercially available fibers used in composites are fiberglass, graphite (carbon), aramid, polyethylene, boron, silicon carbide, and other ceramics such as silicon nitride, alumina, and alumina silica. Many matrix choices are available, both thermosetting and thermoplastic. Each type has an impact on the processing technique, physical properties, and environmental resistance of the finished composite. The most common resin matrices include polyester, vinyl esters, epoxy, bismaleimides, polyimides, cyanate ester, and triazine. 

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