Applications chip-scale packages

Kada M, Smith L. Advancements in stacked chip scale packaging (S-CSP), provides system-in-a-package functionality for wireless and handheld applications. Proceedings of Pan Pacific Microelectronics Symposium Conference 2000. p 1-7. 

Table 5.11 Examples of Chip-Scale Packages, SuppUeis, and Applications... 

J. H. Lau and S. W. Ricky Lee, Chip Scale Packaging Design, Materials, Processes, and Applications, McGraw-Hill, New York, 1999. 

In mobile phone applications, where chip scale packages (CSPs) are commonly employed, low-CTE non-woven aramid reinforcement extends solder joint life as much as three times over FR-4 and resin-coated foil (RCF). After more than 1,000 thermal cycles ( 0 to -tl25°C), non-woven aramid-reinforced epoxy resin does not crack, as is common with nonreinforced dielectrics. 

W. Lee, L. Nguyen, and G. Selvaduray, Solder Joint Fatigue Models Review and Applicability to Chip Scale Packages, Microelectronics Reliability, Vol 40,2000, p 231-244... 

Elenius, P. Yeh, S. Lead-free solder for flip chip and chip scale packaging (CSP) applications. IPCWorks 99 Minneapolis, MN, October 1999 1-6 S-03-2. 

C-N thin films could be an attractive diamond-like coating material for thermal management in multi-chip modules and micro-scale devices [35]. The field-emission properties of C-N thin films were studied, and indicated an enhancement in the emitted current density [36]. It has been predicted that this material would, as a consequence, have a wide range of potential applications, such as in electronic packaging and wear protective coatings for magnetic storage devices [37]. 

Uddin, A., Milaninia, K., Chen, C. H., and Theogarajan, L. 2011. Wafer scale integration of CMOS chips for biomedical applications via self-aligned masking. IEEE Trans. Compon., Packag., Manuf. Technol. 1 1996-2004. 

---