Thermal conductivity Alumina

We consider shaping in Chapter 23, but mention some additional features here. The method used depends on the material. Either brute force or a plasticizer should be used. The classic example is pottery—we mold the clay. Then we have the alumina thermal conduction module (TCM), cordierite honeycombs, Si3N4 fishhooks, and carbide blades for kitchen knives. 

Calculate the thermal conductivity of 35% (by volume) non-Newtonian suspensions of alumina (thermal conductivity = 30 W/mK) and thorium oxide (thermal conductivity = 14.2 W/mK) in water and in carbon tetra chloride at 293 K. 

Various material properties (e. g. thermal diffiisivity, air permeability) have been determined for WHIPOX CMCs. Reliable data are important for potential applications such as thermal insulators, filters or burners. Thermal conductivity perpendicular to fiber orientation is about IW/mK. Closer inspection reveals lower conductivity if a mullite matrix is employed instead of alumina. Thermal conductivity in fiber direction, on the other hand, is about three times higher as perpendicular to the fiber direction, reflecting the non-isotropic structure of the composite (Figure 11). 

K2 (W/m.K) - alumina thermal conductivity Gaussian Mean = 35 Standard dev = 0.05 mean... 

The interelectrode insulators, an integral part of the electrode wall stmcture, are required to stand off interelectrode voltages and resist attack by slag. Well cooled, by contact with neighboring copper electrodes, thin insulators have proven to be very effective, particularly those made of alumina or boron nitride. Alumina is cheaper and also provides good anchoring points for the slag layer. Boron nitride has superior thermal conductivity and thermal shock resistance. 

Alumina, or aluminum oxide [1344-28-17, has a thermal conductivity 20 times higher than that of most oxides (5). The flexural strength of commercial high alumina ceramics is two to four times greater than those of most oxide ceramics. The drawbacks of alumina ceramics are their relatively high thermal expansion compared to the chip material (siUcon) and their moderately high dielectric constant. 

Although beryllium oxide [1304-56-9] is in many ways superior to most commonly used alumina-based ceramics, the principal drawback of beryUia-based ceramics is their toxicity thus they should be handled with care. The thermal conductivity of beryUia is roughly about 10 times that of commonly used alumina-based materials (5). BeryUia [1304-56-9] has a lower dielectric constant, a lower coefficient of thermal expansion, and slightly less strength than alumina. Aluminum nitride materials have begun to appear as alternatives to beryUia. Aluminum nitride [24304-00-5] has a thermal conductivity comparable to that of beryUia, but deteriorates less with temperature the thermal conductivity of aluminum nitride can, theoreticaUy, be raised to over 300 W/(m-K) (6). The dielectric constant of aluminum nitride is comparable to that of alumina, but the coefficient of thermal expansion is lower. 

Fig. 3. Effect of density on thermal conductivity. A, 48-mg/cm siUca fiber B, 96-mg/cm siUca fiber C, 128-mg/cm alumina—siUca fiber D, 192-mg/cm ...

Gas Chromatography. Gas chromatography is a well recognised method for the analysis of H—D—T mixtures. The substrate is alumina, AI2O2, coated with ferric oxide, Fe202. Neon is used as the carrier gas. Detectors are usually both thermal conductivity (caratherometer) and ion chamber detectors when tritium is involved (see Chromatography). 

Finally, it is to be expected that the evaporation coefficient of a very stable compound, such as alumina, which has a large heat of sublimation resulting from the decomposition into the elements, will be low. Since the heat of evaporation must be drawn from the surface, in die case of a substance widr a low thermal conductivity such as an oxide, the resultant cooling of the surface may lead to a temperature gradient in and immediately below the surface. This will lower die evaporation rate compared to that which is calculated from the apparent, bulk, temperature of the evaporating sample as observed by optical pyromeuy, and thus lead to an apparently low free surface vaporization coefficient. This is probably die case in the evaporation of alumina in a vacuum. 

For certain products, skill is required to estimate a product s performance under steady-state heat-flow conditions, especially those made of RPs (Fig. 7-19). The method and repeatability of the processing technique can have a significant effect. In general, thermal conductivity is low for plastics and the plastic s structure does not alter its value significantly. To increase it the usual approach is to add metallic fillers, glass fibers, or electrically insulating fillers such as alumina. Foaming can be used to decrease thermal conductivity. 

Thermal conductivities of two porous catalytic particles are nickel-tungsten, 0.47 W/(m)0C), platinum-alumina, 0.22 (Satterfield, Heterogeneous Catalysis in Practice, 1980). 

Figure 5.6. Typical geometry of a thermal conductivity detector cell. The feedthroughs supporting the axial filament are insulated from the stainless steel body by alumina ceramic. All dimensions are in centimeters. ...

We assume that the adsorbent mass used in the kinetic test consists of a sphere of radius R. It may be composed of several microsize particles (such as zeolite crystals) bonded together as in a commercial zeolite bead or simply an assemblage of the microparticles. It may also be composed of a noncrystalline material such as gels or aluminas or activated carbons. The resistance to mass transfer may occur at the surface of the sphere or at the surface of each microparticle. The heat transfer inside the adsorbent mass is controlled by its effective thermal conductivity. Each microparticle is at a uniform temperature dependent on time and its position in the sphere. 

Collin, K.M., Rowcliffe, D.J. (2001), Influence of thermal conductivity and fracture toughness on the thermal shork resistance of alumina-silicon-carbide-whisker compositer Journal of the American Ceramic Society, 84(6), 1334—1340. 

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