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Wafer Mounting

Wafer Mounting The wafer should be mounted parallel to the pad surface. Proper wafer mounting design may account for wafer curvature or wafer thickness variations. Wafer mounting may also affect slurry transport. [Pg.46]

Wafer Mounting Deformed Wafer After Polish... [Pg.116]

Wafer Mounting After Polish Wafer Demount... [Pg.116]

However, SHM applications of the curvature-modes method requires the use of in situ sensing instead of the SLDV approach. Harney et al. [73] describe the use of surface-mounted flexible piezo sensors made of polyvinylidene fluoride placed at 16 locations on a cross-ply CFRP beam. Vibration excitation was done with a piezoceramic wafer mounted at end of the beam energized by a sine signal swept up to 2 kHz. Various damages were applied on separate specimens (saw-cut notches delaminations simulated by Teflon inserts impact). A set of pristine specimens were used to constract a baseline database of curvature modes. Subsequently, data were taken on the damaged beams. Further processing of these experimental results was done in Lestari et al. [74]. The method showed promise although the experimental data suffered from considerable scatter. [Pg.486]

Figure 1 shows a double-cell arrangement used to anodize single wafers up to 150 mm in diameter. Comprised of two cell halves (each with a large area integrated electrode) clamped together with the wafer mounted between the two, electroljhe from two (vented) reservoirs supplies each cell half and is pumped continuously during anodization. [Pg.562]

Available in wafer design for mounting between flanges. [Pg.436]

Objekt-sucher, m. (Optics) object finder, -tisch, m. (Micros.) stage, stand, -trager, m. (Micros.) slide, mount, also stage, stand. Oblate,/, wafer. [Pg.324]

Despite its smaller cross section, the other nuclear reaction used for deuterium analysis, the (2H,p) reaction, can be made extremely sensitive, as Myers (1987) has shown. The key is that the proton is emitted with such high energy, 15 MeV, that the detector can be mounted behind the sample wafer (Fig. 1) ensuring a very low background count rate and hence good sensitivity. Myers measured deuterium amounts as low as 1012 atoms/cm2 in his study of deuterium uptake by Si02. However, the depth resolution of this measurement was poor, l jum. [Pg.202]

Raman samples were prepared by peeling SiNW thin films off the silicon wafers to avoid Raman signals from the silicon substrate. A razor blade was used to shave the thin films on top of the silicon wafers. The thin films were mounted on a carbon tape for SEM and Raman inspection, or on a transparent Mylar film for Raman measurements. [Pg.160]

Wafer wands, wafer transport carriers. .. Surface-mounted trimming potentiometers... Appliances handles, cooking equipment... [Pg.108]

A patterned array of goethite can be deposited from an Fe(N03)3 solution at 70 °C on an organic substrate mounted on a silicon wafer (Rieke et al., 1994). The organic surface contains a mixture of sulphonate groups (which bind the iron oxide) and nonbinding methyl groups (which permit development of a pattern). [Pg.539]

Gallium arsenide ingots are wax mounted to a graphite beam and sawed into individual wafers through the use of automatically operated inner diameter (ID) diamond blade saws. This operation is done wet with the use of lubricants and generates a gallium arsenide slurry. [Pg.345]

Wafers are wax mounted to the lapper using a hot plate, and are lapped on a machine exerting a set rotational speed and pressure. A lapping solution is fed onto the lapping surface and constitutes a slurry of aluminum oxide, glycerin and water. After a brief lapping period, the wafers are dismounted on a hot plate, rinsed in a soap solution and wiped dry. [Pg.345]

The wafers are Chen physically mounted Co a mechanical polishing machine, using a sodium bicarbonate, 5% chlorine, water and colloidal silica slurry. [Pg.348]


See other pages where Wafer Mounting is mentioned: [Pg.67]    [Pg.500]    [Pg.622]    [Pg.37]    [Pg.155]    [Pg.219]    [Pg.233]    [Pg.194]    [Pg.194]    [Pg.63]    [Pg.34]    [Pg.2942]    [Pg.67]    [Pg.500]    [Pg.622]    [Pg.37]    [Pg.155]    [Pg.219]    [Pg.233]    [Pg.194]    [Pg.194]    [Pg.63]    [Pg.34]    [Pg.2942]    [Pg.394]    [Pg.524]    [Pg.25]    [Pg.255]    [Pg.104]    [Pg.94]    [Pg.324]    [Pg.325]    [Pg.308]    [Pg.396]    [Pg.425]    [Pg.34]    [Pg.559]    [Pg.48]    [Pg.196]    [Pg.198]    [Pg.75]    [Pg.246]    [Pg.129]    [Pg.355]    [Pg.140]    [Pg.15]    [Pg.104]    [Pg.11]   
See also in sourсe #XX -- [ Pg.38 , Pg.47 , Pg.155 ]




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