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Using High Thermal Conductivity

The aluminum vacancy leads to phonon scattering because its scattering cross section, F, for phonons is large T is proportional to the relative difference in mass between the original site occupant and the new site occupant. [Pg.628]

Aluminum has an atomic weight of 27 and the vacancy has zero weight. So for our example AM/M is 1. When an N atom is replaced by O on the anion sublattice MUM = 0.1. As a result the scattering cross section is smaller. [Pg.628]

The record-high thermal conductivity of diamond makes it an obvious choice for consideration as a substrate for high power electronic devices. One method that has been successful in producing diamond films is chemical vapor deposition (CVD). The CVD diamond films are polycrystalline, but can still have k 2000Wm K . The high cost of diamond films still precludes their widespread use. [Pg.628]

We know from our everyday experiences that when we heat most materials they expand and when we cool them they contract. The linear coefficient of thermal expansion, a, indicates how much the dimensions of a solid change with temperature  [Pg.628]

FIGURE 34.9 A ceramic pin-grid-array package (96% pure AI2O3 with multilayer Au metallization. [Pg.628]


Excess heat is delivered to radiator surfaces using high thermal conductivity materials or heat transport systems. [Pg.513]

Thermal Conductivity Detector One of the earliest gas chromatography detectors, which is still widely used, is based on the mobile phase s thermal conductivity (Figure 12.21). As the mobile phase exits the column, it passes over a tungsten-rhenium wire filament. The filament s electrical resistance depends on its temperature, which, in turn, depends on the thermal conductivity of the mobile phase. Because of its high thermal conductivity, helium is the mobile phase of choice when using a thermal conductivity detector (TCD). [Pg.569]

Euture appHcations may involve use of SiC as substrates for siHcon chips, making use of the high thermal conductivity of SiC and its close thermal expansion match to siHcon. The low density and high stiffness of siHcon carbides may also result in appHcations in space. One such appHcation is for space-based mirrors, making use of the high degree of surface poHsh possible on dense SiC. [Pg.321]

Heat pipes are used to perform several important heat-transfer roles ia the chemical and closely aUied iadustries. Examples iaclude heat recovery, the isothermaliziag of processes, and spot cooling ia the mol ding of plastics. In its simplest form the heat pipe possesses the property of extremely high thermal conductance, often several hundred times that of metals. As a result, the heat pipe can produce nearly isothermal conditions making an almost ideal heat-transfer element. In another form the heat pipe can provide positive, rapid, and precise control of temperature under conditions that vary with respect to time. [Pg.511]

The third characteristic of interest grows directly from the first, ie, the high thermal conductance of the heat pipe can make possible the physical separation of the heat source and the heat consumer (heat sink). Heat pipes >100 m in length have been constmcted and shown to behave predictably (3). Separation of source and sink is especially important in those appHcations in which chemical incompatibilities exist. For example, it may be necessary to inject heat into a reaction vessel. The lowest cost source of heat may be combustion of hydrocarbon fuels. However, contact with an open flame or with the combustion products might jeopardize the desired reaction process. In such a case it might be feasible to carry heat from the flame through the wall of the reaction vessel by use of a heat pipe. [Pg.512]

Gaseous helium is commonly used as the working fluid ia closed-cycle cryogenic refrigerators because of chemical iaertness, nearly ideal behavior at all but the lowest temperatures, high heat capacity per unit mass, low viscosity, and high thermal conductivity. [Pg.16]

Because of its high modulus of elasticity, molybdenum is used in machine-tool accessories such as boring bars and grinding quills. Molybdenum metal also has good thermal-shock resistance because of its low coefficient of thermal expansion combined with high thermal conductivity. This combination accounts for its use in casting dies and in some electrical and electronic appHcations. [Pg.466]

Cases can be classified as either hermetic or nonhermetic, based on their permeabiUty to moisture. Ceramics and metals are usually used for hermetic cases, whereas plastic materials are used for nonhermetic appHcations. Cases should have good electrical insulation properties. The coefficient of thermal expansion of a particular case should closely match those of the substrate, die, and sealing materials to avoid excessive residual stresses and fatigue damage under thermal cycling loads. Moreover, since cases must provide a path for heat dissipation, high thermal conductivity is also desirable. [Pg.530]

Beryllia and Thoria. These are specialty oxides for highly specialized appHcations that require electrical resistance and high thermal conductivity. BeryUia is highly toxic and must be used with care. Both are very expensive and are used only in small quantities. [Pg.26]

Silicon carbide has very high thermal conductivity and can withstand thermal shock cycling without damage. It also is an electrical conductor and is used for electrical heating elements. Other carbides have relatively poor oxidation resistance. Under neutral or reducing conditions, several carbides have potential usehilness as technical ceramics in aerospace appHcation, eg, the carbides (qv) of B, Nb, Hf, Ta, Zr, Ti, V, Mo, and Cr. Ba, Be, Ca, and Sr carbides are hydrolyzed by water vapor. [Pg.27]

Sodium is used as a heat-transfer medium in primary and secondary cooling loops of Hquid-metal fast-breeder power reactors (5,155—157). Low neutron cross section, short half-life of the radioisotopes produced, low corrosiveness, low density, low viscosity, low melting point, high boiling point, high thermal conductivity, and low pressure make sodium systems attractive for this appHcation (40). [Pg.169]

High Temperature. The low coefficient of thermal expansion and high thermal conductivity of sihcon carbide bestow it with excellent thermal shock resistance. Combined with its outstanding corrosion resistance, it is used in heat-transfer components such as recuperator tubes, and furnace components such as thermocouple protection tubes, cmcibles, and burner components. Sihcon carbide is being used for prototype automotive gas turbine engine components such as transition ducts, combustor baffles, and pilot combustor support (145). It is also being used in the fabrication of rotors, vanes, vortex, and combustor. [Pg.468]

Refractories. Its low coefficient of expansion, high thermal conductivity, and general chemical and physical stabihty make sihcon carbide a valuable material for refractory use. Suitable apphcations for sihcon carbide refractory shapes include boiler furnace walls, checker bricks, mufflers, kiln furniture, furnace skid rails, trays for zinc purification plants, etc (see Refractories). [Pg.468]


See other pages where Using High Thermal Conductivity is mentioned: [Pg.148]    [Pg.31]    [Pg.473]    [Pg.628]    [Pg.3041]    [Pg.131]    [Pg.131]    [Pg.1866]    [Pg.628]    [Pg.148]    [Pg.31]    [Pg.473]    [Pg.628]    [Pg.3041]    [Pg.131]    [Pg.131]    [Pg.1866]    [Pg.628]    [Pg.123]    [Pg.347]    [Pg.321]    [Pg.321]    [Pg.336]    [Pg.17]    [Pg.430]    [Pg.8]    [Pg.204]    [Pg.530]    [Pg.530]    [Pg.348]    [Pg.26]    [Pg.30]    [Pg.36]    [Pg.64]    [Pg.508]    [Pg.413]    [Pg.4]    [Pg.65]    [Pg.513]    [Pg.515]    [Pg.515]    [Pg.515]    [Pg.521]    [Pg.522]    [Pg.342]    [Pg.349]   


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