Thin film deposition technologies and processing of biomaterials

City University of Hong Kong, Kowloon, Hong Kong, China [Pg.3]

CVD is a well-understood thin film deposition method that uses chemical reactions of vapor-phase precursors. CVD processes have traditionally been initiated and controlled by heat as the source of energy. An elevated deposition temperature is normally required, which restricts the types of substrates that can be used and coating materials that can be deposited, especially thermally sensitive ones (Jones and Hitchman, 2009). However, thermal energy is not the only energy supplied to the system plasmas and photons are widely used in CVD processes. Plasma-enhanced chemical vapor deposition (PECVD), or plasma-assisted CVD, is a CVD technique in which plasma in lieu of thermal energy is used primarily to activate ions and radicals in the chemical reactions leading to layer formation on the substrate. One major advantage of PECVD over [Pg.3]

Thin Film Coatings for Biomaterials and Biomedical Applications. http //dx.doi.org/10.1016/B978-l-78242-453-6.00001 8 Copyright 2016 Elsevier Ltd. All rights reserved. [Pg.3]

PECVD has been used industrially for several decades to deposit oxides and nitrides of silicon, polycrystalline silicon, and epitaxial silicon (Tedrow and Reif, 1994) for microelectronics. There are also many applications in the automotive. [Pg.4]

Plasma-induced ionic chain-growth polymerization may also occur similar to that of radicals fragment +M— P+,P+ + M— -PjJ. j. [Pg.6]

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