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Thermal substrate

Figure 5.13 Experimental setup for thermal substrate processing of hydroxyapatite (Kuroda and Okido, 2012). ( Licenced under the Creative Commens Attribution 3.0 Act.)... Figure 5.13 Experimental setup for thermal substrate processing of hydroxyapatite (Kuroda and Okido, 2012). ( Licenced under the Creative Commens Attribution 3.0 Act.)...
Figure 5.14 Microstructure of calcium phosphate coatings deposited from a solution containing 0.7 mmol CaCI2 and 0.3 mmol Ca(H2P04)2 by the thermal substrate technique. (a) Monetite (DCPA, pH 4, 150°C,... Figure 5.14 Microstructure of calcium phosphate coatings deposited from a solution containing 0.7 mmol CaCI2 and 0.3 mmol Ca(H2P04)2 by the thermal substrate technique. (a) Monetite (DCPA, pH 4, 150°C,...
Despite these promising results, there is an urgent need to improve the homogeneity, density, and, in particular adhesion of the calcium phosphate layers formed by the thermal substrate (hydroprocessing) method. [Pg.162]

Kuroda, K., Ichino, R., Okido, M., and Tokai, O. (2002a) Effect of ion concentration and pH on hydroxyapatite deposition from aqueous solution onto titanium by the thermal substrate method. Biomed. Mater. Res., 61, 354-359. [Pg.239]

Okido, M., Kuroda, K., Ishikawa, M., Ichino, R., and Takai, O. (2002) Hydroxyapatite coating on titanium by means of thermal substrate method in aqueous solutions. Solid State Ion., 151, 47 - 52. [Pg.244]

Ziani-Cherif, H., Abe, Y, Imachi, K and Matsuda, T. (2002) Hydroxyapatite coating on titanium by thermal substrate method in aqueous solution. /. Biomed. Mater. Res., 59 (2), 390- 397. [Pg.252]

For some applications, the high temperature required for rigorous mass transport limited control, or, occasionally, to a greatly reduced extent, even the lower temperature required for kinetic limited control, can induce thermal substrate damage. One potential solution to these problems is to employ alternate forms of energy input, permitting deposition at lower substrate temperatures (see Sect. 1.3.1.3). [Pg.22]

Coreactive photoinitiators seem to be promising tools to Investigate UV induced processes of ketone structures with a permanent bold to solid substrates. Under the conditions of the thermal substrate coupling (coreaction) the photoinitiator activity should t)e conserved and a subsequent photochemical cC-cleavage in the presence of a suitable monomer should initiate a polymerization process. [Pg.110]

TABLE 11.7 Thermal Properties of Common PCB Materials Glass TCE-Thermal Substrate Transition, Coefficient of Thermal Moisture... [Pg.1305]

In a reply on this note Mirbach [13] emphasized that the quantum yield of product formation only is not a sufficient criterion to identify whether a reaction belongs to the first category, here named as photoinitiated catalytic reactions. When the quantum yield of the initial photoreaction, forming the catalyst is very low, the overall quantum yield may be less than unity, although the catalyst can enter many cycles of thermal substrate conversion. Furtheron, Mirbach classified such photoreactions which need a photon to start a new cycle into three fundamentally different processes Photoassisted catalytic reactions, catalyzed photoreactions, and sensitized photoreactions. [Pg.54]

Due to the absorbed photon energy in the moment of the beam admission the particles and the substrate surface warm up very fast. As a consquence of the thermal induced stresses between the relative brittle hard particles, some particles brake apart and, because of the released impulse energy, they are ejected out of the effective beam zone, transmission... [Pg.547]

The interest in vesicles as models for cell biomembranes has led to much work on the interactions within and between lipid layers. The primary contributions to vesicle stability and curvature include those familiar to us already, the electrostatic interactions between charged head groups (Chapter V) and the van der Waals interaction between layers (Chapter VI). An additional force due to thermal fluctuations in membranes produces a steric repulsion between membranes known as the Helfrich or undulation interaction. This force has been quantified by Sackmann and co-workers using reflection interference contrast microscopy to monitor vesicles weakly adhering to a solid substrate [78]. Membrane fluctuation forces may influence the interactions between proteins embedded in them [79]. Finally, in balance with these forces, bending elasticity helps determine shape transitions [80], interactions between inclusions [81], aggregation of membrane junctions [82], and unbinding of pinched membranes [83]. Specific interactions between membrane embedded receptors add an additional complication to biomembrane behavior. These have been stud-... [Pg.549]

Cohen S R, Naaman R and Sagiv J 1986 Thermally induced disorder in organized organic monolayers on solid substrates J. Phys. Chem. 90 3054-6... [Pg.2631]

Liidemann et al., 1997] Liidemann, S. K., Carugo, O., and Wade, R. C. Substrate access to cytochrome P450cam A comparison of a thermal motion pathway analysis with moleculM dynamics simulation data. J. Mol. Model. 3 (1997) 369-374... [Pg.63]

The (thermal) decomposition of thiazol-2-yldiazonium salts in a variety of solvents at 0 C in presence of alkali generates thiazol-2-yl radicals (413). The same radicals result from the photolysis in the same solvents of 2-iodothiazole (414). Their electrophilic character is shown by their ability to attack preferentially positions of high rr-electron density of aromatic substrates in which they are generated (Fig. 1-21). The major... [Pg.111]

Thermal ionization has three distinct advantages the ability to produce mass spectra free from background interference, the ability to regulate the flow of ions by altering the filament temperature, and the possibility of changing the filament material to obtain a work function matching ionization energies. This flexibility makes thermal ionization a useful technique for the precise measurement of isotope ratios in a variety of substrates. [Pg.389]

The thermal protection system of the space shutde is composed mainly of subliming or melting ablators that are used below their fusion or vaporization reaction temperatures (42). In addition to the carbon-carbon systems discussed above, a flexible reusable surface insulation composed of Nomex felt substrate, a Du Pont polyamide fiber material, is used on a large portion of the upper surface. High and low temperature reusable surface insulation composed of siHca-based low density tiles are used on the bottom surface of the vehicle, which sees a more severe reentry heating environment than does the upper surface of the vehicle (43). [Pg.5]

Euture appHcations may involve use of SiC as substrates for siHcon chips, making use of the high thermal conductivity of SiC and its close thermal expansion match to siHcon. The low density and high stiffness of siHcon carbides may also result in appHcations in space. One such appHcation is for space-based mirrors, making use of the high degree of surface poHsh possible on dense SiC. [Pg.321]

In conventional tenter orientation, the sequence of steps is as described above (MD—TD). In some cases it is advantageous to reverse the draw order (TD—MD) or to use multiple draw steps, eg, MD—TD—MD. These other techniques are used to produce "tensilized" films, where the MD tensile properties are enhanced by further stretching. The films are generally unbalanced in properties and in extreme cases may be fibrillated to give fiber-like elements for special textile appHcations. Tensilized poly(ethylene terephthalate) is a common substrate for audio and video magnetic tape and thermal transfer tape. [Pg.381]

Synthetic Fiber and Plastics Industries. In the synthetic fibers and plastics industries, the substrate itself serves as the solvent, and the whitener is not appHed from solutions as in textiles. Table 6 Hsts the types of FWAs used in the synthetic fibers and plastic industries. In the case of synthetic fibers, such as polyamide and polyester produced by the melt-spinning process, FWAs can be added at the start or during the course of polymerization or polycondensation. However, FWAs can also be powdered onto the polymer chips prior to spinning. The above types of appHcation place severe thermal and chemical demands on FWAs. They must not interfere with the polymerization reaction and must remain stable under spinning conditions. [Pg.119]

As a tme thermoplastic, FEP copolymer can be melt-processed by extmsion and compression, injection, and blow molding. Films can be heat-bonded and sealed, vacuum-formed, and laminated to various substrates. Chemical inertness and corrosion resistance make FEP highly suitable for chemical services its dielectric and insulating properties favor it for electrical and electronic service and its low frictional properties, mechanical toughness, thermal stabiUty, and nonstick quaUty make it highly suitable for bearings and seals, high temperature components, and nonstick surfaces. [Pg.358]

Thermal—Oxidative-Resistance Coatings. The thermal stabihty of coatings produced by either covalendy or noncovalendy incorporating 2,4-dinitroaniline into an inorganic siUcate network and coating it onto a sapphire substrate has been examined (67). Although some increase in the thermal... [Pg.330]


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