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Substrate Preparation Pretreatment

As the first step in the wet processing sequence, substrates are typically cleansed of contaminants that inhibit sorption or interfere with reaction of the processing solutions used for dyeing, printing, and finishing. A wide variety of contaminants are present in raw fibers [48], As the fiber is heated or scoured, these contaminants are liberated into water and air as pollutants. Due to the massive amounts of fibers used, impurities present even in trace quantities can be important pollutants. The total polyester/cotton fiber wastes (from all sources in the United States) is estimated to be 4.5 x 10 lb annually [31]. [Pg.276]

Many natural fiber impurities present potential pollution problems, including natural waxes and oils (BOD, COD, TOC, FOG (fats, oils and grease)), metals (aquatic toxicity, treatment system inhibition), agricultural residues (aquatic toxicity) and, lubricant residues (BOD, COD, TOC, FOG). [Pg.276]

Raw cotton contains pesticides, fertilizer, and defoliants as shown in Table 7.20, and metals as shown in Table 7.21 [1]. These are removed during preparation and become part of the wastewater stream. [Pg.276]

There are many reports of environmental impacts arising from wool processing. One of the more significant is pesticide residues that are released into the wool processing wastewater during wool processing [49-51]. Wimbush reports that pentachlorophenol was found at a level as high as 100 ppm in consumer products on wool carpets, as shown in Table 7.22 [52]. [Pg.276]

The process of cotton preparation comprises singeing, desizing, scouring, and bleaching and perhaps mercerizing. Synthetic substrate preparation typically [Pg.276]


Major Aspects R arding Substrate Preparation/ Pretreatment... [Pg.6176]

Substrate and Pretreatment. Sweet corn (hybrid Lingodor) of W.H. Perron Laval, Quebec was grown in well prepared soil in a plot of 3 x 2 meters. Corn stalks were ground to 20 mesh to be used as a substrate. It was pretreated with 1.5% sodium hydroxide (NaOH) wt/vol with substraterwater ratio of 1 10 at 121 C for 60 minutes. The substrate was not washed after the pretreatment, and all the solubilized polymers (hemicelluloses and lignin) were retained along with the insoluble polymer (cellulose) in the fermentation medium. The composition of corn stalk is presented in Table 1. [Pg.305]

Almost any substrate that will be powder coated, whether metal, medium-density fiberboard (MDF) or some other material, requires some kind of surface treatment. Surface preparation ( pretreatment ) of wood and, more specifically, of MDF preparation, consists of sanding, removal of contaminants and board conditioning. MDF boards that will be coated by UV-curable powders should have moisture content of 4 to 9%. It is also a common practice to preheat MDF boards prior to application of the UV powder.37... [Pg.144]

In particular, CVD of the derivatives Cu(hfac)(PMe3),1,2 Cu(hfac)(l,5-cod),3-6 Cu(hfac)(2-butyne),7,8 and Cu(hfac)(vtms),9-12 where 1,5-cod = 1,5-cyclooctadiene and vtms = vinyltrimethylsilane, has been studied in detail. These species can be used to deposit copper films either selectively or nonselectively on various surfaces depending on the nature of the precursor, the deposition conditions, and the substrate surface pretreatment. The syntheses of these species from a general salt elimination reaction according to eq. (2) is described here in detail.10,13,15-17 It should be noted that other general methods of preparation of this class of compounds have been reported elsewhere.18... [Pg.289]

Substrate preparation. Thin films of mixed transition metal oxides were deposited by spin-coating on Si (100) tiles. Before deposition Si tiles were pretreated as follows. Square pieces (0.9 x 0.9 cm ) were first cleaned by HF (2%) dipping for 20 s to remove native oxide from its surface. After several rinsings with water (HPLC grade), the tiles were kept in water. UV/O3 treatment (Jelight s UVO-Cleaner A2, % = 254 nm) was applied to obtain a static contact angle nearing 0. [Pg.747]

In conclusion, enzyme preparations have been assayed for their activities and certain preparations have been identified as being most suitable for use in hydrolysis experiments. A lack of detailed knowledge about the nature of the substrate after pretreatment (porosity, size, insolubility, and crystallinity of the macroseopic particles) required us to follow an empirical approach in this study. Furthermore, the role of each enzyme in the crude enzyme preparations is difficult to assess but fundamental studies have pointed to each enzyme as having a complementary role in the sequential hydrolysis of lignocellulose [9]. The boost in... [Pg.286]

Various aspects of SAM formation, structure, properties, and possible applications are discussed in other chapters. The properties of a SAM of a certain composition depend on a number of parameters, such as the solvent used for self-assembly, the concentration of the adsorbing molecules, the adsorption time and temperature, and to an appreciable degree, on the properties of the substrate. The latter include the substrate type, chemical composition, morphology, preparation, pretreatment, and cleanliness. [Pg.6175]

In all cases, the aluminium substrates are pretreated using conventional chromic acid anodising techniques, often this is augmented with the application of a pretreatment protection primer. The carbon composites use peel ply techniques to prepare the surfaces for bonding. [Pg.311]

SAM is a technique that can sample extremely small volumes of material (probably the smallest of any technique without the need for extensive sample preparation) and for this reason the choice of sample and the manner in which the analysis is carried out is extremely important. As with any electron microscopy-based analysis method, the need to acquire data from a representative sample of the specimen must be uppermost in the mind of the analyst. As SAM is an electron beam technique it is really only applicable to conductors or semiconductors, a useful guide being that if the specimen can be imaged in an SEM without sample charging SAM will be possible. For these reasons the role of AES/SAM in adhesion studies is restricted to the analysis of metallic substrates and pretreatment layers. There are ways in which it is possible to apply the technique to insulators (Baer et al. 2010) but analysis of polymers by AES is not practicable the usual approach being to use XPS or ToF-SIMS. [Pg.201]

Substrate Properties. It is clear from equation 5 that higher hardness of the substrate lowers friction. Wear rate of the film also is generally lower. Phosphate undercoats on steel considerably improve wear life of bonded coatings by providing a porous surface which holds reserve lubricant. The same is tme for surfaces that are vapor- or sandblasted prior to appHcation of the soHd-film lubricant. A number of typical surface pretreatments are given in Table 13 to prepare a surface for solid-film bonding (61). [Pg.251]

Adhesion of copper films to PMDA/ODA polyimide was determined by peel tests conducted on samples that were prepared by vapor-depositing a thin layer of copper onto the polyimide and then building the thickness of the metal layer to about 18 p,m by electrodeposition of copper. Results of the adhesion measurements correlated well with substrate pretreatment. When the substrate... [Pg.277]

The hydride phase may be present in a catalyst as a result of the method of its preparation (e.g. hydrogen pretreatment), or it may be formed during the course of a given reaction, when a metal catalyst is absorbing hydrogen (substrate—e.g. in H atom recombination product—e.g. in HCOOH decomposition). The spontaneous in situ transformation of a metal catalyst (at least in its superficial layer) into a hydride phase is to be expected particularly when the thermodynamic conditions are favorable. [Pg.286]

Initial bond strength depended heavily upon substrate type rather than surface preparation. Regardless of pretreatment, initial bond strength was highest when using Al-Tl adherends and lowest when the adherends were galvanized steel. [Pg.193]


See other pages where Substrate Preparation Pretreatment is mentioned: [Pg.276]    [Pg.279]    [Pg.281]    [Pg.276]    [Pg.279]    [Pg.281]    [Pg.16]    [Pg.368]    [Pg.57]    [Pg.243]    [Pg.90]    [Pg.6077]    [Pg.137]    [Pg.470]    [Pg.175]    [Pg.449]    [Pg.438]    [Pg.619]    [Pg.283]    [Pg.1038]    [Pg.291]    [Pg.165]    [Pg.466]    [Pg.36]    [Pg.358]    [Pg.99]    [Pg.59]    [Pg.160]    [Pg.399]    [Pg.96]    [Pg.567]    [Pg.183]    [Pg.227]    [Pg.85]    [Pg.429]    [Pg.456]    [Pg.695]    [Pg.144]   


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Substrate preparation

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