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Siloxanes resins

The single largest use of silicone resins is as water repellents for stone and masomy. The resins also find important applications in paints and finishes, especially for high-temperature use, and increasingly as additives to conventional paints. Among the numerous speciality uses which have also been developed, siloxane resins are used to coat pharmaceutical pills and as encapsulants for electronic components. [Pg.3992]

Use Corrosion inhibitor in organic systems, additive to lubricating oils, flame-retardant, siloxane resin additive. [Pg.1146]

Glass clad HP (GCHP) a heparin modified siloxane resin giving hydrophilic properties to the surface. [Pg.384]

Uses Intermediate in prep, of siloxane resins and fluids wetting agent, leveling agent, antifog, antistat, surf, lubricant for coatings Properties Colorless to straw clear to si. hazy liq. sp.gr. 1.03 vise. 200 cSt flash pt. (PMCC) > 200 F 100% act. [Pg.390]

Chem. Desaip. Methylphenyl siloxane resin in xylene Uses Silicone for cold blending with org. resins to improve moisture resist., heat stability, and weatherability of paints based on polyester, melamine, acrylic, or phenolic resins food-contact coatings Features Med. hard, high solids Regulatory FDA 21 CFR 175.300... [Pg.751]

Chem. Descrip. Polymethylphenyl siloxane resin (50%) emulsion in water/ Solvesso 100 (12.5%)... [Pg.844]

Ecco Rez UVC-3001 resin, high-solids coatings Methyl phenyl siloxane resin, high-temp. powder coatings Methyl siloxane resin, hot-melt coatings Permalyn NC-11... [Pg.1589]

Uses Corrosion inhibitor in organic systems lubricating oil additive flame-retardant siloxane resin additive Sodium humate... [Pg.4031]

Methyldichlorosilane siloxane resin agent Sodium hexylene glycol monoborate silver alloy ingredient Cadmium oxide silver determination 1,10-Phenanthroline monohydrate silver extraction Potassium cyanide silver extraction agent Sodium cyanide silver nitrate mfg. [Pg.5646]

Keywords Polymers / Hybrid Organic-Inorganic Polymers / Polymer Network / IPN / Hybrid Polymer Technologies / Contact Lenses / Coatings / Surfactants / Wetting Agents / Silicones / Silicone Polyimides / Siloxane Resins... [Pg.592]

Fig. 6. The Diene-Siloxane resins have low dielectric constants allowing labrication of multilayer printed circuit boards for use in computer applications (courtesy R. LiebfKed, Hercules). Fig. 6. The Diene-Siloxane resins have low dielectric constants allowing labrication of multilayer printed circuit boards for use in computer applications (courtesy R. LiebfKed, Hercules).
All of the above seven organically modified siloxane resins were subject to pyrolysis at 450 °C for 2 h. Porosity measurements were performed on the pyrolyzed resins using the nitrogen sorption method (Table 1). The surface areas, calculated using the BET equation [6], were considered to give the total internal and external surface area of the material. The micropore surface areas and micropore volume were calculated using the de Boer r-method. [Pg.697]

The BET surface areas of the first three pyrolyzed resins were lower than 20 m /g due to the type of the organic group Rl, R2 and R3. The R4-modified resin gave a slightly higher level of porosity after pyrolysis, whereas R5-, R6- and R7-modified siloxane resins led, after pyrolysis, to a porosity higher than 400m /g and up to 900 m /g, which rendered them attractive candidates as ILD materials and they were selected for further porosity studies. [Pg.697]

The pore size distribution, BJH plots [7], of the last four pyrolyzed porous materials obtained from organically modified siloxane resins (R4 to R7) revealed that mainly microporous materials were generated through pyrolysis and that most of the pore diameters were below 50 A. HK pore size distributions confirmed that the majority of the pores in the R6- and R7-modified siloxane... [Pg.697]

The paper by Copley presents a study of two types of silicone pressure-sensitive adhesives, of known composition, by dynamic mechanical and thermal analysis. The materials were prepared from a siloxane resin and two silicone gums poly(dimethylsiloxane) and poly(dimethyl-co-phenylsiloxane). [Pg.173]

The commercial value of PC-siloxane resins is based primarily on the enhanced impact strength these copolymers exhibit compared to PC homopolymers under severe (i.e., embrittling) end-use conditions. Frequently, the superiority of the PC-siloxane resins is demonstrated by impact testing at low temperatures. Figure 14.11 displays Izod impact data measured at room temperature and -30°C that clearly demonstrate this performance advantage. [Pg.351]

Polymers may also be embrittled by part design variables. In Figs. 14.12 and 14.13, the embrittling effects of sharper notch radius and of increased part thickness on various materials are shown. Again, the PC-siloxane resins are shown to be superior to PC homopolymers in this regard. [Pg.351]

H. A. Clark, Pressure Sensitive Adhesive Made from Siloxane Resins, U.S. Pat. 3,527,842 (1970). A blend of three PDMS linear resins. Polymer I has —OH groups, polymer II has —CH=CH2, polymer III has —H. Si—H crosslinks Si—CH=CH2. Further heating crosslinks polymer I. [Pg.245]

Ultra Low-k Dielectric Filins with Ultra Small Pores Using Poragens Chemically Bonded to Siloxane Resin... [Pg.173]

Most of the known porous low-k technologies utilized the blending rq>proach that was pioneered by IBM researchers [i, 2], In this roach, nonvolatile organic molecules were blended into a curable siloxane resin to serve as molecular tenqrlates , or porr ens. When the blend was cured thermally, the resin matrix became rigid and die poragen molecules were decomposed to leave pores behind. In this way, the dielectric constants of the matrix materials were significandy reduced. [Pg.174]


See other pages where Siloxanes resins is mentioned: [Pg.2217]    [Pg.2231]    [Pg.415]    [Pg.311]    [Pg.851]    [Pg.909]    [Pg.405]    [Pg.414]    [Pg.97]    [Pg.77]    [Pg.851]    [Pg.744]    [Pg.351]    [Pg.603]    [Pg.696]    [Pg.697]    [Pg.697]    [Pg.699]    [Pg.101]    [Pg.362]    [Pg.173]    [Pg.177]    [Pg.177]    [Pg.185]    [Pg.95]    [Pg.2217]    [Pg.2231]   
See also in sourсe #XX -- [ Pg.592 ]




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