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Properties silicon nitride

Creep Resistsince. Studies on creep resistance of particulate reinforced composites seem to indicate that such composites are less creep resistant than are monolithic matrices. Silicon nitride reinforced with 40 vol % TiN has been found to have a higher creep rate and a reduced creep strength compared to that of unreinforced silicon nitride. Further reduction in properties have been observed with an increase in the volume fraction of particles and a decrease in the particle size (20). Similar results have been found for SiC particulate reinforced silicon nitride (64). Poor creep behavior has been attributed to the presence of glassy phases in the composite, and removal of these from the microstmcture may improve the high temperature mechanical properties (64). [Pg.58]

Non-oxide ceramics such as silicon carbide (SiC), silicon nitride (SijN ), and boron nitride (BN) offer a wide variety of unique physical properties such as high hardness and high structural stability under environmental extremes, as well as varied electronic and optical properties. These advantageous properties provide the driving force for intense research efforts directed toward developing new practical applications for these materials. These efforts occur despite the considerable expense often associated with their initial preparation and subsequent transformation into finished products. [Pg.124]

Silicon carbide, SiC [1] and silicon nitride, Si3N4 [2], have been known for some time. Their properties, especially high thermal and chemical stability, hardness, high strength, and a variety of other properties have led to useful applications for both of these materials. [Pg.143]

A. Y. Liu and M. L. Cohen, Structural Properties and Electronic Structure of Low-Compressibility Materials P-silicon Nitride and Hypothetical Carbon Nitride (P-C3N4), Phys. Rev. B, 41(15), 10727-34 (1990). [Pg.10]

In the sintering of such materials as silicon nitride, a silica-rich liquid phase is formed which remains in the sintered body as an intra-granular glass, but this phase, while leading to consolidation, can also lead to a deterioration in the high-temperature mechanical properties. [Pg.301]

The minimum detectable signal for cantilever bending depends on the geometry and the material properties of the cantilever. For a silicon nitride cantilever of 200 pm long and 0.5 pm thick, with E = 8.5 x 1010 N/m2 and v = 0.27, a surface stress of 0.2 mJ/m2 will result in a deflection of 1 nm at the end. Because a cantilever s deflection strongly depends on geometry, the surface stress change, which is directly related to molecular adsorption on the cantilever surface, is a more convenient quantity of the reactions for comparison of various measurements. [Pg.248]

Experiments like those described above have been performed to evaluate sodium ion barrier properties of Hitachi PIQ and DuPont PI 2540 polyimide films. Also included in the comparison were silicon nitride coatings plasma deposited in both tensile and compressive stress modes. The structure of the samples is illustrated in Figure 9. N-type, (111) oriented silicon substrates were cleaned and oxidized in dry oxygen ambient at 1100°C to form a 1060 A Si02 film. Wafers intended for polyimide characterization were coated with an organic silane film (gamma glycidal amino propyl trimethoxysilane) to promote adhesion of the polyimide to the oxide surface. The polyimide resins were spun onto the wafers at speeds to produce final... [Pg.161]

Most structural PMCs consist of a relatively soft matrix, such as a thermosetting plastic of polyester, phenolic, or epoxy, sometimes referred to as resin-matrix composites. Some typical polymers used as matrices in PMCs are listed in Table 1.28. The list of metals used in MMCs is much shorter. Aluminum, magnesium, titanium, and iron- and nickel-based alloys are the most common (see Table 1.29). These metals are typically utilized due to their combination of low density and good mechanical properties. Matrix materials for CMCs generally fall into fonr categories glass ceramics like lithium aluminosilicate oxide ceramics like aluminnm oxide (alnmina) and mullite nitride ceramics such as silicon nitride and carbide ceramics such as silicon carbide. [Pg.103]

Table 3 summarizes the properties of the so-called nonmetallic hard materials, including diamond and the diamondlike carbides B4C, SiC, and Be2C. Also included in this category are comndum, A1203, cubic boron nitride, BN, aluminum nitride, AIN, silicon nitride, S N and silicon boride, SiB6 (12). [Pg.440]

Siaions consist of three-dimensional arrays of (Si—Al) (O.N)4 tetrahe-dra. These oxynitrides are traditionally fabricated with silicon nitride An example is beta-sialon, where the O and Si are partially replaced by N and Al, respectively. Advanced sialons are now being researched to enhance fracture toughness and iinpioved cieep properties,... [Pg.70]

The carbides and nitrides are well known for their hardness and strength, and this section will briefly compare a number of these properties with those of the pure metals. Concentration will be placed here on the first row compounds, since these constitute a complete series, and Mo and W, since these are the most commonly studied metals. As will be shown, the physical and mechanical properties of carbides and nitrides resemble those of ceramics not those of metals. Comparisons will be made with boron carbide (B4C), silicon carbide (SiC), aluminium nitride (AIN), silicon nitride (Si3N4), aluminium oxide (A1203), and diamond, as representative ceramic materials. [Pg.13]

NISTCERAM National Institute of Standards and Techology Gas Research Institute, Ceramics Division mechanical, physical, electrical, thermal, corrosive, and oxidation properties for alumina nitride, beryllia, boron nitride, silicon carbide, silicon nitride, and zirconia... [Pg.119]

Plasma-deposited silicon nitride contains large amounts of hydrogen, typically in the range of 20—25 atomic % H, and has polymer-like properties. The electrical resistivity of the film depends on the deposition temperature, the film stoichiometry, and the amounts of hydrogen and oxygen in the film. [Pg.348]


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See also in sourсe #XX -- [ Pg.892 , Pg.936 ]

See also in sourсe #XX -- [ Pg.565 ]




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