Semiconductor manufacturing

The growth of solid films onto solid substrates allows for the production of artificial stmctures that can be used for many purposes. For example, film growth is used to create pn junctions and metal-semiconductor contacts during semiconductor manufacture, and to produce catalytic surfaces with properties that are not found in any single material. Lubrication can be applied to solid surfaces by the appropriate growth of a solid lubricating film. Film growth is also... 

The advantages of miniaturization are now being exploited in areas beyond microelectronics. Adaptation of materials and processes originally devised for semiconductor manufacture has allowed fabrication of sensors (for example, pressure meters and accelerometers used in the automotive industry) (6,7), complex optical (8) and micromechanical (6,7,9) assembHes, and devices for medical diagnostics (6,7,10) using Hthographic resists. 

DNQ—novolac resist chemistry has proved to have remarkable dexibiUty and extendibiUty. First introduced for printing appHcations, DNQ—novolac resists have been available since the eady 1960s in formulations intended for electronics appHcations. At present, most semiconductor manufacturing processes employ this resist chemistry. Careful contemporary research and engineering support the continuing refinement of this family of materials. 

Since the original proof of concept, and a later demonstration of its practical use in semiconductor manufacturing (40), appHcations and extensions of this concept have proliferated. In the following sections these systems are described in greater detail with emphasis on the resist formulation at a components level (41). 

Selenium is an essential element and is beneficial at low concentrations, serving as an antioxidant. Lack of selenium affects thyroid function, and selenium deficiencies have been linked to Keshan Disease (34). Selenium at high levels, however, is toxic. Hydrogen selenide (which is used in semiconductor manufacturing) is extremely toxic, affecting the mucous membranes and respiratory system. However, the toxicity of most organ oselenium compounds used as donor compounds for organic semiconductors is not weU studied. 

Silicate esters are used ia the production of coating and refractories and in some semiconductor manufacturing operations. A broad range of purity grades of silicon tetrachloride are available to meet the requirements of these different appHcations. 

Process requirements (e.g., in pharmaceutical and semiconductor manufacturing, painting processes, plastic injection molding, and breweries)... 

R. P. Donovan. Particle Control for Semiconductor Manufacturing. New York M. Dekker, 1990. 

Process safety management has been applied primarily in the chemical process industries. However, the concepts of PSM, and the approaches used for implementing PSM, can be applied equally well to any manufacturing process that uses chemical products. Manufacturing industries as diverse as semiconductor manufacturing 2md food processing can, and do, apply PSM to improve safety and operations. 

Paranjpe, A., and Islamraja, M., CVD TiN Process Modeling for ContactA ia Barriers, Proc. of Symp. on Process Control of Semiconductor Manufacturing, Electrochem. Soc. (May 1995)... 

Ronald A. Powell and Stephen Rossnagel, PVD for Microelectronics Sputter Deposition Applied to Semiconductor Manufacturing, Volume 26, 1998. 

TXRF is frequently used for contamination control and ultrasensitive chemical analysis, in particular in relation to materials used in semiconductor manufacturing [278,279], and metallic impurities on resin surfaces, as in PFA sheets [279,280], TXRF has been used by Simmross et al. [281] for the quantitative determination of cadmium in the four IRMM polyethylene reference materials (VDA-001 to 004). Microsamples (20-100 ig) from each reference material were transferred by hot pressing at 130 °C as 3 xm thin films straight on to quartz glass discs commonly used for TXRF analysis. The results obtained were quite satisfactory (Table 8.50). Other reports of the forensic application to plastic materials by TXRF have appeared [282], including a study of PE films by elemental analysis [283],... 

K. Ohtani, K. Ihara and T. Ohmi, Proceedings Electrochemical Society (Contamination, Control and Defect Reduction in Semiconductor Manufacturing) 92 (2), 361-74 (1992). 

In the field of microelectronics, there is continuing research in developing new materials to be used in semiconductor fabrication. They must be formed as thin films in a controlled, reproducible and uniform manner to be useful in semiconductor manufacturing applications. Depth profiling by AES is used to assess the properties of such films. The samples are sputtered with an argon ion beam and analysis performed using standard sensitivity factors, and it is possible to demonstrate that such films are uniform throughout a depth of, say, 250 nm. 

Froot, H.A. The Use of Microfluorescence Analysis for Process Control in the Semiconductor Manufacturing Industry, IEEE Trans. Reliab.. 1979, 17. 190-192. 

There are at least a dozen semiconductor manufacturers making the popular 384x series controllers. All of them behave slightly differently. The same applies to any other semiconductor device made by several vendors. Be cautious of so-called equivalents. So if your company s smart-alecky purchase officer has just cooked up a new deal to procure your 1N5408 diodes at half price (from some hitherto unknown manufacturer on the Mainland, for example), replace it and confirm that it is not causing the problem. 

Arsine toxicity data from acute and short-term inhalation exposures. Pp. 85-89 in Hazard Assessment and Control Technology in Semiconductor Manufacturing. American Conference of Governmental Industrial Hygienists. Chelsea, MI Lewis. 

Mallik S, Harker PT (2004) Coordinating supply chains with competition Capacity allocation in semiconductor manufacturing. European Journal of Operational Research 159 (2) 330-347... 

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