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Resistive transition temperature

Figure 4. The relation between resistive transition temperature and composition x in YBa2 xaaNi)xCu3 x07 6. The... Figure 4. The relation between resistive transition temperature and composition x in YBa2 xaaNi)xCu3 x07 6. The...
Of course, condensed phases also exliibit interesting physical properties such as electronic, magnetic, and mechanical phenomena that are not observed in the gas or liquid phase. Conductivity issues are generally not studied in isolated molecular species, but are actively examined in solids. Recent work in solids has focused on dramatic conductivity changes in superconducting solids. Superconducting solids have resistivities that are identically zero below some transition temperature [1, 9, 10]. These systems caimot be characterized by interactions over a few atomic species. Rather, the phenomenon involves a collective mode characterized by a phase representative of the entire solid. [Pg.87]

Elastomeric Modified Adhesives. The major characteristic of the resins discussed above is that after cure, or after polymerization, they are extremely brittie. Thus, the utility of unmodified common resins as stmctural adhesives would be very limited. Eor highly cross-linked resin systems to be usehil stmctural adhesives, they have to be modified to ensure fracture resistance. Modification can be effected by the addition of an elastomer which is soluble within the cross-linked resin. Modification of a cross-linked resin in this fashion generally decreases the glass-transition temperature but increases the resin dexibiUty, and thus increases the fracture resistance of the cured adhesive. Recendy, stmctural adhesives have been modified by elastomers which are soluble within the uncured stmctural adhesive, but then phase separate during the cure to form a two-phase system. The matrix properties are mosdy retained the glass-transition temperature is only moderately affected by the presence of the elastomer, yet the fracture resistance is substantially improved. [Pg.233]

Qiana, introduced by Du Pont in 1968 but later withdrawn from the market, was made from bis(4-aminocyclohexyl)methane and dodecanedioic acid. This diamine exists in several cis—trans and trans—trans isomeric forms that influence fiber properties such as shrinkage. The product offered silk-like hand and luster, dimensional stabiUty, and wrinkle resistance similar to polyester. The yam melted at 280°C, had a high wet glass-transition temperature of - 85° C and a density of 1.03 g/cm, the last was lower than that of nylon-6 and nylon-6,6. Qiana requited a carrier for effective dyeing (see Dye carriers). [Pg.260]

Polycarbonates are an unusual and extremely useful class of polymers. The vast majority of polycarbonates are based on bisphenol A [80-05-7] (BPA) and sold under the trade names Lexan (GE), Makrolon (Bayer), CaUbre (Dow), and Panlite (Idemitsu). BPA polycarbonates [25037-45-0] having glass-transition temperatures in the range of 145—155°C, are widely regarded for optical clarity and exceptional impact resistance and ductiUty at room temperature and below. Other properties, such as modulus, dielectric strength, or tensile strength are comparable to other amorphous thermoplastics at similar temperatures below their respective glass-transition temperatures, T. Whereas below their Ts most amorphous polymers are stiff and britde, polycarbonates retain their ductiUty. [Pg.278]

Polycarbonate—polyester blends were introduced in 1980, and have steadily increased sales to a volume of about 70,000 t. This blend, which is used on exterior parts for the automotive industry, accounting for 85% of the volume, combines the toughness and impact strength of polycarbonate with the crystallinity and inherent solvent resistance of PBT, PET, and other polyesters. Although not quite miscible, polycarbonate and PBT form a fine-grained blend, which upon analysis shows the glass-transition temperature of the polycarbonate and the melting point of the polyester. [Pg.290]

Semiconductor devices ate affected by three kinds of noise. Thermal or Johnson noise is a consequence of the equihbtium between a resistance and its surrounding radiation field. It results in a mean-square noise voltage which is proportional to resistance and temperature. Shot noise, which is the principal noise component in most semiconductor devices, is caused by the random passage of individual electrons through a semiconductor junction. Thermal and shot noise ate both called white noise since their noise power is frequency-independent at low and intermediate frequencies. This is unlike flicker or ///noise which is most troublesome at lower frequencies because its noise power is approximately proportional to /// In MOSFETs there is a strong correlation between ///noise and the charging and discharging of surface states or traps. Nevertheless, the universal nature of ///noise in various materials and at phase transitions is not well understood. [Pg.346]

Titanium alloyed with niobium exhibits superconductivity, and a lack of electrical resistance below 10 K. Composition ranges from 25 to 50 wt % Ti. These alloys are P-phase alloys having superconducting transitional temperatures at ca 10 K. Thek use is of interest for power generation, propulsion devices, fusion research, and electronic devices (52). [Pg.108]

Two resin systems based on this chemical concept are commercially available from Shell Chemical Company/Technochemie under the COMPIMIDE trademark COMPIMIDE 183 (34) [98723-11-2], for use in printed circuit boards, and COMPIMIDE 796 [106856-59-1], as a resin for low pressure autoclave mol ding (35). Typical properties of COMPIMIDE 183 glass fabric—PCB laminates are provided in Table 8. COMPIMIDE 183 offers a combination of advantageous properties, such as a high glass transition temperature, low expansion coefficient, and flame resistance without bromine compound additives. [Pg.26]

T and are the glass-transition temperatures in K of the homopolymers and are the weight fractions of the comonomers (49). Because the glass-transition temperature is directly related to many other material properties, changes in T by copolymerization cause changes in other properties too. Polymer properties that depend on the glass-transition temperature include physical state, rate of thermal expansion, thermal properties, torsional modulus, refractive index, dissipation factor, brittle impact resistance, flow and heat distortion properties, and minimum film-forming temperature of polymer latex... [Pg.183]


See other pages where Resistive transition temperature is mentioned: [Pg.171]    [Pg.509]    [Pg.177]    [Pg.508]    [Pg.246]    [Pg.171]    [Pg.509]    [Pg.177]    [Pg.508]    [Pg.246]    [Pg.455]    [Pg.130]    [Pg.207]    [Pg.240]    [Pg.439]    [Pg.233]    [Pg.233]    [Pg.285]    [Pg.539]    [Pg.67]    [Pg.131]    [Pg.26]    [Pg.56]    [Pg.532]    [Pg.195]    [Pg.279]    [Pg.280]    [Pg.286]    [Pg.321]    [Pg.403]    [Pg.460]    [Pg.463]    [Pg.93]    [Pg.463]    [Pg.470]    [Pg.351]    [Pg.346]    [Pg.121]    [Pg.317]    [Pg.22]    [Pg.103]    [Pg.117]    [Pg.261]    [Pg.474]   
See also in sourсe #XX -- [ Pg.176 , Pg.178 ]




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TEMPERATURE RESISTANCE

Temperature resistivity

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