Prevention defining

Risk can be cut down through pollution prevention defined as the use of processes, practices, materials, or products that avoid or reduce pollution at the source when this is not possible, pollution control can be achieved through an environmentally safe treatment. Pollution prevention may include recycling, process changes, environmentally safe control mechanisms, efficient use of resources, and materials substitution. 

Tank overfill prevention Defining tank capacity... 

Copied Reoommendations 3, 4 and 5 - Tank overfill prevention Defining tank oapaoity... 

Priority must be given to the prevention defined by legal enactments, snch as Directive No. 42/2006/EC, on machinery. A machine in compliance with the directive must be designed and constructed so that risks caused by airborne noise emissions are reduced to the lowest levels possible with respect to scientific knowledge and technology as well as availability of means for noise rednction, especially at the source of the noise. The noise emission levels may be assessed nsing comparative data on noise emissions for similar machine eqnipment. 

Secondary prevention defined as subjects with documented cancer including nonmelanoma skin cancer (although some of the primary prevention trials did not exclude those with nonmelanoma skin cancer at baseline). 

The Food, Dmg and Cosmetics Act defines a cosmetic as a substance intended to be mbbed, poured, sprinkled, or sprayed on, introduced into, or otherwise appHed to the human body or any part thereof for cleansing, beautifying, promoting attractiveness, or altering the appearance. A dmg is defined as an article intended for use in the diagnosis, cure, mitigation, treatment, or prevention of disease in humans or other animals, and articles intended to affect the stmcture or any function of the body of humans or other animals. 

Dielectric Film Deposition. Dielectric films are found in all VLSI circuits to provide insulation between conducting layers, as diffusion and ion implantation (qv) masks, for diffusion from doped oxides, to cap doped films to prevent outdiffusion, and for passivating devices as a measure of protection against external contamination, moisture, and scratches. Properties that define the nature and function of dielectric films are the dielectric constant, the process temperature, and specific fabrication characteristics such as step coverage, gap-filling capabihties, density stress, contamination, thickness uniformity, deposition rate, and moisture resistance (2). Several processes are used to deposit dielectric films including atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), or plasma-enhanced CVD (PECVD) (see Plasma technology). 

Restraints. A restraint limits thermal reactions at equipment and line stresses or expansion movement at specifically desired locations. It may be defined as a device preventing, resisting, or limiting the free thermal movement of a piping system. Because the appHcation of a restraint reduces the inherent flexibiHty of the piping, its effect on the system is estabHshed through calculation. 

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