Porous copper substrate

Bagheri et al. [22] co-electrodeposited TMOS and MATMS with PEG on gold fibers modified with MPTMS. The SEM image shows that the sol-gel film was deposited and adhered well onto the gold fibers, due to the MPTMS pretreatment (Figure 12.31a and b). The films were demonstrated for the extraction of polycyclic aromatic hydrocarbons (PAHs), such as naphthalene, acenaphthylene, acenaphthene, and fiuorene, from their aqueous solutions. The electrodeposition potential affected the thickness of the functionalized sol-gel films on the fiber, hence influencing the efficiency of extraction, as shown in figure 12.31c. Azar et al. [23] electrodeposited MATMS onto a porous copper wire modified with MPTMS. The porous copper substrate was prepared by electrodeposition of... 

A device based on a porous silica substrate used as a Fabry-Perot interferometer has been reported as a sensor for organophosphorus nerve agents. The porous silica is coated with a surfactant and a copper hydrolysis catalyst. The mode of operation... 

Fig. 5. Calibration measurement of solid hydrogen film layer thickness via energy loss of a particles [27,28]. Americium a source is embedded on the surface of the gold-plated copper substrate, onto which hydrogen thin film is deposited by releasing the gas through porous sintered metal (diffuser). Silicon detector, mounted on the vertically movable diffuser, measured the a particle energy loss in the film, which is converted the thickness using the stopping power...

A tri-dimensional electrode reactor geometry was studied by He et al. (2004a, b) to overcome the problem of low conductivity media (>1 S m-1). The reduction of model carbon tetrachloride was performed on a porous copper foam with good conversion rates and almost total dehalogenation of the substrate. 

Many experimental results have been reported (Patankar 2004 Ran et al. 2008 Shirtcliffe et al. 2005) on the transition of the Wenzel state to the Cassie state. For example, Shirtcliffe et al. (2005) observed the transition of water from the Wenzel state to the Cassie state on patterned copper surfaces with different roughness. Similarly, Ran et al. (2008) studied the surface wettability of nano-porous alumina substrates and were able to transform from the Wenzel state to the Cassie state by systematically changing the hole diameter and hole depth. 

The second category was concerned with adhesion to porous or microfibrous surfaces on metals. Aluminium may be anodised to form an oxide surface comprising pores of diameter of tens of nanometers. Electroforming and chemical oxidation can be used to produce microfibrous or needle-like coatings on metals, including copper, steel and titanium. The substrate topography was demonstrated to play an vital part in adhesion to these surfaces [45-48]. 

A porous or cracked mill scale can expose the steel substrate underneath the rinse solution, Table 7.18. The mill scale will then act as a cathode, and the exposed area, which will be an anode, will undergo galvanic corrosion. Due to the large-area cathode compared with the small-area anode (exposed through the cracks in the mill scale), the corrosion rates will be quite high. The presence of copper within the mill scale can increase the cathodic reduction rate, thus accelerating further the corrosion of steel in the exposed regions. 

Performance improvement in 1102 is achieved by doping the titania with platinum or vanadium oxide and copper. In order to improve the adsorption characteristics of Ti02, attempts have been made to support fine Ti02 on the porous adsorbent materials such as silica, alumina, activated carbon, clay, and zeolites. Ti02-supported adsorbent provides higher specific surface area and introduces more effective adsorption sites than bare Ti02. Decomposition rates of the substrates are found to increase due to one or... 

Following the work of Bloch and Vofsi, two other methods of producing immobilized liquid films were introduced. Both are still under development. In the first approach, the liquid carrier phase is held by capillarity within the pores of a microporous substrate, as shown in Figure 9.4. This approach was first used by Miyauchi14 and further developed by Baker et al15-17 and by Largman and Sifniades.18 The principal objective of this early work was the recovery of copper and other metals from hydrometallurgical solutions. Despite considerable effort on the laboratory scale, the first pilot plant was not installed until 1980.19-20 The principal problem is instability of the liquid carrier phase in the micro-porous membrane support. 

Complex substrate modifications involving intermediate layers and palladium alloy deposition methods are often required for superior membrane performance. Modification of a membrane support surface before palladium deposition by sintering on smaller particles can create a smoother surface with smaller pores, facilitating the deposition of a defect-free palladium layer. Nickel microparticles have been sintered together to form a porous support that was sputter-coated with palladium and then copper [118]. Thermal treatment at 700 °C for 1 h promoted reflow to create a durable, pinhole-free membrane with a Pd-Cu-Ni alloy film. In another case, starting with commercially available PSS with a 0.5 pm particle filtration cut-ofF, submicron nickel particles were dispersed on the surface, vacnium sintered for 5 h at 800 °C, and then sputtered with UN [159]. The nickel particles created a smoother surface with smaller pores, so a thinner palladium alloy layer... 

Chromium is cathodic to steel however, economic electrodeposited coatings of chromium are too thin and porous to give protection on their own and are used in conjunction with thick (25 pm) deposits of copper or nickel. Chromized coatings, on the other hand, are relatively thick and can confer protection by their barrier action, although corrosion of the steel substrate will be increased at any discontinuities in the coating. 

Porous silicon layers with a porosity of 60% on n-type (lll)Si substrates were prepared by anodic etching under white illumination. Copper/porous-silicon/Si and Cu/Si structures were fabricated by evaporation of thin metal films onto the porous silicon or Si surface, respectively. The diffusion annealing of structures was carried out in air at 100 to 250C. Examination of the Cu concentration distribution in porous silicon layers and monocrystalline Si substrates was performed by successive removal of thin layers from samples and measurement of the energy dispersive X-ray fluorescence intensity of CuKq i peaks. The effective diffusion coefficients were... 

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