Polyvinyl formal-phenolics

Table 3.5. Effect of pretreatment on lap shear strength of steel polyvinyl-formal-phenolic adhesive joints... [Pg.99]

Cure conditions for the polyvinyl formal-phenolic film consist of 177°C for 5 minutes or 150°C for 30 minutes at 0.35-3.5 MPa bonding pressure. [Pg.126]

These are used in bonding metal or reinforced plastic facings to paper (resin impregnated) honeycomb structures, cork and rubber compositions, cyclized and unvulcanized rubbers, steel to vulcanized rubber, and electrical applications. They are also used as primer for metals to be bonded to wood with phenolics. Polyvinyl butyral-phenolics lack the shear strength and toughness of the polyvinyl formal-phenolic type. ... [Pg.127]

Suggested adhesives include modified acrylics, epoxies, polyesters, resorcinol-formaldehyde, furane, phenol-formaldehyde, polyvinyl formal-phenolic, polyvinyl butyral, nitrile rubber-phenolic, polyisobutylene rubber, polyurethane rubber, reclaimed rubber, melamine-formaldehyde, epoxy-phenolic, and cyanoacrylates. For maximum adhesion primers should be used. Nitrile-phenoUcs give excellent bonds if cured under pressure at temperatures of 149 C. Lower-strength bonds are obtained with most rubber-based adhesives. [Pg.150]

Phenolic epoxy, polyester-isocyanate, polyvinyl acetate, vinyl chloride-acetate copolymer, polyvinyl formal-phenolic, nitrile rubber, nitrile rubber-phenolic, reclaim rubber, neoprene rubber, polyurethane rubber, butyl rubber, melamine-formaldehyde, neoprene-phenolic, and polyvinyl formal-phenolic. [Pg.153]

TABLE 7.15 Effect of Pretreatment on the Shear Strength of Steel Joints Bonded with a Polyvinyl Formal Phenolic Adhesive (from Ref. 26)... [Pg.442]

Structural adhesives Polyvinyl formal-phenol formaldehyde Polyvinyl butyral-phenol formaldehyde Nitrile-phenolic Epoxy-polyamine Epoxy-anhydride Epoxy-nylon Epoxy-phenolic Epoxy-polyamide Epoxy-polyurethane... [Pg.176]

Peel resistance. The straight epoxies cured by either polyamines (amides) or anhydride are poor in peel. Polyvinyl formal-phenol formaldehyde (P/F) and butyral-P/F are moderate but the peel varies with the P/F content. As the P/F content increases, room temperature lap-shear and peel strength decrease but these properties improve at elevated temperatures. The epoxy-polyamides (epoxy-nylon) such as FM1000 (Cyanamid Corp.) give extremely good peel resistance under dry conditions. Hockney (1970) quotes 511N for an adhesive of this type with a strip 25 4 mm wide, peeled at 90°. The peeling... [Pg.186]

Curing of polyvinyl butyral-phenohc film requires a temperature of 150 °C at 0.10—0.20 MPa pressure. Polyvinyl formal-phenolic film, the most common form, retains adequate strength when exposed to weather, mold growth, salt spray, humidity, and... [Pg.175]